Hands-on Guide
Instructor demo
Instructor begins by setting up the bench with the training "kit" and powering on the TV w/ HDMI microscope
Ensure the student has a chair near the bench and can see the board + TV.
Key introduction points
Safety and safety glasses
Board holding
Board function
Power supply, ruler, helpful diagrams, and component names
Last thing is reminding them of tip tinning. This acts as segue into the hands-on portion
D1, R1, SW1
Resistor lead bending, insert into board and bend to hold in place
LED polarity (silkscreen reminder), insert and bend to hold in place
Show how SW1 will be difficult to hold in place
Slightly pre-bend the outer leads and show how SW1 becomes a press-fit
Clamp board with pana-vise
Position HDMI microscope about 6 inches above board
Solder D1 and R1
Make sure the student can see what's happening on the TV
TA should be looking at the board on the bench, NOT the TV
Use through-hole technique from the online tutorial. Demonstrate adding a little solder, waiting a moment to see it wick into the through-hole, then adding a tad more
Snip the leads. Show how to use other hand to hold the pin so it doesn't fly away. Set pins in a pile nearby on the bench for later use
Reposition board to see SW1 pins, emphasize the importance of moving the board around as often as necessary to reach the area of interest
Solder SW1
C1 (0.22uF)
Reposition board to see C1 pads, reiterate the importance of moving the board around
Tin the non-grounded pad of C1, mention how it's easier to solder pads with "fewer connections" (less thermal mass)
Briefly mention tweezer sizes and etiquette, showing how large tweezers would prevent C1 from sitting flat on the board and bent tips would make it difficult to hold
Slowly and carefully show how to slide the capacitor into place while heating the tinned pad
Mention these capacitors don't have a polarity
Use the technique from the online tutorial.
Remove iron THEN remove tweezers. Mention how "pressing down" on the capacitor can cause it to slip out and shoot across the board
Tin U1 pad
Reiterate the thermal mass comment
U1 (5 volt regulator with "L53B" marking on chip)
Smaller pins first, big terminal last
Show how big terminal has larger thermal mass- needing more time/heat to get the solder to wet
C2 (0.1uF)
Flip board over in pana-vise (open jaws to hold length-wise)
Mention the importance of positioning (again). Show how it helps reach C2
Tin C2 pad (mention thermal mass again) and solder C2
Prep. breadboard
Show how to snip header pins
Cut 2ea of 2x3 headers and insert into breadboard power rails (about 1/2 down the length of the breadboard)
Place board on pins and use a single row of header pins placed on the side to prop board
Show the importance of having the board sit flat on the header pins
J2
Reiterate the through-hole technique discussed for D1/R1
Waste and Cleanup
Find the small pile of snipped pins from earlier and show how to properly dispose of them in the waste bin.
Tin the iron and put back in the holder
student hands-on
The student will now solder the same components the TA demonstrated on their half of the board.
Move the HDMI microscope away so the student isn't compelled to learn how to solder while trying to keep the board in-frame on the TV
Make sure the student is wearing safety glasses
IMPORTANT: Have the student solder the components in the order outlined below. This was designed to intentionally create troubleshooting scenarios for the student.
D2, R6
C4 (0.22 uF)
After the student solders one side of C4, ensure the capacitor is lying flat on the board before letting them proceed
U2 (3.3 volt regulator with "C3Q" marking on chip)
The student will need to reposition the board the in pana-vise
Make sure a pad is tinned and the student knows they can rotate the board whichever way gives them the best angle for soldering
It's likely the student will struggle while soldering the large tab on the U2 regulator. If the student isn't able to achieve consistent wetting to the pad/tab after 2-3 tries, then it is an excellent opportunity for the instructor to introduce the concept of paste flux.
Apply paste flux to the tab and have the student hold their iron horizontally such to make contact with the tab and the pad. Ensure they wait long enough to melt the solder and emphasize how the flux helped with conducting heat and removing the oxides.
R11, R12, R13, R14
Having only been exposed to surface-mount capacitors, these resistors are for additional practice with 1206 components
Mention that resistors have an "up" and a "down" orientation and that the black side (with markings) should be facing "up."
C5 (47 uF)
The student will need to reposition the board again and they should be mindful not to hit the nearby LED with the iron
J3
Have the student transition to the breadboard that already has the header pins in place
C3
C6
student exam
To pass the qualification exam, the student will independently finish soldering the remaining components on the board and the instructor will evaluate the solder joints according to the criteria below. The instructor can be elsewhere in the lab while the student works.
The following criteria will be used to grade the exam and pertain ONLY to the components labeled as "Student Exam" on the schematic.
Described as Satisfactory or Unsatisfactory:
Electrical functionality of the board
Reasonable amount of solder on all joints (no bridges)
Acceptable solder wetting
No ripped pads
No scorched areas
Minimal/no melted housings
If any of the criteria are "unsatisfactory," the student may have as many attempts as necessary to fix the issue. The instructor can provide feedback/demonstrations on the student's board (if necessary). If the student continues to struggle, or the instructor is concerned for the safety of the student/equipment, the instructor will hand-off the student to the Instructional Lab Manager for one-on-one help.