List of publications and conferences attended
REFEREED PUBLICATIONS
1. D. Sharma, S. B. Reddy, and P. Kumar, "Electromagnetic force induced fracture of pre-cracked thin metallic conductors," International Journal of Fracture, https://doi.org/10.1007/s10704-018-0299-2, 2018.
2. D. Sharma, S. B. Reddy, and P. Kumar, "Fracture of Pre-Cracked Metallic Conductors under Combined Electric Current and Mechanical Loading," International Journal of Fracture, https://doi.org/10.1007/s10704-018-0298-3, 2018.
3. D. Sharma, A. Jain, N. Somaiah, R. Sharma, P.R. Narayanan, P. Kumar, “Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material” Journal of Electronic Materials, 47, Issue 8, pp 4863–4874, 2018.
4. D. Sharma, R.K. Tiwari, R. Sharma, P.R. Narayanan, P. Kumar, “Two-Phase Metallic Thermal Interface Materials Processed through Liquid Phase Sintering followed by Accumulative Roll Bonding,”IEEE Trans. Compon. Pack., 6, Issue 1, pp 58–66, 2015.
5. N. Somaiah, D. Sharma, P. Kumar, “Electric Current Induced Forward and Anomalous Backward Mass Transport” Journal of Physics D Applied Physics, 49 20LT01, 2016.
6. Sil, A. A. Wagh, D. Sharma, R. Ranjan, and P. Anil Kumar, "On the inter-layer magneto-electric coupling in BiFeO3/SrRuO3 heterostructure," Applied Physics Letters, vol. 111, p. 102902, 2017.
7. P. Jagtap, S. K. Reddy, D. Sharma and P. Kumar, “Tailoring Energy Absorption Capacity of CNT Forests through Application of Electric Field” Carbon, vol. 95, pp 126-136, 2015.
CONFERENCES
1. D. Sharma and P. Kumar, “Synergistic Effect of Electromagnetic Forces On the Fracture of Pre-Cracked Thin Metallic Structures” 14th International Conference on Fracture (ICF 14), Rhodes, Greece, 18th-23rd June 2017.
2. Sharma and P. Kumar, “Transition of sharp crack propagation to blow hole formation in a pre-cracked thin conductor under short duration electric current pulses” NMD-ATM, Goa, India 11th - 14th November, 2017 (2nd Best contributory presentation award).
3. Sharma and P. Kumar, “Graphene Nano-Sheet Cu Embedded 2-Phase In-Cu Solders as Next Generation Thermal Interface Materials” IUMRS-ICYRAM, IISc, Bangalore, India, 11th-15th December, 2016.
4. D. Sharma, R.K.Tiwari and P. Kumar, “A Novel Two Step Processing Route for Fabricating 2-Phase Metallic Thermal interface Materials” IIM-NMD-ATM, Coimbatore, 13th-16th November, 2015.