Publications

29.     Raj A, Alvi SMAA, Islam K, Motalab M, Xu S. "An Atomistic Study of the Tensile Deformation of Carbon Nanotube-Polymethylmethacrylate Composites." Polymers, 2023; 15(13):2956. Click here

28.     Billah MM, Aad AR, Das S, Motalab M, Paul R. "Dependence of mechanical and thermal deformation behaviors on crystal size and direction of Cu3Sn intermetallic: A molecular dynamics study." Alexandria Engineering Journal, 2023; 66:79-96. Click here

27.     Rahman MH, Rahaman MDZ, Motalab M, Hossain AKMA. "First-principles prediction of outstanding mechanical and thermodynamic properties of YX2Si2 (X = Pd and Rh) superconductors." Materials Today Communications, 2022; 31:103785. Click here 

26.     Alvi SMAA, Faiyad A, Munshi MAM, Motalab M, Islam MM, Saha S. "Cyclic and tensile deformations of Gold-Silver core shell systems using newly parameterized MEAM potential." Mechanics of Materials, 2022; 169:104304. Click here

25.       Billah MM, Siddiquee RI, Motalab M, Paul R, Rabbi MS. "Effects of temperature and strain rate on tensile properties of (Ag,Cu)-Sn intermetallic compounds: A molecular dynamics study." Journal of Materials Research and Technology, 2022; 18:3044-3055. Click here

24.     Akter S, Motalab M, Helali M. "Analysis of the Correlation Between Crimp Parameters and its Effect on Yarn Strength and Hairiness." Fibres & Textiles in Eastern Europe, 2022; 30(2):55-60. Click here

23.     Rahman MH, Rahaman MDZ, Chowdhury EH, Motalab M, Hossain AKMA, Roknuzzaman M. "Understanding the role of rare-earth metal doping on the electronic structure and optical characteristics of ZnO." Molecular Systems Design & Engineering, 2022; 7(11):1516-1528. Click here

22.     Mitra S, Rahman MH, Motalab M, Rakib T, Bose P. "Tuning the mechanical properties of functionally graded nickel and aluminium alloy at the nanoscale." RSC Advances, 2021; 11(49):30705-30718. Click here

21.         Ahmed MT, Motalab M, Suhling JC. "Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint." Journal of Electronic Materials, 2021; 50(l):233-248. Click here

20.     Mojumder S, Thakur MSH, Islam M, Mahboob M, Motalab M. "Numerical investigation of mechanical properties of aluminum-copper alloys at nanoscale." Journal of Nanoparticle Research, 2021; 23(1):3. Click here

19.     Mojumder S, Mahboob M, Motalab M. "Atomistic and finite element study of nanoindentation in pure aluminum." Materials Today Communications, 2020; 23:100798. Click here

18.     Rahman MH, Mitra S, Motalab M, Bose P. "Investigation on the mechanical properties and fracture phenomenon of silicon doped graphene by molecular dynamics simulation." RSC Advances, 2020; 10(52):31318-31332. Click here

17.     Munshi MAM, Majumder S, Motalab M, Saha S. "Insights into the mechanical properties and fracture mechanism of Cadmium Telluride nanowire." Materials Research Express, 2019; 6(10):105083. Click here

16.       Mojumder S, Rakib T, Motalab M. "Atomistic study of hardening mechanism in Al-Cu nanostructure." Journal of Nanoparticle Research, 2019; 21(5):88. Click here

15.     Motalab, M., Dipto, N. D., Islam, M. A., Ahmed, I., “Modification of stress concentration and stress intensity factors of a mild steel plate”, Journal of Mechanical Engineering, IEB, Bangladesh, April 2019.

14.     Kallol, K. M., Motalab, M., Parvej, M. S., Konari, P. R., Barghouthi, H, Khandaker, M., “Differences of Curing Effects between a Human and Veterinary Bone Cement”, Materials, MDPI, Vol. 12(3), pp. 470, 2019. Click here

13.     Motalab, M., Paul, R., Saha, S., Majumdar, S., Ahmed, T., Suhling, J. C., "Atomistic Analysis on Thermo-mechanical Properties of Sn-Ag-Cu Based Solder Materials at Nanoscale with MEAM potential", Journal of Molecular Modeling, Springer, Vol. 25(3), pp.59, 2019. Click here

12.     Das, S., Mojumder, S., Rakib, T., Islam, M. M., Motalab, M., "Atomistic insights into mechanical and thermal properties of stanene with defects", Physica B: Condensed Matter, Elsevier, Vol. 15, pp.553:127-36, 2019. Click here

11.          Nahid, S. M., Nahian, S., Motalab, M., Rakib, T., Mojumder, S., Islam, M. M., "Tuning the mechanical properties of silicene nanosheet by auxiliary cracks: a molecular dynamics study", RSC Advances, Royal Society of Chemistry, Vol. 8(53), pp.30354-65, 2018. Click here

10.     Pial, T. H., Rakib, T., Mojumder, S., Motalab, M., Akanda, M. S., "Atomistic investigations on the mechanical properties and fracture mechanisms of indium phosphide nanowires", Physical Chemistry Chemical Physics, Royal Society of Chemistry, Vol. 20(13):8647-57, 2018. Click here

09.     Saha, S., Motalab, M., "Nature of creep deformation in nanocrystalline Tungsten", Computational Material Science, Elsevier, Vol. 149, pp. 360-372, 2018. Click here

08.      Paul, R., Tasnim, T., Saha, S., Motalab, M., "Atomistic analysis to characterize the impact of temperature and defects on the mechanical properties of germanene sheet', Materials Research Express, lOPscience, Vol. 5(1), pp.015062, 2018. Click here

07.     Rakib, T., Saha, S., Motalab, M., Mojumder, S., Islam, M. M., “Atomistic representation of anomalies in the failure behaviour of nanocrystalline silicone”, Scientific Reports, Nature, Vol. 7(1), pp. 14629, 2017. Click here

06.      Saha, S., Motalab, M., Mahbub, M., "Investigation on Mechanical Properties of Polycrystalline W Nanowire", Computational Material Science, Elsevier, Vol. 136, pp. 52-59, 2017. Click here

05.      Rakib, T., Mojumder, S., Das, S., Saha, S., and Motalab, M., "Graphene and its elemental analogue: A molecular dynamics view of fracture phenomenon", Physica B: Condensed Matter, Elsevier, Vol. 515, pp. 67-74, 2017. Click here

04.      Shiddartha, P., Motalab, M., Zubaer, M., A., Hossain, M., Z., "Strain rate and curing condition effects on the stress-strain behavior of epoxy adhesive materials", Journal of Adhesion Science and Technology, Taylor & Francis, Vol. 31(16), pp. 1782-1795, 2017. 

03.      Motalab, M., Shakil, A. S., Rahman, T., Suhling, J. C., “Variation of Thermal Cycling Life Prediction of PBGA Microprocessor Components with Substrate Properties”, Journal of Emerging Trends in Engineering and Applied Sciences (JETEAS), UK, Vol. 6(5), pp. 371-376, 2015. Click here

02.      Jaeger, R. C., Motalab, M., Hussain, S., Suhling, J.C., “Four wire bridge measurements of silicon Van der Pauw stress sensors”, Journal of Electronic Packaging, ASME, Vol. 136(4), Paper No. EP14-1027, 2014. Click here

01.       Roberts, J. C., Motalab, M., Hussain, S., Suhling, J. C., Jaeger, R. C., Lail, P., “Characterization of Die Stresses in CBGA Packages due to Component Assembly and Heat Sink Clamping,” Journal of Electronic Packaging, ASME, Vol. 134(3), Paper 031005, pp. 1-17, 2012. Click here

47.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

46.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

45.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

44.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

43.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

42.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

41.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

40.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

39.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

38.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

37.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

36.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

35.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

34.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

33.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

32.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

31.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

30.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

29.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

28.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

27.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

26.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

25.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

24.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

23.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

22.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

21.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

20.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

19.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

18.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

17.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

16.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

15.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

14.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

13.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

12.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

11.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

10.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

9.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

8.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

7.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

6.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

5.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.

4.     Chowdhury, S. C., Sarakar, M. A. R., Motalab, M. A., “Solar Thermal Applications in Bangladesh”, Proceedings of 3rd International Conference on Renewable Energy for Sustainable Development (ICRESD 2003), pp. 81-88, The Institution of Engineers, Dhaka, October 2-4, 2003.

3.     Fardin S, Moresalein MJ, Motalab M. “Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87691, p. V012T13A019). 1MECE.

2.     Islam T, Aziz MSA, Motalab M, Faiyad A. “Atomistic study on the cooling rate induced mechanical properties variations in additively manufactured Inconel-718.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, Salt Lake City, USA, February, 2024 (Vol. 87615, p. V004T04A031). IMECE.

1.     Motalab M, Jamil MF, Jony MSAM, Bose P, Suhling JC. “Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study” 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, August, 2021, (p. 1250-1256). IEEE.