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JOSEPH JEAN VUILLEMIN
https://sites.google.com/site/vuilleminresume/
Links: DESIGN Computational Fluid Dynamics (CFD) Thermal Analysis PROTOTYPE Finite Element Analysis (FEA) TESTING
RESUME:
OBJECTIVE:
A challenging position in mechanical engineering that will be complemented by my skills in Computer Aided Design (CAD) with expertise in SolidWorks, rapid prototyping, Finite Element Analysis (FEA), Computational Fluid Dynamics (CFD), experimentation and creative design.
EDUCATION:
Bachelor of Science, MECHANICAL ENGINEERING
University of Arizona, Graduation - May 1991
EMPLOYMENT:
MIT Lincoln Laboratory, (November 2021-July 2023) Lexington, MA 02421
Design Engineer subcontractor in the Rapid Prototyping group supporting packaging efforts. Developed packaging for devices (spectrometers, aircraft add-ons, etc.) and engineering support for prototyping and testing. Also used analysis tools like Finite Element Analysis (FEA). Solved very challenging and interesting engineering problems.
EIC LABORATORIES/BASCOM-TURNER INSTRUMENTS/AVION POWER/INPHOTONICS
These four companies are all affiliated.
EIC LABORATORIES (February 2004 to November 2021) Norwood, MA
Senior Mechanical Design Engineer in the packaging department. The EIC products include various government & privately funded research projects (opto-mechanical, heat transfer, initial product development, military, testing fixtures, package design, etc.). I designed many Military Lithium Ion-Batteries for larger and small-attack Helicopters, a stand-alone mini-gun power source, Ground Solders & Air Warriors batteries. These batteries are in the military testing phase of development. I also worked on various new innovative optics including spectrometers & optical probes. To accomplish these diverse packaging challenges, I took advantage of skills in creative design, 3D-solid modeling using SolidWorks, experimentation, rapid prototyping, analytical and numerical modeling (CAD, FEA, CFD, etc.). I used SolidWorks models for FEA structural analysis (NASTRAN & FEMAP) or thermal analysis for machining. I would port them to CAD-CAM (MasterCAM) to generate CNC milling machine programs and STL files for 3D-printing rapid prototypes. These skills were fine-tuned over the years, working with leading researchers, talented engineers and on cutting-edge projects.
INPHOTONICS, INC.
Designed packaging and mechanical engineering for InPhotonics. The work consisted of designing electronic & optical devices for commercial use and solving production related problems (mechanical & opto-mechanical design, heat transfer, production, etc.). The InPhotonics products are various Raman spectrometers and optical probes. I redesigned the VERAX desktop, Compact InPhochelle & InPhotote Portable Raman Systems.
BASCOM-TURNER INSTRUMENTS
Designed packaging and mechanical engineering for Bascom-Turner. The work consisted of designing electronic & optical devices for commercial use and solving production related problems (mechanical & opto-mechanical design, heat transfer, production, etc.). The Bascom-Turner products are gas detectors, sensors and calibration stations. I designed the handheld Gas-Explorer & Gas-Rover gas detector cases and was the lead mechanical engineer in their development. I redesigned and enhanced gas detectors & calibration systems like the latest N-CAL as well as their Gas Sensors. Some other enhancements were to help add Bluetooth & GPS capability to their detectors. In addition, I was heavily involved in acquiring product certifications like ATEX & MET lab. Just recently, I did the mechanical design of a new vehicle mounted Optical Gas-Detector. After finishing the design, I machined the parts for the first four detectors. I am now designing a new handheld electronic Gas-Detector. These mechanical designs were generated using SolidWorks.
AVION POWER
Designed packaging and mechanical engineering for AVION POWER. The work consisted of designing electronic & optical devices for commercial use and solving production related problems (mechanical & opto-mechanical design, heat transfer, production, etc.). The AVION POWER product is a Helicopter Starting System (Voyager). I designed the mechanical design for Voyager, which is the product that spun off this company. I also designed all of the EIC Labs Batteries that they sell. These mechanical designs were generated using SolidWorks.
CLARENDON PHOTONICS, (April 2002 to November 2003) Newton, MA
Senior Mechanical Design Engineer in the packaging department. Developed packaging for Clarendon’s planar waveguide products and helped research explore new possible products. These products are Remotely configurable Optical Add / Drop Multiplexer (ROADM) and Tunable OADMs for the telecommunication metro Dense Wavelength-Division Multiplexing (DWDM) network systems. This work consisted of design, COSMOS Finite Element Analysis (FEA), FloWorks (CFD) Thermal Modeling and building prototypes. There, I invented a passive variable resistant heatsink to reduce their ROADM power consumption. In addition, I helped model innovative advances in the waveguide technologies using my SolidWorks 3D modeling and numerical modeling tools (FEA). Working at this high-tech startup with bright young MIT graduates allowed me to exploit my creativity in a fast-paced/pressure-filled environment.
BELL LABORATORIES LUCENT TECHNOLOGIES (December 1998 to April 2002) Murray Hill, NJ
Research Engineer and Experimentalist at Lucent’s headquarters and main research center, working in the MEMS, Microelectronic and Optical Device Packaging Department. Bell Labs was one of the premier research institutions with the discovery of the transistor and turning out 11 Nobel Prize winners. The work consisted of research and development on optical networking device packaging and solving very difficult production problems. This included various optical waveguide devices, laser packages and a MEMS optical cross connect (OXC), a MEMS Dynamic Gain Equalization Filter (DGEF), etc. This was accomplished with experimentation, rapid prototyping, programming, computer aided design using Pro/Engineer (CAD), ANSYS Finite Element Analysis (FEA), Thermal Analysis using Icepak & Flotherm Computational Fluid Dynamics (CFD), analytical and numerical modeling with respect to photonics and microelectronic devices. During my time at Bell Labs, I worked with many project teams within basic research including MEMS, Packaging, Heat Transfer, Photonics, Wireless, Reliability, wafer fabrication, Mobile-Phone Base Stations, Network Cabinet Airflow, etc. In addition, I worked with several production engineering teams at many of Lucent’s manufacturing facilities.
AMERICAN BUREAU OF SHIPPING (ABS) (May 1991 to December 1998) New York, NY
Technical Computer Programmer and Mechanical Engineer. ABS is one of the top engineering societies certifying container ship, oil-tanker and oil-platforms, cruise ship designs & inspections. The computer programming work involved the development of engineering-based software to optimize ship structural designs and related mechanical systems (engines, propellers, etc.). I was one of the lead programmers who had developed an industry first in automating the ship classification process & design evaluation software (Safehull). In addition, I was the lead programmer in developing COM interfaces to other companies’ software in a joint effort to generate a seamless design through manufacturing software program system. This required knowledge of C, C++, COM, OpenGL graphics and FORTRAN to develop and port the programs to NT & UNIX platforms (SUN, HP, AIX, DEC, etc.). The engineering work consisted of FEMAP & NASTRAN Finite Element Analysis (FEA) on ship structures (Oil Tankers, Bulk Carriers, Oil Platforms, etc.) along with using engineering techniques to transfer technology from research to development. One of my responsibilities was to train other ABS engineers to use FEA. Wrote several user front ends to aid FEA structural building & loading like Bulkheads, Loading Oil, containers, etc.
SPECIAL SKILLS:
Excellent Mechanical Engineer skills
Experienced Researcher, Experimentalist and Troubleshooter Superior Mechanical Aptitude
CAD/Drafting/Solid Modeling Experience
Computer Aided Design (CAD): AutoCAD, SolidWorks, ProE, Mentor Graphics etc. Computer Aided Manufacturing (CAM) MasterCAM
Rapid prototyping (machining, welding, etc.)
Finite Element Analysis (FEA): ANSYS, NASTRAN, FEMAP, PATRAN, COSMOS Computational Fluid Dynamics (CFD): Icepak, Flotherm, FloWorks
Heat Transfer: ANSYS, NASTRAN, Harvard Thermal (TAS)
Computer Programming: JAVA, CGI, C, C++, OpenGL, FORTRAN, Pascal, Basic Mathematical spreadsheets: Mathematica, MathCAD, MATLAB
PROFESSIONAL REGISTRATIONS:
State of Arizona Engineering Registration - EIT
PROFESSIONAL AFFILIATIONS:
American Society of Mechanical Engineers Society of Automotive Engineers
Photonic and Optical Network Packaging Projects:
Waveguide Devices Packaging: Structural analysis to characterize Birefringence within the optical waveguide core for an Integrated Tunable Dispersion Compensator device. In addition, I ran steady state and transient thermal modeling with computational fluid dynamics to expedite waveguide production with respect to the packaging for a Programmable ADD-DROP waveguide module (RPLAD). A series of experimental benchmarks were used to validate these models which included rapid prototyping of packages.
40 Gbit/s. Receiver Thermal Analysis: Transient thermal Finite Element Analysis (FEA) to optimize the package thermally.
High-speed wire bonding analysis (40 Gbit/s): Non-linear Finite Element Analysis of high speed RF wire bonding for characterization and innovation purposes (FEA) for reliability concerns of very high speed interconnections.
Thermoelectric Cooler (TEC): Experimental and thermal modeling with computational fluid dynamics to characterize TECs with respect to performance and failure modes. The focus was on optimal selection of a TEC for packaging of thermal optical devices.
Laser Pump misalignment: Optimized design of the Kovar packaging to minimize thermally induced warpage of a Laser Pump. Extremely accurate FEA was needed (Presentation, Analytical & FEA).
Optical Fiber Curl: I developed an analytical solution for predicting thermally induced curl of an optical fiber caused by a functional variation of CTE and Young's modulus across the diameter. Published: Optical Engineering, Vol. 39 No. 12, December 2000 (Presentation, C++ programming, Analytical & FEA).
Interactive web publication of Fiber Optical Structures – Design for Reliability: Ephraim Suhir's course notes with integrated programs were published on Lucent's internal network (CGI network programming).
TRXA18 - ULTEM (FUBA) Reliability: Evaluate the reliability of manual soldered circuit board with solder (METAL 117 at 412 degrees C 1mm SuPb36Ag2)
InP wafer analysis for Reliability: Determined thermally induced and lattice mismatch stresses within the InP wafers (Photodetector & Laser) for various manufacturing steps. This project has increased our knowledge of the mechanical behavior of InP and thin films (Presentation, Experimental, Analytical & FEA).
Silicon wafer analysis for Reliability: Determine thermally induced stresses within the Silicon DI wafers for various manufacturing steps. This project is a good example of transferring technology from research to development (Experimental, Analytical & non-linear FEA).
Micro Electro Mechanical Systems (MEMS) Projects:
MEMS window analysis: Thermally induced stresses using FEA.
Aluminum Hexpack fiber bundle for the MEMS optical cross-connect (OXC): Design evaluation of an Aluminum Hexpack fiber bundle fixture with Zirconia Ferrules for the lens array.
Stainless Steel Hexpack fiber bundle for the MEMS optical cross-connect (OXC): Design evaluation of a Stainless Steel spring loaded Hexpack fiber bundle fixture with Zirconia Ferrules for the lens array.
MEMS Reliability of an adhesive bondline: FEA Parametric Analysis of bondline to determine the optimal thickness and adhesive type (ANSYS macro programming, Analytical & FEA).
MEMS polyamide pillar design evaluation: Design evaluation of the Lucent’s MEMS optical cross-connect structure and optical Dynamic Gain Equalization Filter (DGEF) devices.
MEMS polysilicon pillar design evaluation: Design evaluation of the Lucent’s MEMS optical cross-connect structure.
MEMS mirror curvature evaluation: Design evaluation of the Lucent’s MEMS optical cross-connect structure.
Specific Project / Skills:
Experienced Engineer
Design - Telecordia (Bellcore) specification.
Analytical Modeling
Numerical Modeling (FEA, CFD, Heat transfer, Mathematical spreadsheets, programming, etc.)
Experience at collecting data (data acquisition)
Experienced Researcher (retrieving information)
Work well in a team environment or individually
Experience dealing with clients and suppliers/vendors
Experience using testing equipment (PerkinElmer, Instron, OMEGA, etc.)
Experienced at Finite Element Analysis (ANSYS, NASTRAN, COSMOS, FEMAP, PATRAN, GIFTS, etc.)
Linear & Non-Linear Structural Analysis (stress, strain & displacement)
Steady state & Transient Thermal Analysis (Conduction, Convection, Radiation)
Dynamic Analysis (Modal, Spectrum, Harmonic, Random Vibration)
Thermally induced stress Structural Analysis
Experimentation Experience:
PerkinElmer DMA 7e - Dynamic Mechanical Analyzer
Instron Tensile Test
Stylus profiler- Dektak V200Si
Data acquisition (LabVIEW, InStruNet, etc.)
Strain gages, Thermocouples, etc.
Optical measurements
Accelerated Testing
Mathematical spreadsheets (Mathematica, MathCAD, MATLAB, etc.)
Experienced CAD & Solid Modeling (SolidWorks, Pro/Engineer, AutoCAD, TriSpectives, etc.)
Knowledge of many CAD, FEA, and Internet file formats (DXF, STEP, NASTRAN, HTML, SGML, etc.)
Experienced Technical/Engineering programmer (JAVA, CGI, C, C++, OpenGL, FORTRAN, Pascal, Basic, AutoLisp)
Knowledge of UNIX and Microsoft Windows GUI programming and interactive graphics involving “OpenGL”
Knowledge of interfacing and integrating “STEP” - STandard for the Exchange of Product model data - designated ISO 10303
Knowledge of interfacing and integrating “SGML” – Standard Generalized Markup Language ISO 8879 (Arbortext/ADEPT editor software)
Knowledge of interfacing and integrating “COM” – Component Object Model (OLE Automation)
Experienced at porting programming code from Microsoft Windows PC’s to UNIX workstation plat forms (SUN, HP, AIX, DEC).
Personal Activities: Golf, Skiing, Scuba, Mountain Biking, Chess
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