Research Facility

Basic Facilities

Wet Bench

Yellow Room

Muffle Furnace

Horizontal Tube Furnace

Plasma Treatment

Deposition Facilities

Thermal Evaporation System

Make: Advance Process Technology
No. of Source: 3
The system is equipped with a turbomolecular pump with a load lock chamber facility. It is provided with three source boats for material evaporation along with two power supplies.
Substrate rotation and height adjustment setup with a thickness monitoring system is integrated with the system. The system is used for the evaporation of metals like Aluminium, Gold, Copper, Nickel, Chromium etc to form metal contact.

RF-DC Magnetron Sputtering

Make- Excel Instruments No. Of Magnetron Gun: 4
The system is equipped with a turbomolecular pump with a load lock chamber facility. It is provided with 1 RF and 2 Dc supplies along with substrate heating up to 650°C. Substrate rotation and height adjustment setup with an arrangement of two different process gas flows. The system is in use for the deposition of metal oxide and metal thin films.

Thermal Chemical Vapor Deposition System (CVD)

Make- Metrex Scientific Instruments Temperature Range- Upto 1100°C

This three-zone CVD system is equipped with programmable heating arrangements and three rotameters for controlled gas flow. The system is provided with a rotary pump to evacuate the tube before deposition. A mass flow controller unit is also attached to the system for precise control of process gas during deposition.
The system is in use for the deposition and growth of nanostructured TMDC and metal oxide thin films.

LPCVD

Metal Sputtering

Spin Coating

Patterning Facilities

UV Lithography

Make- SUSS Microtech Model- MJB4

The MJB4 Mask Aligner can perform contact UV exposures for a variety of sample and mask sizes. Sample sizes that can be accommodated range from small pieces to 4-inch wafers.
It can be used with masks of up to 5 by 5 inches.
The maximum combined thickness of the substrate and mask is 9 mm. The achievable position alignment accuracy is ~1 μm. The MJB4 allows 1 um resolution in vacuum contact mode. The tool has 5 different contact modes (proximity, soft, hard, low vacuum, and vacuum), and three different exposure modes (flood, first, and align and expose.