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Working with process development for realizing the leading edge logic semiconductor devices in 2nm nodes and beyond. Cutting edge AI &ML, data centre computations requires higher computation powers which can be realized with nodes 2nm and beyond logic devices.
Working with process development for realizing the leading edge logic semiconductor devices in 2nm nodes and beyond. Cutting edge AI &ML, data centre computations requires higher computation powers which can be realized with nodes 2nm and beyond logic devices.
- Completed On Job Training (OJT) on full semiconductor manufacturing process.
- Completed On Job Training (OJT) on full semiconductor manufacturing process.
- have intensive hands on 4 days workshop on complete (CMOS) chip manufacturing process from cleaning of wafer to wiring and packaging at Kyushu Institute of Technology, Fukuoka, Japan.
- have intensive hands on 4 days workshop on complete (CMOS) chip manufacturing process from cleaning of wafer to wiring and packaging at Kyushu Institute of Technology, Fukuoka, Japan.
- Started to understand deeper on device physics in connection with device performance. Further studying Device Physics.
- Started to understand deeper on device physics in connection with device performance. Further studying Device Physics.
- Studied the cutting edge technologies future scaling from IBM/Imec PTW and IEDM materials, sessions. - In the process, also got to hands on with EDA tools/spice simulations.
- Studied the cutting edge technologies future scaling from IBM/Imec PTW and IEDM materials, sessions. - In the process, also got to hands on with EDA tools/spice simulations.
- Recently working with Siview and BEOL Process Integration techniques.
- Recently working with Siview and BEOL Process Integration techniques.
Assertively contributing towards process realization, integration and yield enhancements.
Assertively contributing towards process realization, integration and yield enhancements.
Project / Research Experience (3 Years full time & 2 Years 3 Months during my master course)
Project / Research Experience (3 Years full time & 2 Years 3 Months during my master course)
Project Officer / Project Scientist ( 29 Jan 2020 - 31 Oct 2020 || 01 Feb 2021 - 25 Sep 2021 [1 year 6 months]) ,
Centre for Industrial Consultancy & Sponsored Research,
Indian Institute of Technology Madras, Chennai - 600036, Tamilnadu, India.
Project Associate / Project Engineer (13 May 2016 to 18 June 2018 || 1 Jan 2019 - 31 March 2019 [2 Years 3 months])
Centre for Industrial Consultancy & Sponsored Research,
Indian Institute of Technology Madras, Chennai - 600036, Tamilnadu, India.
Exchange Program / Internship (STSI Program) (June - Sep 2019)
Quantum Science and Engineering, Faculty of Engineering
Hokkaido University, Sapporo, Japan.
Project Associate (Jan - 2015 - Feb 2016) | Project Assistant (Sep 2014 - Dec 2014) [1 year 6 months]]
Department of Mechanical and Aerospace Engineering,
Indian Institute of Technology Hyderabad, Hyderabad - 560012 , Telangana, India.
Research Internship (Jun'14 - July'14)
Department of Mechanical Engineering,
Indian Institute of Technology Guwahati, Guwahati - 781039, Assam, India.
Industrial Internship (May'13 - July'13)
HMT Machine Tools Limited, Bangalore Complex, Bangalore - 560013, Karnataka, India
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