11th International Conference on Artificial Intelligence and Applications (AIAP 2024)

January 20 ~ 21, 2024, Zurich, Switzerland



Hybrid -- Registered authors can present their work online or face to face 

Scope & Topics 


11th International Conference on Artificial Intelligence and Applications (AIAP 2024) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of Artificial Intelligence and its applications. The Conference looks for significant contributions to all major fields of the Artificial Intelligence, Soft Computing in theoretical and practical aspects. The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet and share cutting-edge development in the field.

Authors are solicited to contribute to the Conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to.

Topics of interest include, but are not limited to, the following:


Paper Submission


Authors are invited to submit papers through the conference Submission System by Closed .

Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).


           courtesy

Invited Talk




Supported by




Proceedings

Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on AIRCC Digital Library 


Speakers 

Qideng Tang

National University of Defense Technology

China 

Cédric Maron

Hubert Curien Laboratory, Segula Technologies

France 

Cleber Viana

ngena

United States 

Saud Althabiti

University of Leeds

United Kingdom 

David Noever

US 

René Peinl

Hof University of Applied Sciences

Germany 

Foday Junior Conteh

Marymount University

USA