Welcome to Translational Soft Devices Lab!
Announcements
첨단 반도체 패키징 및 CMP 연구 분야 대학원생·학부 인턴 모집
김민구 교수 연구실에서는 첨단 반도체 패키징 및 CMP(Chemical Mechanical Planarization) 공정 분야의 연구에 참여할 대학원 진학 희망자 및 학부 인턴 연구원을 모집합니다.
관심 있는 학생들의 많은 지원 바랍니다.
자세한 내용은 [기계공학부 홈페이지 모집 공고]를 참고해 주세요.
Please contact Prof. Min Ku Kim (mkim1618@hanyang.ac.kr)
Our research group is located at the School of Mechanical Engineering at Hanyang University. We are dedicated to transforming phenomena across diverse fields into data for real-time analysis, focusing on developing multimodal sensors optimized for specialized environments, monitoring systems, and beyond. Through these efforts, we aspire to pioneer next-generation innovative technologies by innovating materials, manufacturing processes, and system integration while expanding potential applications in multiple areas. In addition, we aim to advance high-reliability sensor technologies designed to maximize the trustworthiness and accuracy of data used in machine learning (ML), driving progress toward a new era of intelligent solutions.