Dr.K CHANDRAPPA

Professional Skills

Projects on Automation, Rapid Prototyping, Finite Element Analysis ,and FMS

Research Interest

CAD,CAM,ROBOTICS,AUTOMATION, NON-TRADITIONAL MACHINING,SUPERPLASTICITY AND DIFFUSION BONDING

Professional Experience

Joined SIT on 1-9-1989 as Lecturer and currently working as Associate professor

Administrative Experience

1. Deputy warden

(Ladies Hostel)

To look after hostel

One year

2. Deputy warden

(Transport )

To look after the maintenance of Vehicles

one year

3. Co-ordinator

VTU Valuation centre, Tumkur

three years

4. Proctor

To look after students welfare and guidance

Every semester

5. Placement officer

( Department )

To look after the placement and training programs

Two years

6. Co-ordinator

Halcyon and Spandana, a cultural events

Till date

7. Co-ordinator

Momentum , Departmental Technical event

Till date

8. Co-ordinator

Departmental work shop on Computer Aided Drafting (AutoCAD) 0ne week

Educational Qualification

Ph.D from JNTUA,Ananthapuram AP.

Conferences Organised/attended

Attended international conference at Government Engineering College ,Assam

Conferences/Workshops Attended

1. International Sympososium for research scholars at IITMadras, Chennai ,India.

2. FEA workshop –AICTE, at MGIT, Hyderabad.

3. Materials processing Technology, at MREC, Jaipur.

4. FEA -heat transfer and structures at KEC, Erode, Tamil Nadu.

5. ICMSET-13, @ London, United King Dom.

6. AMMMT-13, @SIT, Tumkur.

7. National Conference On science & Technology, Binseswar Brahma Engineering College, Chandrapara (Assam)

8. Residual Stress: key Challenges and Remedies at CPRI, Bangalore.

9. MEMS and Mechatronics @ IITMadras, Chennai.

Professional Membership

ISTE,IIM and Instion of Engineers

Subjects Engaged

CIM,CAD,CAM ,NTM ,MECHATRONICS,INDUSTRIAL HYDRAULICS AND PNEUMATICS

Research Publications

International Journal

§ K. Chandrappa, Joel Hemanth, Optimization of process parameters of Diffusing bonding of Titanium with Titanium and Titanium with Copper, “Advanced Materials Research Vol. 856 (2014) pp 153-158 Online available since 2013/Dec/06 at www.scientific.net © (2014) Trans Tech Publications, Switzerland doi:10.4028 www.scientific.net AMR. 856.153(Elsevier)

§ Mr. Suhas V, Mr. B H Vasudeva Murthy & Mr. K. Chandrappa “Investigation of Superplastic Deformation of Aluminium, Copper and Inconel 718 for Aerospace Applications “ ISSN 2349-2082 Volume: 01 Issue: 06 | Jun-2014, Available www.ijiminds.com

§ Hydrogen and Fuel Cells K. Chandrappa and Subham Kumar Shah, International Journal of Engineering Technology Science and Research IJETSR www.ijetsr.com ISSN 2394 – 3386 Volume 4, Issue 10 October 2017

§ This research work is applied for patent

§ Another paper is ready for the submission in the Materials Science and Engineering journal

Conference Proceedings

§ K. Chandrappa, S.S. Bhattacharya, “Modeling and simulation of the superplastic deformation” IITM,Chennai during International symposium for research scholar (ICSR-15)

§ K. Chandrappa, Joel Hemanth, “Superplasticity and superplastics deformation with diffusion bonding Titanium alloy sheets” SIT. Tumkur in AMMMT-13

§ K. Chandrappa, Joel Hemanth, Superplasticity and superplastics deformation with diffusion bonding Titanium alloy with other materials at SIT. Tumkur in AMMMT-13

§ K. Chandrappa, Joel Hemanth, “Optimization of Process Parameters of Diffusing Bonding of Titanium with Titanium and Titanium with Copper” ICMSET-17^th, 18th and 19^th November 2013 held under Science and Engineering Institute at London (United King Dom).

§ K Chandrappa, Amit kumar and Kumar Shubham ^“ Diffusion bonding of a titanium alloy to a stainless steel with an aluminium alloy interlayer “ at International conference on Advances in Mechanical Engineering held on 22^nd to 24^th March 2018 organized by SRM Institute of Science and Technology , Kattankulathur ,Chennai Tamil Nadu .This paper is awarded as best paper.