Mark A. Tschopp, Ph.D.
PhD 2007 Georgia Institute of Technology, Materials Science & Engineering
MS 1999 University of Missouri-Rolla, Metallurgical Engineering
BS 1998 University of Missouri-Rolla, Metallurgical Engineering
Link to Publications: Mark Tschopp, Google Scholar
Link to Nanoscale Research: CAVS ICME Site
Dr. Mark A. Tschopp is a materials engineer at the U.S. Army Research Laboratory. He obtained his Ph.D. degree in materials science and engineering in 2007 from the Georgia Institute of Technology (advisor: Dr. David L. McDowell), where his atomic scale research into grain boundary and dislocation interactions received an NSF fellowship, the Luther Long award (awarded to one solid mechanics student from four ‘Top 10’ departments), and the Sigma Xi best PhD dissertation award (annually awarded to only 5 students on campus). He obtained his Master's degree in metallurgical engineering from the University of Missouri-Rolla, where his research on defect formation mechanisms in lost foam casting was awarded best paper by the American Foundry Society. Additionally, Mark has spent 4 years in casting research and development at GM Powertrain, 2 years in material sustainability and mechanics within the Life Prediction and Behavior group within the Metals branch at the Air Force Research Laboratory, and 4+ years as faculty at Mississippi State University. Mark has published over 100 journal papers, book chapters, conference papers, and technical reports with >1100 citations for the >60 peer reviewed journal papers (Google Scholar, h-factor of 18). At present, he has been either the presenter or co-author on >100 presentations and seminars at national and international conferences, including giving >50 invited seminars, invited talks, and keynote talks. His research has been featured on the covers of two journals. Mark was recently awarded the Mississippi State University StatePride Faculty Award for excellence in teaching, research, and service to Mississippi State University. He is a highly active member of ASM International, TMS, and ASME.