• Ph.D 1985~1988 Department of Electrical Engineering University of Maryland, College Park, Maryland, USA

• MS. 1983~1985 Department of Electrical Engineering University of Maryland, College Park, Maryland, USA

• BS. 1977~1981 Department of Material Science and Engineering National Tsing-Hua University, Taiwan, R.O.C.

• 2001/02~present,   Department of Electronic Engineering, I-Shou University, Kaohsiung, Taiwan,   Professor,   Teaching and research. Leader of VLSI and Packaging Design laboratory. 

• 2010/07~2010/12,   National Chiao Tung University,   Visiting Professor,   Visiting Professor

• 1992/08~2001/02,   Department of Electronic Engineering, I-Shou University, Kaohsiung, Taiwan,    Associate Professor,    Teaching and research

• 1990/04~1992/07,   Integrated Microcomputer System Inc., Maryland, USA,   System Engineer,   System Development                     

• 1988/10~1990/04,   Brimrose of America, Baltimore, USA,   Scientist,   IR System Development

• 1983/09~1988/12,   University of Maryland, College Park, Maryland,   Teaching and Research assistant,   Teaching and Research 

1. Machine Learning 

2. Computer-Aided-Design/Software System Development and Analysis

3. System-on-Chip Design/VLSI Design/ System-in-Package Design

4. RFID/WSN Security Analysis and Implementation

5. Nano/Microelectronic Devices and Characterization

6. Flexible Electronics Applications

1. Pan Pacific Microelectronics Symposium, Hawaii, USA/ TPC member (2005 ~ Present)

2. IMPACT Taipei, Taiwan/organization committee, 2009~Present

3. 2011 Engineering, Medicine and Biology Applications Symposium/ organization committee

4. SMTA Taiwan Chapter/ Secretary General, 2008~2021

5. International Advisory Board of International Symposium on Microelectronics and Packaging (ISMP), 2015- present

6. 2015 IEEE Electrical Design of Advanced Packaging & Systems Symposium (IEEE EDAPS 2015) Steering, Advisory and Technical Program Committee Members

• Referred Journal Papers

1. Tzu-Lun Yuan, Mong-Na Lo Huang and Yu-Jung Huang (2020, Dec), "Placement Design for a Stacked Die Package With Reliable Wireless Connections," IEEE Transactions on Reliability, Vol. 69, no. 4, Dec 2020, pp. 1230 – 1238, doi: 10.1109/TR.2020.2980904.

2. Shao-I Chu, Chen-En Hsieh, Yu-Jung Huang, "Design of FSM-based Function with Reduced Number of States in Integral Stochastic Computing", IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 27, no. 6, pp. 1475-1479, 2019.06

3. Yu-Jung Huang, Chung-Long Pan, Shin-Chun Lin, Mei-Hui Guo, "Machine Learning Approach in Detection and Classification for Defects in TSV-Based 3D IC", IEEE Transactions on Components, Packaging and Manufacturing Technology, IEEE Transactions on Components, Packaging and Manufacturing Technology , vol. 8, no. 4, pp. 699 - 706, 2018.04

4. I-Chih Wu, Yu-Jung Huang, Min-Haw Wang, Ling-Sheng Jang, "Characteristics of Lock-in Thermography Signal from Solder Bump Cracking in Wafer-level Chip Scale Packaging for Internet of Things Applications", Sensors and Materials, vol. 30, no. 4(2), pp. 833-843, 2018.04

5. Shao-I Chu, Yu-Jung Huang, Wei-Cheng Lin, "Authentication Protocol Design and Low-Cost Key Encryption Function Implementation for Wireless Sensor Networks", IEEE Systems Journal, vol. 11, no. 4, pp. 2718-2725, 2017.12, Impact Factor: 3.882, Rank Factor: 11/146

6. Yu-Jung, Huang, Chung-Long, Pan, Mei-Hui, Guo, "Defect Detection for 3D Through Silicon via Based on Machine Learning Approach", Nanoscience and Nanotechnology Letters, vol. 9, no. 8, pp. 1175-1179, 2017.08, Impact Factor: 1.889, Rank Factor: 133/275

7. Yu-Jung Huang, Mei-Hui Guo, Cheng-Han Chua, "Differential Pad Placement Design of a Capacitive Coupling-Based Stacked Die Package", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 7, pp. 1035-1042, 2017.07, Impact Factor: 1.581, Rank Factor: 139/262

8. Yu-Jung Huang, Chung-Long Pan, Po-Ying Chen, and Shen-Li Fu, “Micro-Pattern Fabrication for Medical Device Applications”, Nanoscience and Nanotechnology Letters, vol. 7, no. 12, pp. 974-979, 2015.12, Impact Factor: 1.889, Rank Factor: 133/275

9. Yu-Jung Huang, Ming-Kun Chen, Yi-Lung Lin, Shen-Li Fu, "Fabrication and characterization of low-cost ultrathin flexible polyimide", Microelectronics Reliability, vol. 55, pp. 1248-1255, 2015.08,(published online)

10. P.-Y. Chen, C.-C. Chen, W.-K. Yeh, Y. Chang, D.-C. Huang, S.-S. Yu, C.-S. Tsai, Y.-J. Huang, W.-C. Lin, S.-I Chu, C.-L. Pan, "Using Capacitance Sensor to Extract Characteristic Signals of Dozing from Skin Surface", Journal of Sensors, vol. 2014, pp. 1 -7, 2014.11

11. Ming-Kun Chen, Yu-Jung Huang, Chi-Chan Cheng, , Yi-Lung Lin, Shen-Li Fu, "Failure analysis of EOS-induced damage at final electrical testing", Journal of Materials Science: Materials in Electronics, Vol. 25, Issue 2, vol. 25, no. 2, pp. 596 - 603, 2014.02

12. Shao-I Chu, Chih-Yuan Lien1, Wei-Cheng Lin, Yu-Jung Huang, Chung-Long Pan, Po-Ying Chen, "Relative Location Estimation over Wireless Sensor Networks with Principal Component Analysis Technique", Advances in Intelligent Systems and Computing,, vol. 238, pp. 221-230, 2013.09

13. Yu-Jung Huang, Wei-Cheng Lin, Hung-Lin Li, "Efficient Implementation of RFID Mutual Authentication Protocol", IEEE Transactions On Industrial Electronics, vol. 59, no. 12, pp. 4784 - 4791, 2012.12

14. Hsien Chiao Teng, Shen Cherng, Yu-Jung Huang, "A Novel Design Of Organic Semiconductor Thin Film Device Embedded Microstrip Antenna", Microwave and Optical Technology Letters, vol. 53, no. 11, pp. 2569 - 2572, 2011.11

15. Yu-Jung Huang, Senior Member, IEEE, Ching-Chien Yuan, Ming-Kun Chen, Wei-Cheng Lin, and Hsien-Chiao Teng, “Hardware Implementation of RFID Mutual Authentication Protocol,” Vol. 57, Issue 5, IEEE Transactions on Industrial Electronics., May, pp. 1573 – 1582, 2010. Impact Factor: 4.678, Rank Factor: 3/245

16. Ming-Kun Chen, Cheng-Chi Tai, and Yu-Jung Huang,“Nondestructive Analysis of Interconnection in Two-die BGA Using TDR,” IEEE Transactions on Instrumentation and Measurement, Vol. 55, No. 2, April, pp. 400 – 405, 2006.

17. K. C. Hung, Y. S. Hung, and Y. J. Huang, “A non-separable VLSI architecture for 2D discrete periodized wavelet transform,” IEEE Trans. On VLSI systems, Vol. 9, N0. 5, pp. 565-576, 2001. Impact Factor: 4.678, Rank Factor: 3/245

18. K. C. Hung, Y. J. Huang, J. M. Guo, and T. K. Troung, “The Advanced OCA for 2-D Discrete Periodized Wavelet Transformation,” IEEE Trans. On Signal Processing, Vol. 47, No. 10, pp. 2874-2878, 1999.

• Patent

United State Patent

1. Yu-Jung Huang, Mong-Na  Lo Huang, Tzu-Lun Yuan, Mei-Hui Guo, "Method And Electronic Device For Configuring Signal Pads Between Three-Dimensional Stacked Chips", US11,748,545B2, 2023.09.05

2. Yu-Jung Huang, Chung-Long Pan, Mei-Hui Guo , “Defect Detection Method For Multilayer Daisy Chain Structure And System Using The Same”, US10,776,559B2, 2020.09.15~2037.05.25

3. Yu-Jung Huang, Yan-Cen Liou “Chip-To-Chip Signal Transmission System And Signal Reception Circuit”, US10,422,831B2，2019.09.24~2037.09.26

4. Yu-Jung Huang, Chung-Long Pan, Shin-Chun Lin, Mei-Hui Guo, “Defect Detection Method For 3D Chip And System Using The Same”, US10,303,823B2, 2019.05.28

5. Yu-Jung Huang, Mei-Hui Guo, “Chip-to-Chip signal transmission system and method for arranging chips thereof”, US10,063,282B1, 2018.08.28

6. Yu-Jung Huang, Hsuan-Hsun Wu, "Wireless Sensor Network And Central Node Device Thereof", US 9374706B2, 2016.06.21

7. Yu-Jung Huang, Ming-Kun Chen, Kai-Jen Liu “Chip-To-Chip Singal Transmission System And Chip-To-Chip Capacitive Coupling Transmission Circuit”, US9,274,167B2, 2016.03.01.

8. Yu-Jung Huang, Hsuan-Hsun Wu “Wireless Sensor Network And Central Node Device Thereof”, US 9060265B2, 2015,06,16

9. Chun-Wei Huang, Yu-Jung Huang, Ming-Kun Chen, "Signal Transmission System And Signal Transmission Circuit" , US 8913687B1, 2014.12.06

中華民國發明專利

1. 黃有榕 劉彥岑， "晶片間訊號傳輸系統與訊號接收電路" ，發明第I630801 號， 2018.07.21

2. 黃有榕 郭美惠， "晶片間訊號傳輸系統及其晶片配置方法" ，發明第I626721號， 2018.06.11

3. 黃有榕、黃威翰， "中介層結構及其製造方法" ，發明第I613781號， 2018.02.01

4. 黃有榕、潘宗龍、林仕鈞、郭美惠， "適用於三維晶片的缺陷測試方法及系統" ， 發明第 I606531 號， 2017.09.28

5. 林倍如、黃有榕、柯清邁， "非矩形基板之電子元件配置方法" ， 發明第I545454號， 2016.08.11

6. 黃有榕、陳明坤、劉凱仁， "晶片間信號傳輸系統及晶片間電容耦合傳輸電路"， 發明第I493666號， 2015.07.21

7. 黃俊瑋 黃有榕 陳明坤， "訊號傳輸系統與訊號傳輸電路" ， 發明第I492554號， 2015.07.11

8. 袁境鍵 黃有榕， "無線射頻裝置" ， 發明第I441502號， 2014.06.11

9. 黃有榕 葉家豪， "辨識標籤和射頻辨識系統"， 發明第I407307 號， 2013.09.01

10. 林倍如 黃有榕 陳明坤， "具監控功能之醫用紗布回收裝置" ，發明第 I391123號， 2013.04.01

11. 黃有榕 袁境鍵， "系統匯流排之仲裁裝置" ， 發明第I385528號， 2013.02.11

12. 黃有榕 陳育宏， "可調式之匯流排混合演算法仲裁器模組" ，發明第I376604號， 2012.11.17

1. 20120801~20210731 具頻率感知的堆疊式晶片擺置設計 Stacked Die Placement Design with Frequency Awareness (109-2221-E-214-025-)

2. 20120801~20210731採用亂數共享技術之隨機計算為基礎的多項式計算與應用(109-2221-E-992-080-)

3. 20190801~20200731 隨機計算元件設計與應用Design and Application of Stochastic Computing Elements (108-2637-E-992-010-)

4. 2018/08/01~2019/07/31 基於強化學習的神經網絡之設計與實現Design and Implementation of neural network based reinforcement learning MOST 107-2221-E-214-027 -

5. 2015/08/01~2018/07/31 無線可穿戴式關節醫療電子裝置研發與試驗The development of wireless wearable medical electronics components and apparatus MOST104-2632-E-214-002

6. 2014/08/01~2016/07/31 2.5D/3D堆疊晶片糸統測試電路之研發The development of test circuits for 2.5D/3D stacked dies system MOST 103-2221-E-214 -054 -MY2

7. 2013/08/01~2014/07/31 3D 高速電容耦合晶片通訊技術之研發The research and development of 3D capacitive coupling for high speed chip to chip communication NSC102-2221-E-214-057-

8. 2012/08/01~2013/07/31 高速晶片間電容耦合通訊介面技術之研發The development of high-speed chip-to-chip communication interface technology NSC101-2221-E-214-077-

9. 2011/8/1~2012/7/3 非接觸鄰近晶片間高速通訊介面技術設計之研究The study of contactless high-speed chip-to-chip communication interface design NSC101-2221-E-214-077-

1. 2008/08/01 ~ 2009/07/31 必達科技股份有限公司
   以無線射頻辨識技術為主情境感知定位系統之開發

2. 2012/04/01 ~2012/12/31 日月光半導體製造股份有限公司
   3D晶片間高速通訊介面技術開發計畫 101-IND-45-

3. 2013/04/01 ~ 2013/09/30 台灣福雷電子股份有限公司
   微間距空間轉換器介面設計技術開發 102-IND-35

4. 2013/12/15 ~ 2014/06/15 台灣福雷電子股份有限公司
   內連線微間距空間轉換器設計技術開發 102-IND-115-

5. 2017/03/01 ~ 2017/12/31 雲義科技
   大數據顧問諮詢 ISU106-IND-31

6. 2019/03/01 ~ 2020/02/01義大醫院
   基於深度學習之醫學圖像處理EDAH-AI-107-001

7. 2020/08/01 ~2021/07/31義大醫院
   基於深層信念網絡的自發性腦出血患者30天死亡率分析

8. 2020/08/01 ~ 2021/07/31義大醫院 EDDHM109002
   利用數位聽診器，以心雜音診斷先天性心臟病