Projects
Research and Industry projects
As the Principal Investigator (PI), Dr. Yu has independently secured and delivered 6 research projects amounting to over $700,000 SGD (4 million HKD) in A*Star Singapore, while serving as the Co-PI in 3 major projects (over $800,000 SGD). His work created impactful application values, as evidenced by the persistent industry support from sponsors including WS Audiology (Siemens hearing-aid), Thales, Yan San Metals, several medium-sized enterprises, and government agencies.
Some non-confidential research and industry projects are listed here. We provide acoustic consultancy services. You are welcome to contact us and visit our lab.
Onging projects:
Principle-investigator, “Acoustic localization of wellbore leakage based on hydrophone array”, 1 Mar 2024 - 31 Aug 2025
Principle-investigator, “Development of acoustic sensing technology for detection of body sound signals”, IWEAR Seed Fund, 1 Mar 2023 to 28 Feb 2025.
Principle-investigator, “A new paradigm for designing reconfigurable lattice metamaterials for elastic wave manipulation and vibration control”, Postdoc Matching Fund, 15 May 2023 - 14 May 2025.
Co-Principle investigator, “A New Paradigm for Designing and Manufacturing of 4D Printed Reconfigurable Lattice Structures for Tunable Broadband Vibration Suppression”, NSFC/RGC Joint Research Scheme, 1 Jan 2024 to 31 Dec 2027.
Co-Principle investigator, “Artificial Intelligence (AI)-enabled Source Identification and Manipulation of Structural and Acoustic Waves in Complex and Highly Reverberant Environment”, Projects of RIAIoT, 1 Apr 2024 to 31 Mar 2027.
Co-Principle investigator, “Sonic Black Holes in a Perforated Boundary-modulated Retarding Structure”, General Research Fund, 1 Dec 2022 to 30 Nov 2025.
Completed projects:
PI, “Fast simulation of HRTF with anthropometric variations”, Sivantos Pte Ltd.
PI, “Origami-inspired acoustic device design and characterization”, Career Development Award (CDA grant), A*Star.
PI, “Design of lightweight acoustic absorption Panels based on aluminum micro-perforated materials”, Yan San Metals.
PI, “Acoustic modelling and design of lightweight honeycomb wall panel systems”, ICF International Pte Ltd.
PI, “Sound channel optimization modeling for hearing aids”, Sivantos Pte Ltd.
PI, “Further development of sound channel optimization App”, Sivantos Pte Ltd.
Co-PI, “Sonic black holes in a perforated boundary-modulated retarding structure”, GRF Hong Kong.
Co-PI, “Machine learning based ear picture analysis and HRTF prediction”, WS Audiology (Sivantos).
Co-PI, “Active and passive noise control in a business class cabin”, Thales group.
Co-PI, “Novel sound-absorbing metallic foams with heterogeneous structure via template replication processing”, Young Individual Research Grant (YIRG), A*Star.
Key member, “Design and fabrication of free-format lattice cores for sandwich structures”, SERC IAF-PP grant.
Key member, “Noise Mitigation Solutions For the Building Envelop with Green and Intelligent Sound Absorbing Materials”, L2NIC project.
HRTF and hearing perception
Head Related Transfer Function (HRTF) characterizes how our ear perceives sound from the space. It is affected by the size and shape of head, torso and ear pinna. HRTF enables ear to localize sound in the 3D space. It is important for audio, hearing-aid device design and AR/VR applications. HRTF personalization is time-consuming and facility demanding. Simulation models are developed to enable fast prediction of HRTF and other acoustic information for individuals.
Sandwich sound absorption/insulation panel
Traditional sound insulation panel based on porous mineral materials has many disadvantages. Seeking to overcome these restrictions, micro-slit aluminum panels and flexible honeycomb structures are combined to form efficient sound absorbers. Finite element modeling technique is used to evaluate the various properties of the absorber and to optimize the acoustic performance. The study could generate highly efficient, lightweight and maintenance-free noise barrier which can be implemented in various applications.
