The CHIME Center

Vertically Integrated Artificial Intelligence for Sensing and High Performance Computing (VIAS)

This project aims to develop the next generation of detectors using 3D heterogeneous integrated circuits — devices that combine separately manufactured components like chips, chiplets and other components into a single package that, together, provide enhanced functionality.

These detectors work in challenging conditions and produce large amounts of data. Using advanced artificial intelligence hardware enables faster data analysis and quicker discoveries. The team is also developing new ways to build tiny, stacked, chiplet-based systems that combine multiple functions into small, efficient packages, boosting performance while saving space.

Principal Investigator: Farah Fahim