H. M. Lee, W. C. Choi et al. "Stability analysis of the rapid heating multilayer structure mold by the contact error and thickness of layers." Applied Sciences, 2024, 14(7), 2813.
H. S. Choi, W. C. Choi et al. "Press Conduction Welding for Secondary Bonding of Aircraft Skin/Stiffener Assemblies Using Carbon Fiber/PEKK Thermoplastic Composites and PEI Adhesive." Polymers, 2024, 16(6), 750.
H. M. Lee, W. C. Choi et al. "Development of a modular mold with a carbon-nanotube web film heater for rapid-heating cycle molding." The International Journal of Advanced Manufacturing Technology, 2024, 1-14.
H. S. Choi, W. C. Choi et al. "Secondary bonding of CF/PEKK thermoplastic composites with a PEI film adhesive in a press welding process." Modern Physics Letters B, 2023, 37(17), 2340016.
H. S. Choi, W. C. Choi et al. "Quantitative evaluation of the sheared edge of woven glass epoxy laminate after mechanical punching." The International Journal of Advanced Manufacturing Technology, 2023, 124(7), 2313-2321.
J. Jang and W. C. Choi. "Error Compensation Through Analysis of Force and Deformation in Non-circular Grinding." International Journal of Precision Engineering and Manufacturing, 2022, 23(6), 627-638.
J. Jang and W. C. Choi, “Prediction of angle error due to torsional deformation in non-circular grinding,” Mech. Sci., vol. 12, pp. 51–57, 2021.
Y. K. Kim and W. C. Choi, “Effect of ricochet of exploded steel debris with various ground conditions on lethality ,” Process Safety and Environmental Protection, In preparation.
Y. K. Kim and W. C. Choi, "Ricochet of steel spheres on sand with varying water content," Advances in Mechanical Eng., vol. 12, no. 12, pp. 1–12, 2020.
Y. K. Kim and W. C. Choi, “Effect of Change of Sand Properties on Travel Distance of Ricocheted Debris ,” Def. Tech. Online published, 2020.
J. Jang and W. C. Choi, “Error Compensation Using Variable Stiffness in Orbital Grinding,” Int. J. Precis. Eng. Manuf., vol. 19, no. 3, pp. 317–323, 2018.
Y. K. Kim and W. C. Choi, “Ricochet of Spheres on Sand of Various Temperature,” Def. Sci. J., vol. 68, no. 2, pp. 150–158, 2018.