Flow and temperature visualization setup

ETEC P4K

Build envelop: 90 x 56 x 200 mm

Resolution: down to 35 μm

For the post-processing of UV sensitive curing resins

Chamber: 18 x 18 x 14 in

Elegoo Saturn 2

Build envelop: 219 x 123 x 250 mm

Resolution: 28.5 μm

Print speed: 20 - 25 mm /hr

Measure thermal conductivity (0.005 - 1800 W/m-K), thermal diffusivity (0.01 - 1200 mm2/s), specific heat capacity (< 5MJ/m3K)

Bulk samples with a radius greater than 5 mm.

Intel Core i9-10980XE (18 cores)

Graphic card (Nvidia RTX A6000, 48GB)

Run 3D simulation software and machine learning codes: ANSYS, COMSOL

Elegoo Mercury Plus 2 in 1

Wash volume: 124 x 90 x 110 mm

5x, 10x, 20x, 50x, 100x Lenses

CCD camera: 1.4 MP / 15 FPS