Jun Mizuno Ph.D
Professor
National Cheng Kung University
Academy of innovative Semiconductor and Sustainable Manufacturing
Biography
Waseda University, Japan
Former Professor of Research Organization for Nano & Life Innovation,
Kyushu University, Japan
Former Visiting Professor of Advanced Graduate Course on Molecular Systems for Devices
Hamamatsu University School of Medicine, Japan
Former Visiting Professor
Education
Doctor of Engineering, Tohoku University
Research Interests
MEMS, Nano and micro fabrication, Electronics packaging, Surface modification and Bio compatible materials. My goal is to construct this “Science of Nano and Micro Devices”, and it won’t be possible unless I establish these five main technologies, MEMS, Nano and micro fabrication, Electronics packaging, Surface modification, and Bio compatible materials.
Background
Dr. Mizuno received his PhD in engineering from Tohoku University, where he conducted research on silicon capacitive sensors that can simultaneously detect acceleration and angular acceleration. Since then, he has been conducting research on organic EL using liquid semiconductors, SAW devices using low-temperature bonding technology, 3D electronics packaging technology, low-damage surface treatment machines, and recently, implant materials and regenerative medicine of epithelial mucosa in collaboration with medical engineering.
|D24 | 米恒慶
(1) Reliability Design for TGV Structures
(2) Design of Load-Bearing Biocompatible Polymers
(3) Pretreatment for reliable hybrid bonding
|D25 | Lokesh Selvi Palanisamy
m58147019@gs.ncku.edu.tw
(1) Investigation of pretreatment method & reliability of ultra-fine pitch size hybridbonding
(2) Molecular synthesis & studies of dielectric materials for hybrid bonding
|M26 | Nguyen Duy Quang/ 阮維光
(1) Low-temperature dielectric bonding and Electrical reliability for Advanced Packaging
|M26 | Sai Asrith Boppudi/白賽恩
m36157030@gs.ncku.edu.tw
(1) Microfluidic channel & Thermal dissapation
|M26 | Guhan Ravi
|M26 (Pre-Masters) | 陳聲皓
e64126024@gs.ncku.edu.tw
(1) Design of Load-Bearing Biocompatible Polymers
(2) Thermal dissapation of high-power device
|M26 (Pre-Masters) | 袁益軒
e64126024@gs.ncku.edu.tw
(1) Investigation of pretreatment method & reliability of ultra-fine pitch size hybridbonding
| Year |Name |Email |Current Position | Previous Study
|B22 |董宇晟 | terry900926@gmail.com | Engineer in TSMC
|B22 | 洪麒富 | e54092126@gs.ncku.edu.tw | Engineer in TSMC
|B22 | 黃阡碩 | tiffany03111013@gmail.com | Engineer in TSMC
|B24 | 余東運 | eric5988943@gmail.com | Master student in MSE, NCKU
|B24 | 黃宏儒 | |
|B24 | 呂昶佑 | | Master student in MSE, NTU
|M24 | 羅宇浩 | m56134052@gs.ncku.edu.tw | Engineer in TSMC | Microfluidic Channel & Thermal Dissapation
|M24 | 褚尉臣 | willy7891235@gmail.com | | Hydogen Production
|M24 | Kapa Keharika | M26137046@gs.ncku.edu.tw | Engineer in ASE | High-Frequency AiP Design