Publication List

[1]    C. Yuan, Q. Su, and K.-N. Chiang, "Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks," Materials, vol. 16, no. 14, 2023.

[2]    H.-C. Kuo, C.-Y. Chang, C. Yuan, and K.-N. Chiang, "Wafer-level packaging solder joint reliability lifecycle prediction using SVR-based machine learning algorithm," Journal of Mechanics, vol. 39, pp. 183-190, 2023

[3]    C. C. A. Yuan, H. M. Chang, and K. N. Chiang, "Investigation of the mechanical characteristics of the Cu/low-k BEOL under wire bonding process loading," Journal of Mechanics, vol. 38, pp. 539-551, 2022.

[4]    C. Yuan, "An AI-Based Adaptive Surrogate Modeling Method for the In-Service Response of UVLED Modules," Electronics, vol. 11, no. 18, p. 2861, 2022.

[5]    C. Yuan, X. Fan, and G. Zhang, "Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models," Materials, vol. 14, no. 17, p. 4835, 2021.

[6]    C. Yuan, J. Fan, X. Fan, "Deep Machine Learning of the Spectral Power Distribution of LED System with Multiple Degradation Mechanisms," Journal of Mechanics,vol. 37, pp. 172-183, 2021.

[7]    C. Qian, X. J. Fan, J. J. Fan, C. A. Yuan, and G. Q. Zhang, "An accelerated test method of luminous flux depreciation for LED luminaires and lamps," Reliability Engineering & System Safety, vol. 147, pp. 84-92, 2016.

[8]    Y. Liu, F. Sun, C. A. Yuan, and G. Zhang, "Thermal analysis of chip-on-flexible LED packages with Cu heat sinks by SnBi soldering," Microelectronics International, vol. 33, no. 1, pp. 42-46, 2016.

[9]    C. Yuan, "The extended Beer–Lambert theory for ray tracing modeling of LED chip-scaled packaging application with multiple luminescence materials," Optical Materials, vol. 50, pp. 193-198, 2015.10.29 2015.

[10]  Y. Liu, Y. Y. Liang. K. Y. Wong, C. A. Yuan, G. Zhang, and F. Sun, "Thermal simulation of flexible LED package enhanced with copper pillars," Journal of Semiconductors, vol. 36, no. 6, p. 064011, 2015.

[11]  Y. Liu, F. L. Sun, L. L. Luo, C. A. Yuan, and G. Q. Zhang, "Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate," (in English), Journal of Electronic Materials, vol. 44, no. 7, pp. 2450-2457, Jul 2015.

[12]  Y. Liu, F. L. Sun, H. Zhang, T. Xin, C. A. Yuan, and G. Q. Zhang, "Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes," Microelectronics Reliability, vol. 55, no. 8, pp. 1234-1240, Jul 2015.

[13]  Y. Liu et al., "Thermal and mechanical effects of voids within flip chip soldering in LED packages," Microelectronics Reliability, vol. 54, no. 9, pp. 2028-2033, 2014.

[14]  Y. Liu et al., "Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging,", Journal of Materials Science: Materials in Electronics, vol. 25, no. 11, pp. 4954-4959, 2014/11/01 2014

[15]  Y. Liu, J. Zhao, C. C.-A. Yuan, G. Q. Zhang, and F. Sun, "Chip-on-flexible packaging for high-power flip-chip light-emitting diode by AuSn and SAC soldering," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 11, pp. 1754-1759, 2014

[16]  H. Ye et al., "Electrical–thermal–luminous–chromatic model of phosphor-converted white light-emitting diodes," Applied thermal engineering, vol. 63, no. 2, pp. 588-597, 2014.

[17]  H. Ye, B. Li, H. Tang, J. Zhao, C. Yuan, and G. Zhang, "Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes," Microelectronics Reliability, vol. 54, no. 11, pp. 2448-2455, 2014.

[18]  M. Dong, J. Wei, H. Ye, C. Yuan, and K. Zhang, "Thermal analysis of remote phosphor in LED modules," Journal of Semiconductors, vol. 34, no. 5, p. 053007, 2013

[19]  C. Yuan, M. Erinc, S. Gielen, A. van der Waal, W. van Driel, and K. Zhang, "Thermo-mechanical model optimization of HB-LED packaging," Journal of Light & Visual Environment, vol. 35, no. 3, pp. 214-221, 2011.

[1]    C. A. Yuan, C. N. Han, H. M. Liu, and W. D. van Driel, "Solid-State Lighting Technology in a Nutshell," in Solid State Lighting Reliability, vol. 1, W. D. van Driel and X. J. Fan, Eds. (Solid State Lighting Technology and Application Series: Springer New York, 2013, pp. 13-41.

[2]    C. Yuan, W. D. van Driel, R. Poelma, and G. Q. Zhang, "The Mechanical Properties Modeling of Nano-Scale Materials by Molecular Dynamics," in Molecular Modeling and Multiscaling Issues for Electronic Material Applications, N. Iwamoto, M. M. F. Yuen, and H. Fan, Eds.: Springer US, 2012, pp. 115-131.

[3]    C. Yuan, W. D. van Driel, R. Poelma, and G. Q. Zhang, "The Mechanical Properties Modeling of Nano-Scale Materials by Molecular Dynamics," in Molecular Modeling and Multiscaling Issues for Electronic Material Applications, N. Iwamoto, M. M. F. Yuen, and H. Fan, Eds.: Springer US, 2012, pp. 115-131.

[1]    C. Yuan, S. D. M. de Jong, and W. D. van Driel, "AI-assisted Design for Reliability: Review and Perspectives," presented at the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024.

[2]    C. Yuan, "AI-based Adaptive Surrogate Modeling: A Future Performance Prediction Method Applied to UV-LED Modules," presented at the 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan, R.O.C., 2023. (Best Paper Award)

[3]    C. Yuan, J. Y. Wang, C. E. Lee, and K.-N. Chiang, "Equation Informed Neural Networks with Bayesian Inference Improvement for the Coefficient Extraction of the Empirical Formulas," presented at the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023.