Outcomes

Journal Publications

[J1] Ming-Chun Lee, Christian Eckrich, Vahid Jamali, Yu-Chih Huang,  Arash Asadi, and Li-Chun Wang, “Robust and resilient networks with integrated sensing, communication and computation,” IEEE Commun. Mag., 2025, accepted. (arXiv)

[J2] Min Qiu, Ming-Chun Lee, Yu-Chih Huang,  and Jinhong Yuan, “Scaling law tradeoff between throughput and sensing distance in large ISAC networks,” IEEE Trans. Wireless Commun., 2025, accepted.

Conference Publications

[C1] Tzu-Chiang Chiu, Ming-Chun Lee, and Ta-Song Lee, “Deep unfolding learning-based beamforming design for multi-user MIMO-OFDM integrated sensing and communication systems,” IEEE GLOBECOM, Dec. 2025.

[C2] Min Qiu, Ming-Chun Lee, Yu-Chih Huang*,  and Jinhong Yuan, “On the scaling law tradeoff of integrated sensing and communication networks,” IEEE ISIT, 2025.

Invited Talks

[T1] “Tutorial: MIMO-OFDM ISAC Systems: Fundamentals, Recent Advances, and Opportunities," APNOMS 2025, Sep 2025 (Presented by Ming-Chun Lee)

[T2] “Recent advances on the design of MIMO-OFDM ISAC systems," University of New South Wales, July 2025 (Presented by Ming-Chun Lee)

[T3] “AI-empowered perceptive wireless networks," University of Technology Sydney, July 2025 (Presented by Yu-Chih Huang)

[T4] “On the scaling law tradeoff of integrated sensing and communication networks," TU Darmstadt, Jan. 2025 (Presented by Yu-Chih Huang)

Honor

[H1] Li-Chun Wang, Electrical Engineering Medal (Academic Research Category), The Chinese Institute of Electrical Engineering (CIEE), Oct. 2025. 

[H2] Ming-Chun Lee, Outstanding Young Electrical Engineer Award, The Chinese Institute of Electrical Engineering (CIEE), Oct. 2025. 

Workshop

[W1] Workshop on Next-Generation Integrated Sensing and Communications ( Speakers: Emanuele Viterbo, Yi-Hong, Yu-Chih Huang, Ming-Chun Lee, Shao-Yu Lien, Po-Chih Chen, and Aamer Mohamed Huroon), Dec. 2025.

[W2] NYCU-UTS Joint Workshop on Next-Generation Wireless Systems (Speakers: Kai-Ten Feng, Yu-Chih Huang, Ming-Chun Lee, Andrew Zhang, Diep Nguyen, Hoang Ding, and Ying He), Dec. 2025.

Patents

[P1]