Biography

Short Biography

Jungwon Lee (M’05–SM’12–F’18) is a Corporate EVP in charge of modem development at Samsung Electronics in South Korea. He received his BS degree from Seoul National University and MS and PhD degrees from Stanford University, all in Electrical Engineering. From 2003 to 2010, he was with Marvell Semiconductor, Inc., where he developed LTE, WiMAX, Wi-Fi, Bluetooth, and HD Radio chips. From 2010 to 2020, he was  with Samsung USA, developing cellular modems, connectivity chips, NPUs, and ISPs. From 2013 to 2019, he was also with University of California, San Diego, as an Associate Adjunct Professor. Since 2021, he has been with Samsung Electronics in Korea. He is currently conducting research on 5G, 6G, and AI. He has co-authored over 150 papers and holds approximately 400 patents in the US and many more worldwide. Dr. Lee became an IEEE Fellow in 2018.

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(Updated on 7/28/2022)