Screen printing is the most dominant technology used in solar cell industry for front and rare side metallization because of its high throughput. However, the utilization of silver is quiet high in screen printing compared to other methods and solar cell manufacturers through-out the globe are looking for alternate metallization technologies. In order to reduce the shadow loss in silicon solar cells, the finger width has to be narrowed down to <30 µm. High cost of silver paste and finger interruptions which generally arise during cell metallization process, module interconnections and lamination process are the major issues with existing conventional screen printing process, especially while fabricating high aspect ratio narrow-width finger lines. At PSGIAS, our group has developed cost-effective, silver-less fine-line width front contact metallization patterns for solar cells using nanoimprint lithography (NIL) and maskless lithography. As a part of this investigation, we have also developed a low cost, in-house nanoimprint lithography tool which can be successfully integrated with device manufacturing process of crystalline silicon solar cells. Based on our Finite Element Analysis (FEA) simulation studies, an optimized of solar cell front side metallization grid pattern was designed with which, the cell efficiency can be increased by ~1%, minimizing the shading loss. In this method, instead of using silver screen printing, Ni/Cu/Sn metallization was adopted for patterning metallization grids in silicon solar cells, as the conductivity of copper is comparatively equal to silver with a wider margin in the cost. Based on this method, significant reduction in the cost of the solar cell can be easily achieved with NIL/maskless lithography patterning of the fine-line width (<20 um) fingers in the metallization grids.