Work Experience

Baker Hughes Inc.

Jun – Aug, 2012

Research, Design & Development Software Intern

- Programmed a microcontroller for master slave communication.

- Was responsible right from gathering requirements, designing the system, implementing it and finally testing it.

60 GHz Integrated Circuit Packaging Technologies at Indian Institute of Technology (IIT) Bombay.

Guide: Dr. Shalabh Gupta

15th May 2010- 1st July 2010

Research was on 60-GHz band which is an unlicensed band which features a large amount of bandwidth and a large worldwide overlap. The large bandwidth means that a very high volume of information can be transmitted wirelessly.

The research included two aspects of packaging:

1) The importance of the 60GHz band, challenges involved in packaging of millimeter wave integrated circuits (ICs) and various cost-effective packaging technologies for a fully integrated 60GHz radio suitable for millimeter wave packaging. The packaging technologies analyzed and compared were LTCC, BGA, LGA, DCA (Wire Bonded), DCA (Flip Chip) etc.

2) Substrate material parameters required and comparison of substrates that can be used for millimeter wave ICs.

A final conclusion as to which packaging technology and substrate material would be the most suitable for the ICs working at 60GHz.

Was awarded an honorarium by the IIT, Bombay for this project.

BAJAJ ALLIANZ GENERAL INSURANCE COMPANY LIMITED

JUN 14-JUL 11 2008

Quality and Testing of Software.

Summer vacation internship in the Information Technology Department in the field of Quality and Testing.

Duties included the testing of software and quality assurance through interaction with the staff for understanding process of issuance of the insurance policy and settlement of claims. To test the softwares based on the understanding derived through discussions.