Catalyzed by the recent push for scientific and workforce development activities related to the U.S. CHIPS and Science Act and the need to spur the growth of domestic Semiconductor Manufacturing, University of Illinois at Chicago (UIC) is launching an open-source multi-project wafer (MPW) process offering. The initial UIC-MEM-S25 MPW emulates a one-layer silicon MEMS surface micromachining process. A CMOS MPW shuttle will be offered in the fall of 2025. This new MPW shuttle offering is managed and fabricated entirely by undergraduate students in the UIC Semiconductor and Microsystems Manufacturing (SEMMI) club. Access to the UIC – MEM-S25 MPW is offered to external partners.
RUN UIC-MEM-S25:
Design Submission Deadline 4/7/2025
Estimated Fab Completion 5/9/2025
Ship-out 5/15/2025
Competiton Date (optional) Summer 2025
RUN UIC-CMO-F25:
Design Submission Deadline TBD
Estimated Fab Completion TBD
Ship-out TBD
Competiton Date (optional) TBD