Ruidong Li, 

Associate Professor, Institute of Science and Engineering, Kanazawa University, Japan

Director of Intelligent Computation and Network Laboratory, Director of NVIDIA-ICNL Joint Laboratory, 

Chair of Internet Technical Committee (ITC)

E-mail: liruidong AT ieee.org      lrd AT se.kanazawa-u.ac.jp    ruidongli AT acm.org    

Short biography

Dr. Ruidong Li is an Associate Professor at the Institute of Science and Engineering, and the Director of Intelligent Computation and Network Laboratory (ICNL, www.li-nlab.org), Kanazawa University, Japan. Before joining Kanazawa University, he was a senior researcher at the National Institute of Information and Communications Technology (NICT), Japan. He was a member of the AKARI Architecture Design Project for New Generation Networks, the Japanese national project for developing the future networks. He has been involved in the design, implementation, evaluation, and optimization of future network architecture. 

Dr. Li is an active researcher in the areas of future network, big data, quantum network, metaverse, blockchain, B5G/6G, Internet of Things (IoT), machine learning, and security. He has published technical research papers in leading journals and conferences, such as IEEE JSAC, ACM/IEEE TON, IEEE TIFS, IEEE TWC, IEEE TCCN, IEEE TNSE, IEEE TCOM, IEEE Network, IEEE IoT Journal, IEEE Communications Magazine, IEEE TVT, IEEE TII, IEEE TNSM, IEEE TITS, IEEE TGCN, ACM TOSN, IEEE INFOCOM, Elsevier Computer Networks, and etc.. Dr. Li is listed in World’s Top 2% Scientists, Stanford University/Elsevier. He is the recipient of the best paper awards for IEEE ICC 2022 and IWCMC 2022, IEEE Network 2022 Editor Appreciation Award, and MMTC Outstanding Leadership Award 2023. His laboratory established collaborative relations with National Institute of Information and Communications Technology (NICT) and NVDIA (NIVIDIA-ICNL Joint Lab.).

Dr. Li serves as the chair of IEEE Internet Technical Committee (ITC), and is the founder and chair of IEEE SIG on Metaverse, IEEE SIG on Intelligent Internet Edge, and IEEE SIG on BIg Data Intelligent Networking. He is the associate/technical editor of IEEE TCOM, IEEE IoTJ, and IEEE Network, and also served as the guest editors for a set of prestigious magazines, transactions, and journals, such as IEEE Communications magazine, IEEE Network, IEEE TNSE, IEEE Wireless Communications, IEEE IoTJ, and ITU J-FET. He also served as chairs for conferences and workshops, such as the general chair for ICNC 2025, IEEE HealthCom 2024, MOBILWare 2022, IEEE MSN 2021, CPSCom 2021, IEEE INFOCOM 2019/2020/2021/2022 ICCN workshop, AIVR2019, Area TPC chair for INFOCOM 2023, TPC chair for IEEE AIoT 2024, QCNC 2024, ICNC 2024, IEEE MetaCom 2023, HotICN 2022, IEEE/ACM IWQoS 2021, IEEE MSN 2020, BRAINS 2020, ICCSSE 2019, IEEE ICDCS 2019/2020 NMIC, and IEEE Globecom 2019 ICSTO. He has been visiting scholar in University of Göttingen (2016), Temple University (2016), University of Alabama (2017), and UCLA (2017). He is a senior member of IEEE, a member of ACM and IEICE.

New ICCCN 2025: 34th International Conference on Computer Communications and Networks (ICCCN 2025)

New QCNC 2025: International Conference on Quantum Communications, Networking, and Computing

New IEEE Network, Series 3 on Quantum Communications and Networking, CFP (Submission Deadline: 15 September 2024)

New ICNC 2025 International Conference on Computing, Networking and Communications (ICNC 2025)  

New IEEE AIoT 2024: IEEE International Conference on Artificial Intelligence of Things

New QCNC 2024: International Conference on Quantum Communications, Networking, and Computing

New IEEE HealthCom 2024: IEEE International Conference on E-health Networking, Application & Services

New ICCCN 2024 33nd International Conference on Computer Communications and Networks (ICCCN 2024), Track on Emerging Topics in Networking 

New IEEE Transaction on Consumer Electronics, Special Section on Advances in Artificial intelligence (AI) enabled Vehicular Edge Computing (VEC) for consumer electronics 

New INFOCOM 2024 Demo/Poster: IEEE International Conference on Computer Communications 2024 (INFOCOM 2024) Demo/Poster

New ACM DLT, Special Issue on Blockchain, Metaverse, and Web 3.0: Innovations and Applications, CFP (Deadline: 15 March 2024)

New IEEE INFOCOM ICCN 2024 The Sixth International Workshop on Intelligent Cloud Computing and Networking (ICCN 2024)