7th Sep - 14th Sep:

• We had a couple of meetings with Dr.Cotton to discuss the ideas we wanted to work on.
• our ideas included :

1- Power monitoring electric plug

2- An Interactive Glove

3- a Mammal Spotter

15 Sep - 28 Sep:

• During this week Dr.Cotton offered us to work on the RockSat-C project sponsored by the Delaware Space Consortium.
• We were asked to come up with any ideas to collect data and mount on the Capsule.

29 Sep - 19 Oct:

• Dr.Cotton submitted the I.F.Form waiting for approval.
• DR.Cotton asked us to prepare for the CoDR.
• I was researching how to learn and print PCBs.

20 Oct - 27 Oct :

• Finished a first draft for the CoDR
• Met with Dr.Richard Martin, he gave me a book to learn PCB design that used the Eagle software.

29 Oct - 02 Nov :

• Presneted our CoDR with Audrey our Space program coordinator.
• She gave us pointer for the PDR. said we needed more graphs and diagrams, and more electrical design shcematics. She also let us know that we need to choose some specifications regarding the ports we needed for our the devices we were going to put in the rocket.
• We are planning to meet with both Prof.Mirotznik and Dr.Zeng regarding our invlovment with their projects and its integration to the rocket.

02 Nov - 09 Nov :

• We had our meeting with Dr.Zeng and still waiting on Dr.Mirotznik.
• Dr.Zeng let us know what she needed for her transistor.
• She needs us to build a transitor tester for her HEMT transistor and see its effeciency when exposed to radiation.
• We , the team and Dr.Zeng, agreed to have a regular transistor mounted with the HEMT to have more clarity when processing and making the resulting graphs after the flight.
• We started working on the PDR.

Nov 10 - Nov 17:

• Presented the PDR.
• Audrey commented on the graphs and CAD designs we had on the PDR.

Nov 17 - Nov 25:

• Break

Nov 26 - 02 Dec

• We have been working on preparing the CDR presentation (12/07/2018).
• me and jon made some schematics for our power regulator, transistor tester and INSS design. We made the ones from last year and are trying to integrate the GPS system we're going to use to the INSS.

Dec 07:

• We finished the CDR.
• Audrey commented on the following:
  • We can assume we have either side of the canister and build our equipment’s accordingly.
  • In case we were assigned a side we did not anticipate we can invert the whole experiment upside down.

We will continue working during the winter break to accelerate our spring process. We are planning to do so through researching software’s we need and finalizing our PCBs.

This is how we are planning to proceed over the Spring semester.

Early-Feb: Finalize PCB schematics

Early-Feb: Start writing code for subsystems

Mid-Feb: Integrate components (GPS, HEMT)

Late-Feb: Subsystem Testing Review (STR)

Mid-March: Finish building subsystems

Mid-March: Vibration Test

Late-March: Integrated Subsystems Testing and Review (ISTR)

Mid-April: Begin integrating subsystems into launch canister

Feb 11 - Feb 22 :

• We reconvined after the winter semester.
• We Found out that our current Power Regulator circuit is not fit for our Project's requirments.
• We have a 3D printed canister that we can use as an exact size model of the real canister.
• I am currently in contact with Mr.James McCarcken from the nanofabrication department to do the wirebonding for the GanHEMT transistor we got from Dr.Zeng.
• After i met Dr.Zeng's Graduate Student Mr.Peng Cui he asked of the team to build the transistor tester using the following guidlines
  • introduce from (0V) - (10V) for the gate to source voltages
  • introudcue from (-4V) - (1V) for the drain to source voltages
• We are still deciding if we need one or two 9V batteries.
• 
  

Feb 25 - Feb26

• We contacted Mr Scott McCracken from the NanoFabrication Department to do the WireBonding for the GaN HEMT transistor.
• We are meeting Dr.Zeng on the 5th of March to talk about the measurment specifications she needs for the transistor.

Feb 27th - March 2nd :

• Me and jon met Dr. McCarcken. He told us that the transistor's interfaces (Source,Drain and gate) were smaller than the wire bonder's machine. So we talked to Dr.Zeng's TA Mr.Peng to make a larger transistor with larger pads to make it viable for the wire bonding process or be able to use cognitive apoxy on transistor.

March 3rd - 10th :

• We met with audrey for our progress update presentation. She was impressed with the work we had done in 2 weeks. it was expected because we had just gotten our parts and started buolding based on our design.
• In the next period we need to integrate the GPS as soon as it arrives and make sure that the teensy will handle the incoming data from multiple circuits. We also need to make sure that it will write to the SD card and have recognizable output data from the teensy.

March 4th - 10th :

• I coudn't update my website because I had a lot of work outside senior design and was only able to work with the team.

March 11th - 19th :

• We wored on Voltage step and voltage sweep circuits for our Gan HEMT tester.
• adam had an idea of providing voltage from multiple teensy port and adding them up using an op amp circuit.
• Our voltage step needs to provide 0V - 9V to the drain of the transistor, with 1V step during each full sweep of the sweeping circuit.
• Our votage sweep needs to provide voltages from (-4V) - (1V) to the gate of the transistor.
• We attempted and succeded making the voltage sweep and step circuits we still need the actual GaN HEMT to test the circuit under the required parameters.
• We aslo built the IN219 circuit which was meant to read amps from the output of the Gan HEMT transistor. We used a regular IRF510 MOSFET to test the circuit.

March20th - MArch 30th :

• We received our GPS module, PMB-648 GPS
• After fully designing our circuits we have now started building them, but we still need some parts like step up voltage module for the gieger counter.

April 1st - 15th:

• We had our april progress update with audrey
• she shipped the canister and is supposed to arrive by the end of april
• Professor Cotton let us know that we had to present our progress during decision day
• We have started writing the codes for the teensy 3.6 and the other parts -> GPS->INA219-> Accelerometer
• We started the integration process by the end of april and faced some major flaws in the code. Adam said he would try using Interrupts in the code to eleiminate these problems.
• We have also tested our INSS system and made sure it had written all information to the SD card.

April 16th - 28th :

• Dr.Cotton let us know that he has connectors for the Plug and Play Boards. We will start working on those as soon as we finish the preliminary testing for our main circuits
• I have started learning about designing the PCBs and am in the first stages.
• I decided to wait until we have comleted and tested all of our major components to start building the PCBs and send them for manufactoring after.
• Dr.Zeng and her TA let us know that they will be finishing their final design for the GaN HEMT soon and that we would be able to wire bond it to a Packaged outer shell for testing.
• Adam have made a lot of progress in puting the code together for all of our circuits. We aslo faced major problems in the Full Mission Testing after figuring out that one of our OP AMPs burned.

These are some PCB designs i have created for the Power Regulator and STEP circuit

May 22nd -

• We recieved the GaN HEMT from Dr.Zeng and her TA Peng Cui. She informed me that we needed to test the wire bonding process on one of the 25 transistor on the chip for pressure and heat before actually wire bonding the 4D-transistor that we will be tesitng during flight time.
• We are currently working on writing our Spring Final Report and designing the PCBs.