Established in 1988, we are a specialized trading company specialized in the wire and cable industry. Over the past 40 years, we have proudly contributed to the advancement of India’s manufacturing sectors, including automotive, electronics, medical, and other key industries.
In recent years, we have expanded our focus to the fast-growing semiconductor sector, actively pursuing new business opportunities and strategic partnerships. As part of our long-term vision, we are committed to supporting the development of the Indian semiconductor ecosystem.
We are excited to announce our participation in the upcoming SEMICON India 2025 event, where we will be exhibiting alongside one of Japan’s leading manufacturers. Together, we will showcase cutting-edge, high-quality testing components from Japan, with a strong vision toward localizing production in India in the near future.
IC SOCKETS
Manual Socket is used during the early testing phase. It comes with a top lid and is good for checking a small number of devices.
Handler Socket is made for mass production. It doesn't have a lid and is used for testing many devices quickly.
There are also sockets designed for specific device types:
WLCSP Socket is for very small chips. It has a 0.2mm pitch and 10 pins, using aluminum and ceramic parts for accuracy.
Power MOSFET Socket is used for power devices with a 0.4mm pitch. It can test both upper and lower pins (7 each).
Multi-Pin Socket is for BGA devices with many pins—up to 2,304. It uses strong materials like stainless steel and aluminum and can handle high pressure during testing.
Each socket is built to match the needs of different chips and test situations.
Kelvin Socket is used for very accurate electrical testing. It has 80 pins and is made for QFN-type chips. It can measure tiny resistance values using special Kelvin pins.
PoP Socket is for testing two chips stacked together. The top chip has 168 pins, and the bottom chip can have either 841 holes or 341 pins.
Diagonal Contact Socket has angled probes that clean the surface when they touch. This helps get better contact and more accurate results.
Glass Socket uses glass so you can see the chip during testing. It also helps keep the heat inside.
Barrel-Slide Socket lets you slide the chip in from the side, which reduces pressure and helps protect the chip.
We offer customizable contact probes on over 1,000 Specs for varieties of application
We offer customizable on over 1,000 Specs for varieties of application.
Our probe cards are compatible with WLCSP and can be customized according to pin positions.
It can be used for a pitch of up to 180 μm. We are developing a product for a pitch of 150 μm, to be compatible with narrower pitches.
Our pins are manufactured using a proprietary mechanical grinding process, which enables the production of highly precise taper shapes compared to conventional etched pins. This advanced method allows for the precise machining of precious metal materials that could not be processed by etching, making it suitable for testing increasingly fine-pitched semiconductor devices. From wire drawing, heat treatment, taper processing, and surface treatment (such as insulation coating and plating), to bending and final pin production, all processes are carried out in-house.
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