Published in: 2016 IEEE Region 10 Symposium (TENSYMP)
Date of Conference: 9-11 May 2016
Date Added to IEEE Xplore: 25 July 2016
ISBN Information:
Electronic ISBN: 978-1-5090-0931-2
Print on Demand(PoD) ISBN: 978-1-5090-0932-9
INSPEC Accession Number: 16159645
DOI: 10.1109/TENCONSpring.2016.7519439
Publisher: IEEE
Conference Location: Bali, Indonesia
publication date Aug 19, 2016 publication description Wayamba university of Sri lanka
Published in: TENCON 2019 - 2019 IEEE Region 10 Conference (TENCON)
Date of Conference: 17-20 Oct. 2019
Date Added to IEEE Xplore: 12 December 2019
ISBN Information:
Electronic ISBN: 978-1-7281-1895-6
Print on Demand(PoD) ISBN: 978-1-7281-1896-3
DOI: 10.1109/TENCON.2019.8929616
Conference Location: Kochi, Kerala, India