Research Area : High-k dielectrics, Oxide ALD
Office : Engineering Building 5, RM #330
E-Mail : shinyc9782@gmail.com
Birth date : 1997.08.02
Hanyang University, Ansan, Korea
Research advisor : Professor Ji-Hoon Ahn
B. S. in Department of Mechanical Engineering (2017. 03 - 2023. 02)
Tech University of Korea, Siheung, Korea
3. “Effect of Al doping on structural and electrical properties of HfO2/ZrO2 layered structures for high-k applications"
Journal of Alloys and Compounds, 1010 177682 (2025).
Yeon-Ji Jeon, Seung Won Lee, Yoonchul Shin, Ji-Hwan Kim, Chang Mo Yoon, Ji-Hoon Ahn*
Current Applied Physics, 67 93-100 (2024).
Jae Yeob Lee, Cheol Jun Kim, Minkyung Ku, Tae Hoon Kim, Taehee Noh, Seung Won Lee, Yoonchul Shin, Ji-Hoon Ahn, Bo Soo Kang
1. "Implementation of rutile-TiO2 thin films on TiN without post-annealing through introduction of SnO2 and its improved electrical properties"
Surfaces & Interfaces, 42 Part A 103420 (2023).
Min Ji Jeong, Seung Won Lee, Yoonchul Shin, Jeong-Hun Choi, Ji-Hoon Ahn*
The Korean Ceramic Society, Spring Conference (2025), Korea
Yoonchul Shin, Jin-Sik Kim, Yun-Kyeong Yi, and Ji-Hoon Ahn*
The 32nd Korean Conference on Semiconductors (KCS 2025), Korea
YoonChul Shin, and Ji-Hoon Ahn*
The Korean Institue of Metals and Materials Spring Conference (KIM 2024 spring), Korea
YoonChul Shin, and Ji-Hoon Ahn*
3. "Optimization for enhanced electrical properties of ZrO2/HfO2 laminated structure for metal-insulator-metal capacitors" - Domestic
The 31th Korean Conference on Semiconductors (KCS 2024), Korea
YoonChul Shin, Seung Won Lee, Ji-Hoon Ahn*
2. "Optimization for enhanced electrical properties of ZrO2/HfO2 laminated structure for metal-insulator-metal capacitors" - International
The Korean International Semiconductor Conference & Exhibition on Manufacturing Technology (KISM 2023), Korea
YoonChul Shin, Seung Won Lee, and Ji-Hoon Ahn*
1. "Enhanced physical and electrical characteristics of SnO2 thin films deposited by Atomic Layer Deposition using Noble Tin Precursor" - International
The Global Conference on Innovation Materials (GCIM 2023), Korea
YoonChul Shin, Min Ji Jeong, Seung Won Lee, and Ji-Hoon Ahn*