3rd SUMMIT of IEEE EPS & NTC
STUDENT BRANCH CHAPTERS
15th October 2024
Sibiu, Romania
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Industrial Keynote Speakers
Ovidiu Marius CHICEA
Sr. SW Architect, Deputy Site Manager, NXP, Sibiu, Romania
Ovidiu CHICEA has been working in the Automotive Industry for almost 14 years, having multiple roles. With a Bachelor of Computer Science and a Master`s Degree in Embedded Systems from the Faculty of Engineering (ULBS), he has also been a University collaborator for 7 years, teaching Microarchitectures and Numerical Computers. He started his automotive journey in Powertrain, developing control units for automatic gearboxes, followed by engine control units in the context of Transmission projects, in Advanced Development developing prototypes from idea to concept products, and working in the ADAS (Advanced Driver Assistance Systems) department, where he used perception technologies such as Camera, Radar and Lidar to develop Algorithms that pave the way for Automated Driving. As a Senior SW Architect and Sibiu Deputy Site Manager at NXP Semiconductors Romania, he has been working on building the next generation of Radar SoCs that will power the vehicles of tomorrow.
Presentation: "Automotive Radar Technology Innovations for Next-Gen ADAS and Autonomous Driving"
Dorin ANTONOVICI
Development Manager, IFM Prover, Sibiu, Romania
Dorin ANTONOVICI received his bachelor’s degree in Electrical Engineering and Computer Science in 2012, from Stefan cel Mare University of Suceava. In 2010, he benefited from an Erasmus internship at KAHO Sint-Lieven University - Belgium, where he worked on a research project involving Digital Phase Shifters for Antenna Array. His career has been marked by a focus on hardware development for automotive and industry. His research interests include Signal Integrity analysis of High-Speed circuits and advanced EMC topics for Analog design. He is currently responsible for process sensors development group in IFM Prover company from Sibiu.
Presentation: "Industrial Sensors – Hardware Design Outlines”
Daniel LUCA
Senior District Client Engagement Manager, Microchip, Bucharest, Romania
Daniel LUCA obtained a degree after 4-year of study in management at the Transilvania University in Brasov, graduating in 1997. He was an entrepreneur at several startups with focus on IT infrastructure, security, and data protection as well as product development from market surveillance to product definition, design, and manufacturing. Since 2007, he is a sales representative for Microchip in Romania. Since 2012, he is responsible for Microchip sales in 5 countries from East and Central Europe. As attributions, he has in mind supporting multinational automotive and industrial clients as well as local operations which became important global players. In the past he supported embedded projects at universities in East European countries.
Presentation: "Academic Synergy: Cultivating Innovation through Education and Partnerships"
Keynote Speakers 2022
Kitty PEARSALL
President IEEE Electronics Packaging Society
Kitty PEARSALL received the BS degree in Metallurgical Engineering and her MS and PhD degrees in Mechanical Engineering and Materials from the University of Texas. Across her 41-year career at IBM, Kitty was appointed to increasingly strategic roles and received multiple awards for her work. Currently Kitty is President of Boss Precision Inc. and works as an independent consultant.
IBM Distinguished Engineer in Integrated Supply Chain, Retired
Emeritus Member of IBM Academy of Technology
PE for State of Texas since 1993
Twelve US patents; and 8 published disclosures
Numerous internal IBM publications as well as 24 external publications
UT Austin – Cockrell Engineering Distinguished Engineering Graduate Award (2007)
UT Mechanical Engineering Dept. Academy of Distinguished Alumni
IBM Women in Technology Fran E. Allan Mentoring Award (2008)
Active IEEE member for 31 years; EPS/CPMT member for 28 years
BOG member since 2006 serving in various roles
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Beth KESER
INTEL, Director of Packaging and Systems
BETH KESER, Ph.D. & IEEE Fellow, a recognized global leader in the semiconductor packaging industry with over 24 years of experience, received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 41 U.S. patents and patents pending and over 50 publications in the semiconductor industry. Based in San Diego, Beth leads Intel’s Packaging & Systems Technology department. Currently, Beth is the President of IMAPS North America.
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Klaus WOLTER
TU Dresden, Institute of Electronics Packaging
Prof. Klaus WOLTER’s research interests have embraced many aspects of microelectronics packaging, including substrate technologies, assembly technologies, photonic packaging, MEMS, joining technologies, reliability of electronic packages, and non-destructive test methods. He is well known as co-author of six textbooks, co-editor of three book series with a total of 39 books, author and co-author of more than 200 papers. He is a senior member of IEEE-EPS. Prof. Wolter was the Director of the Electronic Packaging Lab at TU Dresden from 2003 to 2014. From March 2015 to March 2017, he was a visiting professor at the 3D Systems Packaging Research Center of Georgia Tech Atlanta where he researched on system-integration for advanced automotive electronics. Currently he is a professor emeritus at TU Dresden.
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Michiel de MONCHY
Applications Manager
Die Attach and Preforms – Europe
Michiel de MONCHY is the European applications engineer for Powerelectronics within MacdermidAlpha Assembly Solutions (The Netherlands). He has been involved in powerelectronics for over 22 years and has been involved in sintering for over 10 years.
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