LIST OF PUBLICATIONS FOR RAMNATH VENKATRAMAN
1. J-H. Choy, V.Sukharev, A.Kteyan, H.Hovsepyan, R.Venkatraman, R.Castagnetti, Post Placement Leakage Reduction with Stress-Enhanced Filler Cells, To be presented as regular paper at International Symposium on Low Power Electronics & Design (ISLPED) 2015 and Design Automation Conference 2015 (Work-in-progress session).
2. M.Vilchis, R.Venkatraman, E.Costenaro, D.Alexandrescu, A Real-Case Application of a Synergetic Design-Flow-Oriented SER Analysis, pp.43-48, 18th IEEE International On-Line Testing Symposium (IOLTS), June 27-29, 2012.
3. R.Venkatraman, A.Tetelbaum, R.Castagnetti, Experimental Methodology for Validating Timing Closure with Advanced On-Chip Variation (AOCV), Paper 4U.3, Presented at DAC2011 User Track Session "Timing is Everything", 48th Design Automation Conference, San Diego, CA 2011.
4. R.Venkatraman, R.Castagnetti, A.Teene, B. Mbouombouo, S.Ramesh, Power & Variability Test Chip Architecture and 45nm-Generation Silicon-Based Analysis for Robust, Power-Aware SoC Design, Proceedings of the 10th International Symposium on Quality Electronic Design (ISQED), San Jose, 2009 (Best Paper awarded at Conference).
5. R.Venkatraman, R.Castagnetti, S.Ramesh, The Statistics of Device Variations and Its Impact on SRAM Bitcell Performance, Leakage and Stability, Proceedings of the 7th International Symposium on Quality Electronic Design (ISQED), 2006, San Jose, CA, pp.190-195.
6. R. Castagnetti, R. Venkatraman, B. Bartz, C. Monzel, T. Briscoe, A. Teene, S.Ramesh, A High-Performance SRAM Technology with Reduced Chip-Level Routing Congestion for SoC, Proceedings of the 7th International Symposium on Quality Electronic Design (ISQED), 2006, San Jose, CA, pp. 193-196.
7. R.Venkatraman, R.Castagnetti, O.Kobozeva, F.Duan, A.Kamath, J.J.Liaw, J.C.You, S.T.Sabbagh, M.Vilchis, S.Ramesh, The Design, Analysis, and Development of Highly Manufacturable 6-T SRAM Bitcells for SoC Applications, IEEE Transactions on Electron Devices, vol. 52, issue 2, pp.218-226 (2005).
8. O.Kobozeva, R.Venkatraman, R.Castagnetti, F.Duan, A.Kamath, S.Ramesh, Designing high-performance cost-efficient embedded SRAM in deep-submicron era, Proceedings of SPIE- Vol. 5379
Design and Process Integration for Microelectronic Manufacturing II, Lars W. Liebmann, Editor, May 2004, pp. 241-252
9. F.Duan, R.Castagnetti, R.Venkatraman, O.Kobozeva and S.Ramesh, Design and Use of Memory-Specific Test Structures to Ensure SRAM Yield and Manufacturability, Proceedings of the Fourth International Symposium on Quality Electronic Design (ISQED), 2003, San Jose, CA, pp. 119-124.
10. W.Kong, R.Venkatraman, R.Castagnetti, F.Duan and S.Ramesh, High-density and High-Performance 6T-SRAM for System-on-Chip in 130 nm CMOS Technology, 2001 Symposium on VLSI Technology, Digest of Technical Papers, pp.105-106.
11. G.Braeckelmann, R.Venkatraman, C.Capasso and M.Herrick, Integration and Reliability of Copper Magnesium Alloys for Multilevel Interconnects, Proceedings of the IEEE International Interconnect Technology Conference, 2000, pp. 236-238.
12. R.Venkatraman, A.Jain, J.Farkas, J.Mendonca, G.Hamilton, C.Capasso, D.Denning, C.Simpson, B.Rogers, L.Frisa, T.P.Ong, M.Herrick, V.Kaushik, R.Gregory, E.Apen, M.Angyal, S.Filipiak, P.Crabtree, T.Sparks, S.Anderson, D.Coronell, R.Islam, B.Smith, R.Fiordalice, H.Kawasaki, J.Klein, S.Venkatesan, E.Weitzman, Integration of Multilevel Copper Metallization into a High Performance sub - 0.25µm Technology, Invited paper, Proceedings of Materials Research Society Spring 1998 Conference, Symposium on Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits, San Francisco, CA, v338, pp.41-52 (1998), and,
Invited paper, Proceedings of the ISFIIE conference, Sendai, Japan, April 1999.
Invited Talk, University of Michigan, Department of Materials Science, 1998.
13. C. Capasso , M. Herrick, R. Venkatraman, M.Gall, D. Jawarani, H. Kawasaki, M.Azrak, B. Baker, R. Blumenthal, P. Crabtree, D. Denning, D. Farber, J. Farkas, R. Fiordalice, S. Garcia, C. Goldberg, N. Grove, G.Hamilton, R.Hernandez, R.Islam, D.Kolar, P.Mulski, J.Mendonca, R.Nelson, T.Sparks, C.Simpson, B.Smith, S.Venkatesan, E.Weitzman and F.Pintchovski, Electromigration Reliability of Copper Interconnects for 0.15 Gate CMOS Technology, presented at the 1999 Spring Materials Research Society, San Francisco, CA.
14. J.Zhang, R.Venkatraman, R.Nagabushnam, T.Wilson, R.Fiordalice, R.Gregory, E.Weitzman, PVD Ti-Si-N Process Development for ULSI Applications, Proceedings of Materials Research Society Spring 1998 Conference, Symposium on Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits, San Francisco, CA, v338, pp.513-519 (1998).
15. J.Zhang, D.Denning, G.Braeckelmann, R.Venkatraman, R.Fiordalice and E.Weitzman, CVD Cu Process Integration for sub-0.25µm Technologies, paper presented at the 1st International Interconnect Technology Conference (IITC), San Francisco, May 1998.
16. A.Jain, O.Adetutu, B.Ekstrom, R.Fiordalice, R.Venkatraman and E.Weitzman, Process Development, Film Characterization and Integration of PECVD W2N as a Diffusion Barrier for Copper Interconnect, Proceedings of the Advanced Metallization Conference in 1998, G.S. Sandhu, H.Koerner, M.Murakami, Y.Yasuda and N.Kobayashi editors, pp.305-311, Materials Research Society, Warrendale, PA (1999).
17. D.Denning, G.Braeckelmann, J.Zhang, R.Fiordalice and R.Venkatraman, An Inlaid CVD Cu Based Integration for Sub 0.25µm Technology, 1998 Symposium on VLSI Technology Digest of Technical Papers, The IEEE Electron Devices Society, Piscataway, NJ, pp. 22-23 (1998).
18. D.G.Coronell, E.W.Egan, G.Hamilton, A.Jain, R.Venkatraman and E.Weitzman, Monte Carlo Simulations of Sputter Deposition and Step Coverage of Thin Films, presented at the International Conference on Metallurgical Coatings and Thin Films, San Diego, 1997, published in Thin Solid Films, Vol. 333, pp. 77-81 (1998).
19. R.Venkatraman, J.Mendonca, T.P.Ong, G.Hamilton, B.Rogers, L.Frisa, C.Simpson, V.Kaushik, R.Gregory, E.Apen, D.Coronell, M.Angyal, A.Jain, M.Herrick, C.Capasso, R.Fiordalice, J.Klein and E.Weitzman, Process Development and Integration of PVD Ta-Si-N films for Copper Interconnect Applications, Proceedings of the Advanced Metallizations and Interconnect Systems for ULSI Applications conference, San Diego, 1997, pp. 63-70, R.Cheung et al. editors, Materials Research Society, Warrendale PA (1998).
20. A.Jain, C.Simpson, T.Saaranen, R.Venkatraman, M.Herrick, M.Angyal, R.Bajaj, C.Dang, S.Das, D.Denning, J.Farkas, D.Watts, C.Capasso, J.Gelatos, R.Islam, B.Smith, T.Sparks, P.Crabtree, S.Filipiak, C.King, R.Fiordalice, H.Kawasaki, J.Klein, S.Venkatesan and E.Weitzman, CVD TiN and Embedded Barriers for Copper Interconnect Technology, Proceedings of the Advanced Metallizations and Interconnect Systems for ULSI Applications conference, San Diego, 1997, pp. 41-48, R.Cheung et al. editors, Materials Research Society, Warrendale PA (1998).
21. J.Mendonca, R.Venkatraman, G.Hamilton, M.Angyal, B.Rogers, L.Frisa, V.Kaushik, C.Simpson, T.P.Ong, M.Herrick, R.Gregory, T.Remmell, R.Fiordalice, J.Klein, E.Weitzman, P.Ding, T.Chiang, B.Chin, TaN as a Cu diffusion barrier in metallization structures, Proceedings of the Advanced Metallizations and Interconnect Systems for ULSI Applications conference, San Diego, 1997, pp. 741-746, R.Cheung et al. editors, Materials Research Society, Warrendale PA (1998).
22. T.P.Ong, R. Fiordalice, R.Venkatraman, S.Garcia, A.Jain, T.Sparks, J.Farkas, M.Fernandes, M.Gall, D.Jawarani, J.Klein, E.Weitzman, H.Kawasaki, W.Wu, R. Blumenthal, F.Pintchovski, R.Marsh, P.Zhang, H.Zhang, T.Guo, R.Mosely, Void-free chemically vapor-deposited aluminum dual inlaid metallization schemes for ultra-large-scale-integrated via and interconnect applications, Applied Physics Letters, v73, no.1 pp.82-84, (1998).
23. S.Venkatesan, A.V.Gelatos, V.Misra, R.Islam, B.Smith, J.Cope, B.Wilson, D.Tuttle, R.Cardwell, I.Yang, P.V.Gilbert, R.Woodruff, R.Bajaj, S.Das, J.Farkas, D.Watts, C.King, P.Crabtree, T.Sparks, T.Lii, C.Simpson, A.Jain, M.Herrick, C.Capasso, S.Anderson, R.Venkatraman, S.Filipiak, R.Fiordalice, K.Reid, J.Klein, E.J. Weitzman and H.Kawasaki, A High Performance 1.8V, 0.2µm CMOS Technology with Copper Metallization, Proceedings of IEDM, (1997).
24. R.Venkatraman, A.Jain and K.Lucas, Insulating Passivation and ARC films by Reactive Sputtering of M-Si targets, Motorola Defensive Publication, (1997).
25. R.Venkatraman, R.Marsh, E.Weitzman, B.Rogers, R.Fiordalice, M.Gall, D.Jawarani, H.Kawasaki, M.Herrick, J.Farkas and F.Pintchovski, Process for Obtaining Copper Alloyed Chemically Vapor Deposited Aluminum Interconnects, Proceedings of the Advanced Metalization and Interconnect Systems for ULSI Applications, Boston MA 1996 pp. 63-70, R.Havemann et al. editors, Materials Research Society, Warrendale PA (1997).
26. R.Fiordalice, T.Ong, S.Garcia, J.Farkas, M.Fernandes, M.Gall, A.Jain, D.Jawarani, H.Kawasaki, J.Klein, B.Roman, T.Sparks, R.Venkatraman, T.Vuong, E.Weitzman and F.Pintchovski, The chemical vapor deposition of aluminum for interconnect and via applications: an integration overview, Proceedings of the Advanced Metallizations and Interconnect Systems for ULSI Applications conference, Boston, MA 1996, pp. 13-21, R.Havemann et al. editors, Materials Research Society, Warrendale PA (1997).
27. R.Fiordalice, R.Blumenthal, M.Fernandes, S.Garcia, J.Gelatos, H.Kawasaki, J.Klein, R.Marsh, R.Venkatraman, E.Weitzman and F.Pintchovski, A Low Temperature CVD Al Plug and Interconnect Process for 0.25 µm Metallization Technologies, 1996 Symp. VLSI Technology Digest of Technical Papers, p.42, Institute of Electrical and Electronics Engineers (IEEE), (1996).
28. R.Venkatraman, J.R.Wilcox and S.R.Cain, Experimental Study of the Kinetics of Transient Liquid Phase Solidification Reaction in Electroplated Gold-Tin Layers on Copper, Metallurgical and Materials Transactions A, v28A, pp 699-705 (1997).
29. S.R.Cain, J.R.Wilcox and R.Venkatraman, A Diffusional Model for Transient Liquid Phase Bonding, Acta Materialia, v45 pp.701-707 (1997).
30. R.Venkatraman, K.Knadle, G.C. Haddon, K.Ramakrishna and W.T.Chen, Role of Smear on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards, Proceedings of the International Intersociety Electronic Packaging Conference -Interpack '95, EEP v10-1, p409, American Society of Mechanical Engineers (ASME), New York, NY (1995) and in ASME Journal of Electronic Packaging, v.123, No.1, pp 6–15 (2001).
31. R.Venkatraman, M.Jimarez and K.Fallon, Decal Solder Bumping Process for the Direct Flip Chip Attach Applications, Proceedings of the 1995 International Symposium on Flip Chip, TAB and Ball Grid Array Technology (held Feb. 1995), Semiconductor Technology Center Inc., Neffs, PA (1995).
32. R.Venkatraman, Fabrication of Electroplated Stainless Steel Based Eutectic Sn/Pb Solder Decals, IBM Technical Disclosure Bulletin, v37, No.12, p.231 (1994).
33. R.Venkatraman, Plasticity, Microstructure and the Thermal Dependence of Flow Stresses in Aluminum Thin Film Interconnects, Invited Talk, Proceedings of Materials Research Society Conference, (Spring 1994 Materials Research Society Conference, San Francisco, CA), v338, p215 (1994).
34. R.Venkatraman, P.R.Besser, J.C.Bravman and S.Brennan, Elastic strain gradients and X-ray line broadening effects as a function of temperature in aluminum thin films on silicon, Journal of Materials Research , v9, p328 (1994).
35. P.R.Besser, S.Bader, R.Venkatraman and J.C.Bravman, Stress gradient and relaxation measurements in Al and oxygen implanted Al films, Proceedings of Materials Research Society Conference, (Spring 1993 Materials Research Society Conference, San Francisco, CA) v308, p323 (1993).
36. R.Venkatraman and J.C.Bravman, Separation of film thickness and grain boundary strengthening effects in Al thin films on Si, Journal of Materials Research , v7, p2040 (1992).
37. R.Venkatraman, P.R.Besser, J.C.Bravman and S.Brennan, Determination of strain distributions in aluminum thin films as a function of temperature by the use of synchrotron grazing incidence X-ray scattering, Proceedings of Materials Research Society Conference., (Fall 1991 Materials Research Society Conference, Boston, MA) v239, p227 (1992).
38. P.R.Besser, R.Venkatraman, J.C.Bravman and S.Brennan, Determination of strain distributions in thin aluminum lines as a function of temperature using grazing incidence X-ray scattering, Proceedings of Materials Research Society Conference, (Fall 1991 Materials Research Society Conference, Boston, MA) v239, p233 (1992).
39. R.Venkatraman and J.C.Bravman, An anodic process for the determination of grain boundary and film thickness strengthening effects in aluminum films on oxidized silicon, Proceedings of Materials Research Society Conference, (Fall 1991 Materials Research Society Conference, Boston, MA) v239, p127 (1992).
40. R.Venkatraman, Plasticity and flow stresses in aluminum thin films on silicon, PhD dissertation, Stanford University, Stanford, CA 94305 (1992).
41. R.Venkatraman, S.Chen and J.C.Bravman, The effect of laser reflow on the variation of stress with thermal cycling in aluminum thin films, Journal of Vacuum Science and Technology A, v9, p2536 (1991).
42. Pushkar P. Apte, R. Venkatraman, Krishna C.Saraswat, Mehrdad M.Moslehi, Richard Yeakley, Demonstration of multiprocessing by silicon epitaxy following in-situ cleaning, Proceedings of Materials Research Society Conference, (Spring 1991 Materials Research Society Conference, Anaheim, CA) Rapid Thermal and Integrated Processing Symposium, p.273, (1991).
43. R.Venkatraman, J.C.Bravman, W.D.Nix, P.W.Davies, P.A.Flinn and D.B.Fraser, Mechanical properties and microstructural characterization of Al-0.5%Cu thin films, Journal of Electronic Materials., v19, p1231 (1990).
44. R.Venkatraman and N.Jayaraman, Characterization and wear performance of plasma sprayed WC-Co coatings, Materials Science and Technology , v5, p382 (1989).
45. R.Venkatraman, Characterization and evaluation of plasma sprayed tungsten carbide-cobalt coatings, Masters thesis, University of Cincinnati, Cincinnati, OH 45221 (1987).
46. R.Venkatraman and N.Jayaraman, Quantitative analysis by X-ray diffraction in the Co-W-C system, Journal of Materials Science Letters, v6, p1414 (1987).
47. R.Venkatraman, B.Jha, V.Gopinathan and P.Ramakrishnan, Investigation on mechanical alloying of aluminum, nickel and iron powders, Transactions of the Indian Institute of Metals, v39(6), p592 (1986).