Mechanisms
I developed next kinetic mechanisms for the numerical modeling of plasma chemical processes in the electrical discharges in different gas mixtures:
Low-pressure Ar/NF3 mechanism for semiconductor plasma processing (updated 2022/05/24)
Low-pressure c-C4F8 mechanism for semiconductor plasma processing (updated 2022/02/11)
Low-pressure mechanism of CF4/O2 plasma (updated 2021/06/01)
Reduced scheme of reactions for modeling of low-pressure SF6 plasma (updated 2014/01/10)
Kinetic mechanism for the modeling of ethanol plasma for the neutral gas temperature in the range 800-1500 K (updated 2011/08/10)
High temperature (300 - 2000K) kinetic mechanism of the discharge in the ethanol / water / air mixture (updated 2010/05/21)
Rate constants for chemical reactions in the discharge in the methanol / water / Ar mixture in the low temperature region (updated 2010/03/04)
Low temperature kinetic mechanism of the discharge in the ethanol / water / air mixture (updated 2008/07/25)
All content © Dmitry Levko