指導教授
李驊登 名譽教授
學 歷:西德阿亨工業大學(RWTH Aachen)冶材所博士
信 箱:htlee@mail.ncku.edu.tw
研究室:教授室(91705室)、實驗室(91901室)
聯絡電話:0933-587-780
專 長:機械測試分析、電子顯微鏡分析、工程材料、破損分析、機 械製造、金屬學、鋼鐵材料、顯微分析、先進製程
國立成功大學 特聘教授 2005-
國立成功大學 機械系、所 教授 1991/8-
中鋼結構股份有限公司 獨立董事 2017-
財團法人工業技術研究院 特聘研究 2017/1-
穎明工業股份有限公司 首席技術顧問 1986-
聯大物業機構 監察人 2016-
經濟部工業局(SBIR) 審查委員/主審 2004-
日本 北海道大學 (Hokkaido University) 客座研究 2013/7-/9
日本 京都大學 (Kyoto University) 客座研究 2012/7-/11
德國 阿亨工業大學(RWTH Aachen) DAAD獎助客座 2010/6-/9
GEORGIA :Shota Rustaveli Nat. Sci. Found.(SRNSF of GEORGIA) 審議委員 2011-
國立成功大學 校務發展委員會 委員 89,90,103,104,110學年度
台灣金屬熱處理學會 常務理事/理事 1999-2001/1994-
國立成功大學 儀器設備中心 主任 2002/8-2005/7
(國科會) 成大貴儀中心 主任 2002/8-2005/7
中國材料學會破壞科學委員會 委員 1990-
國立成功大學 慶齡工業技術研究發展中心 評議委員 2000-2003
台南區車鑑會 鑑定委員 1998-2004, 2006-
日本 東京工業大學 (Tokyo Institute of Technology) 客座 2002/6-/9
國立成功大學 慶齡工業技術研究發展中心 副主任 1994/8-1999/7
中國機械工程學會高雄分會(44/45,50/51屆) 理事 1999, 2005
澳洲 南澳大學(University of South Australia) 客座研究 1999/1-/2
德國 阿亨工業大學(RWTH Aachen) 客座研究 1997/6-/9
中國礦冶工程學會冶金委員會 委員 1997-
國科會台南貴儀中心 指導教授 1986-
德國 丹斯泰大學(Darmstadt University) 客座研究 1988/8-/10
金屬工業研究發展中心 諮議委員 1990-1996
德國 阿亨工業大學電子顯微鏡實驗室 研究助理 1981/2-1984/6
聯勤 206 廠 機械工程官 1978/1-1979/5
顧問輔導廠家:穎明工業(YM) 技術顧問(1986-)、朋程公司(Actron Tech.)(2014)車用發電機二極體開發、榮剛材料科技(GMTC) (1992-) 技術顧問,新鋼材開發及鎳基718超合金研發之技術指導 、中華汽車(CMC) 汽車零件破損分析實務指導、永大機電(YT) 蝸桿蝸輪生產線及開發相關技術、中國上海吉亿电机變速箱渦輪渦桿製程最佳化及鏈輪軸分析,永磁馬達磁性材料開發 、丹麥Ansaldo-Volund 焚化爐場地下鋼管A312TP316L分析、台朔重工(齒輪廠) 風力發電增速齒輪箱開發案、中興電工 鋼材規範與8620鋼材熱處理技術指導、台灣金鋒沙灘車技術分析 、工研院台中分院(亞崴、程泰、台中精機、永進、百德、大立) 新世代工具機結構材料選用與規範研究 、桂盟鍊條分析、工研院南分院之高性能鎳基合金次微米細晶製程開發、日揚公司閥材質分析研究案、百朝硬化齒輪分析、陸航指揮部 、勞委會、金屬中心、富士康、工研院、燁輝、振法、農廳...等單位 。
2006年國際學術交流召集人(Taiwanese–German Symposium):擔任「台德工業材料最新發展趨勢與應用研討會」台灣方面召集人以及國內外研討會之主持人,如:Technical Committee member, EPTC Singapore(2009)/ The 5 th International Conf. on Fracture & Strength of Solids, Tohoku University, Sendai, Japan (2003), /IEEE EMAP 2002 conference, (Kaoshiung),/ 中華民國第六屆破壞科學研討會年會年會副主任委員(2004)/,中國機械工程年會(CSME)/、中國材料科學年會(CSMS)/、破壞科學研討會年會/、熱處理研討會/、等。
國內外期刊審查委員(Reviewer):
Acta. Scripta./
ASME J. of Electronic Package /
Applied Surface Science/
Corrosion Science/
J. of Electronic Materials, /
J. of Material Science, Tribology/
J. of Alloys and Compounds/
J. of Machine Tools and Manufacture/
J. of Materials Processing Technology/
J. of Manufacturing Processes/
Materials Research Bulletin/
Microelectronic Reliability/
Soldering & Surface Mount Technology/
Surface and Coatings Technology, ..等
學術榮譽獎勵:
*2014: Paper Award,Taiwanese Society for Metal Heat Treatment. (TSMHT)
" Low Cycle Fatigue of Sn-xAg-0.7Cu Lead-Free Solder Joints."
*2013: Outstanding Engineering Professor, Chinese Institute of Engineers-Kaohsiung Chapter
*2012: Plenary Speaker, The 7th Intl. Conf. on Advanced Materials Processing Jun.24-27, 2012, Taipei, Taiwan " Title: Laser Application on Rejuvenation of the Decayed Materials in Nuclear Industry "
*2011: 100年度原子能科技學術合作研究優質計畫成果, (NSC Project)
"雷射表面重熔處理改善異材銲件沿晶應力腐蝕劣化防制技術研究" [NSC 100-2623-E-006-005-NU]
*2011: Peer Reviewer, Shota Rustaveli National Science Foundation (SRNSF) of GEORGIA
*2011: 中華民國防蝕工程學會2011年論文研討會海報獎(CEA)
" Characteristic study of stress corrosion cracking resistance of alloy 690 weldments "
*2010: 獲德國學術交流協會2010年獎助- 德國DAAD訪問學者,
*2010: 99年度原子能科技學術合作研究優質計畫成果, (NSC Project)
"不銹鋼銲件沿晶應力腐蝕劣化防治技術研究" [NSC 99-NU-E-006-001-]
*2010: 臺灣金屬熱處理學會2010年論文研討會論文獎-佳作. (TSMHT)
" Influence of lanthanum additions on the microstructure and refined mechanism of the Sn-3.5Ag solder "
*2010: 臺灣金屬熱處理學會2010年論文研討會論文獎-第二名.(第一名從缺). (TSMHT)
" Process for developing ultra-fine grain and the high temperature characteristics of nickel base superalloy"
*2009: 獲國科會補助1000萬及成大卓越計畫補助1050萬(共2050萬)建置Zeiss高解析掃瞄電子顯微鏡(SEM)
*2009: 臺灣金屬熱處理學會2009年論文研討會海報獎. (TSME)
" Influence of δ Phase Formation on Static Recrystallization of Inconel 718 "
*2008: 中國材料學會破壞科學研討會九十七年度傑出論文獎(CSMS)
" The study of Residual Stress and Intergranular Corrosion in Butting Weldments of Inconel 690 Alloy by GTAW and LBW Processes”
*2008: 臺灣金屬熱處理學會九十七年年會研討會海報獎(TSMH)
" Effect of aging time on mechanical properties of Sn-3Ag-2Sb-xIn Lead-free Solder "
*2006: 臺灣金屬熱處理學會九十五年年會論文獎. (TSMH)
" Susceptibility Study of Surface Cracking by EDM Process "
*2006: Distinguished Professor, Natl. Cheng-Kung University (NCKU)
*2004:中國材料學會破壞科學研討會九十三年度傑出論文佳作獎(CSMS)
“Reliability Study of Sb Addition on Sn-Ag-xSb Lead Free Solder”
*2004: 中華民國銲接協會九十三年度最佳學術論文獎第一名(TWS)
"TEM Investigation of EB Dissimilar Welding of Nickel Base Alloy “.
*2003: 中華民國銲接協會九十二年度學術論文海報競賽第一名(CWS)
"TEM Investigation of EB Dissimilar Welding of Nickel Base Alloy “.
*2002: 中國材料學會破壞科學研討會九十一年度傑出論文獎(CSMS)
“Influence of Interfacial Intermetallic Compound on Fracture Behavior of Solder Joints”
*1991: 教育部八十年度大學教師教學特優獎 Education of Ministry, ROC
*1991: 中國工程師學會八十一年度工程論文獎(CSE)
"Study of Thermoelastic Effect in Metallic Materials." Journal of CSME, Vol.12,No.5, pp.481-488
*1990: 機械月刊七十九年年度論文特優獎-金筆獎
"Formability and Limit Diagram of Sheet Metal Forming." Vol.11,pp.106-114 & Vol.12, pp.216-234(1990)
*1989: 機械月刊七十八年年度論文特優獎-金筆獎
"Defects and Failure Analysis of Sheet Metal Forming."Vol.15,No.11,pp.145-155(1989)
*1989: 中國機械工程學會七十九年年會論文獎(CSME)
"Study of the Effect of Induction Surface Hardening on AISI 1045 Mild Carbon Steel."
Journal of CSME, Vol.10,No.5,pp.365-373(1989).
高引用之期刊論文:(Cited >50)
1.“Relationship between EDM Parameters and Surface Crack Formation,” Journal of Materials Processing Technology, Vol. 142, Issue 3, 2003, pp. 676-683 (SCI.,EI) [http://dx.doi.org/10.1016/S0924-0136(03)00688-5] 引用390次
2."Influence of Interfacial Intermetallic Compound on Fracture Behavior of Solder Joints," Material Science and Engineering A, A358, pp.134-141 (SCI,EI) [http://www.sciencedirect.com/science/article/pii/S0921509303002776] 引用286次
3.“Influence of Intermetallic Compound on Adhesive Strength of Solder Joint,” Material Science and Engineering A, A333 (2002), pp.24-34.(SCI.,EI) [http://dx.doi.org/10.1016/S0921- 5093(01)01820-2], 引用174次
4.“Study of Surface Integrity Using the Small Area EDM Process with a Copper-Tungsten Electrode”. Material Science and Engineering A. 364(2004) pp.346-356. (SCI,EI) [http://dx.doi.org/10.1016/j.msea.2003.08.046] 引用173次
5.“Reliability of Sn-Ag-Sb lead-free solder joints.” Materials Science and Engineering A. 407(2005) pp.36-44 (SCI,EI) [http://dx.doi.org/10.1016/j.msea.2005.07.049], 引用119次
6."Shear strength and interfacial microstructure of Sn-Ag-xNi/Cu single shear lap solder joints" Material Science and Engineering A. 444 (2007) pp.75–83. (SCI,EI),IF:1.457, [http://dx.doi.org/10.1016/j.msea.2006.08.065], 引用95次
7.“Effects of Filler Metal Composition on Joining Properties of Inconel Alloy Weldments,” Mater. Sci. & Eng. A, A338, pp.202-212.(SCI,EI). [doi:10.1016/S0921-5093(02)00063-1], 引用 85次
8.“Characteristic Analysis of EDMed Surface Using the Taguchi Approach,” Materials and Manufacturing Process. Vol.15. No.6. pp.781-806.(SCI,EI). 引用81次
9.”Dissimilar welding of nickel-based alloy 690 to SUS 304L with Ti addition” Journal of Nuclear Materials, 335 (2004) pp.59-69 (SCI.,EI) [http://dx.doi.org/10.1016/j.jnucmat.2004.06.004], 引用79次
10."Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints" Material Science and Engineering A: 419 (2006) pp.172–180 (SCI,EI) [http://dx.doi.org/10.1016/j.msea.2005.12.021], 引用72次
11.“Characteristics of Dissimilar Welding of Alloy 690 to 304L stainless steel,” Science and Technology of Welding and Joining, Vol.6, No.4,( 2001),pp.225-234.(SCI). [https://doi.org/10.1179/136217101101538811] 引用59次
12.”The effects of peak temperature and cooling rate on the susceptibility to intergranular corrosion of alloy 690 by laser beam and gas tungsten arc welding.” Corrosion Science, 51,(2009) pp.439-445. IF=2.293, [http://dx.doi.org/10.1016/j.corsci.2009.01.002] 引用55次
13.“ Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints.” Journal of Electronic Materials. Vol. 33, No.9.(2004) pp.1048-1054 (SCI,EI) [DOI: 10.1007/s11664-004- 0034-9] , Cited: 53次
Publication List :
C.-Y. ho , H. Cheng, Y.-C Chang, and H.-T. Lee” Investigation of Various Bumps and Redistribution Lines to Inhibit Protected Silicon Nitride Cracks in High Pattern Density Chip Package, Journal of ELECTRONIC MATERIALS, Vol. 49, No. 9, 2020, pp.5613-5621 (SCI,EI) https://doi.org/10.1007/s11664-020-08310-8
Lai, C.-T.; Lai, H.-H.; Su, Y.-H.F.; Huang, F.-Y.; Lin, C.-K.; Kuo, J.-C.; Lee, H.-T. 2019 “The Influence of Mg-Based Inclusions on the Grain Boundary Mobility of Austenite in SS400 Steel.” Metals 2019, 9, 370. (SCI,EI) https://doi.org/10.3390/met9030370
H.-T. Lee、and C.-C. Lin 2019 “Enhanced Cell Proliferation on Biomedical Titanium Surfaces by Laser Ablation Induced Micro- and Nanoscale Hybrid Structures” Materials Transactions, Vol. 60, No. 9 (2019) pp. 1799-1806 Special Issue on Latest Research and Development of Structural and Functional Titanium-Based Materials (SCI,EI) [doi:10.2320/matertrans.ME201909]
洪瑞隆、枋敬賀、黃韻倫、楊敦煜、李驊登*2019"Ni 添加對Sn-1.5Ag-0.7Cu 無鉛銲料低週疲勞特性之研究",金屬熱處理143 (2019) pp.39-54,
張宏澤、李驊登*、梁祐誠、曾聖文、林欣民, 2018" Sb添加對Sn-1.5Ag-0.7Cu低銀無鉛銲料顯微組織與機械性質影響之研究",金屬熱處理學會2017年論文發表會論文集,001,106/12/9.金屬熱處理, 136 (2018) pp.24-37.
H.-T. Lee、T.-C. Liu.2018” Microstructure and Intergranular Corrosion Resistance Evaluation of Alloy 82 Weldments Alloy 82” J. of the Chinese Society of Mechanical Engineers, Vol.39, No.2, (2018) pp 131-143 (SCI,EI)
H.-T. Lee, D.-C. Liu,2017" The Improvement of Corrosion Resistance of Sensitized Alloy 82 Welds Using Laser Surface Melting " Materials Transactions, Vol. 58, No. 9 (2017) pp.1329-1336 (SCI,EI)https://doi.org/10.2320/matertrans.M2016456
H.-T. Lee, Kuo-Chen Huang,2016" Effect of solder-joint geometry on the low-cycle fatigue behavior of Sn-xAg-0.7Cu " J. Electronic Materials, Vol.45, No.12, 2016, pp. 6102-6112 (SCI,EI)
[DOI: 10.1007/s11664-016-4773-1] Cited:6
H.-T. Lee, Kuo-Chen Huang,2016"Low Cycle Fatigue Behavior and Reliabilities of SAC Solder-Joint with Different Geometry. CSME15-04-29 pp. (SCI,EI)
H.-T. Lee, Kuo-Chen Huang,2016" Effects of Cooling Rate on Microstructure and Morphology of Sn-3.0Ag-0.5Cu Solder” J. Electronic Materials, Jan. 2016, Volume 45, Issue 1, pp 182–190(SCI,EI) Cited:19
https://link.springer.com/content/pdf/10.1007/s11664-015-4189-3.pdf
S.-L. Jeng, H.-T. Lee, T.-Y. Kuo, K.-C. Tsai, C.-L. Chung, J.-Y. Huang,2015"The effects of Mn and Nb on the microstructure and mechanical properties of Alloy 152 welds." Materials & Design, 87 ( 2015) pp.920-931 (SCI,EI) [doi:10.1016/j.matdes.2015.08.100] Cited:18
汪晨暉,黃國禎,林育仙,李驊登*,2015" Sn-xAg-0.7Cu無鉛銲料低週疲勞之研究",金屬熱處理, 124期(2015) pp.24-33.
H-T Lee ,B.-C. Tseng and Y.-C. Chang,2015 "LSM Rejuvenation for the Decayed Nickel-Based Alloys in Nuclear Industry" Proceedings of LAMP2015 - the 7th International Congress on Laser Advanced Materials Processing [http://www.jlps.gr.jp/en/proc/lamp/15/A284_Lee_et_al.pdf]
H-T Lee, F-M Liu, W-H Hou,2015"Application and Characteristics of Low-Carbon Martensitic Stainless Steels on Turbine Blades" Materials Transactions, Vol. 56, No. 4 (2015) pp. 563 - 569 (SCI,EI) [doi:10.2320/matertrans.M2014307]
H.-S. Chen, H.-T. Lee*, M.-H. Lee, K.-J. Huang, H.-Y. Wu, 2014 "The Welding Characteristics of Different Niobium Added Nickel Base Alloy 52 as Filler Metal by Cladding." J. of Taiwan Society for Metal Heat Treatment, Vol.123, (2014) pp. 18-29
S.-Y. Hu, Y.-Y. Ling, Hsin-Tzu Lee, H.-T. Lee*2014 "Surface Oxidation Behavior of Ti-6Al-4V Alloy at High Forging Temperature" J. of Taiwan Society for Metal Heat Treatment, Vol.123, (2014) pp.40-49
張淵智,曾秉鈞,李驊登2014 "先進高強度鋼(AHSS)於汽車工業之發展與應用"機械月刊,40卷,8期Oct., No.471, pp.2-22
H.T. Lee, 2014 "Lap-Joint Laser Welding of Copper Sheet with SPCC of 0.2mm Thickness" 7th Taiwan-Japan Workshop on Mechanical and Aerospace ,2014/9/12,Taipei.
汪晨暉, 李驊登*, 黃國禎, 林育仙2014," Sn-xAg-0.7Cu無鉛銲料低週疲勞之研究"2014台灣金屬熱處理學會論文研討會,2014/12/06,高雄 "Low Cycle Fatigue of Sn-xAg-0.7Cu Lead-Free Solder Joints." Annual Conf. of Taiwan Soc. for Metal Heat treatment. 2014/12/06, 【2014年台灣金屬熱處理學會年會論文獎】
郭宇傑, 李驊登*, 吳函諭, 陳郁文, 2014 "鎳基合金Alloy 52失延裂紋之失延裂紋機制研究"2014台灣金屬熱處理學會論文研討會,2014/12/06, 高雄
李孟修,李驊登*,王怡茹,謝喻丞, 2014 "脈衝雷射覆銲參數對Alloy 52銲道熱裂敏感性影響之研究"2014台灣金屬熱處理學會論文研討會,2014/12/06, 高雄
黃國禎, 李昭慶, 汪晨暉, 李驊登* 2014 "溫度效應下 Sn-Ag-Cu 無鉛銲料低週疲勞損壞之研究"第12屆破壞科學研討會,P-39,2014/10/24-25,南投
汪晨暉,黃國禎,林育仙,李驊登*,2014 " Sn-xAg-0.7Cu無鉛銲料銲點型貌與低週疲勞之研究"第12屆破壞科學研討會, 2014/10/24-25,南投
H.T. Lee *, J. L. Wu 2013 “ Correlation study of intergranular corrosion resistance of nickel-based alloy 690 weldments. “ Research Express @NCKU Vol. 24, Issue4 - Jul. 5, 2013 Cited:24 [http://proj.ncku.edu.tw/research/articles/e/20130705/1.html]
曹嘉、李孟修、李驊登..等, 2013"國立成功大學校鐘文創典藏與技術分析研究"第30屆CSME全國學術研討會, No.1590.2013/12/06,宜蘭."
黃証羣、李驊登、王怡茹、吳函諭, 2013"雷射表面重熔處理對Alloy 52覆銲之效果研究"第30屆CSME全國學術研討會, No.1593, 2013/12/06,宜蘭-
黃景暉、郭宇傑、張淵智、李驊登, 2013"無氧銅薄板之雷射銲接特性研究"第30屆CSME全國學術研討會,2013/12/06,宜蘭-The 30th Annual Conf. of CSME, 2013,No.1776,pp1-7
張銘峰、李驊登、李昭慶、黃國禎, 2013"Sn-Ag-Cu銲料連續冷卻速率對微結構與機械性質之研究"第30屆CSME全國學術研討會,2013/12/06,宜蘭The 30th Annual Conf. of CSME, 2013, No.1666,
李昭慶、李驊登、黃國禎、汪晨暉, 2013"Sn-xAg-0.7Cu無鉛銲料微結構與低週疲勞研究"第30屆CSME全國學術研討會,2013/12/06,宜蘭- The 30th Annual Conf. of CSME, 2013,No.1588,pp1-6
陳泓昇、李驊登、李孟修、林育仙, 2013"鎳基銲材Alloy 52鈮含量對銲道影響"第30屆CSME全國學術研討會,2013/12/06,宜蘭- The 30th Annual Conf. of CSME, 2013,
張銘峰、李昭慶、黃國禎、李驊登, 2013"連續冷卻速率對Sn-Ag-Cu無鉛銲料組織微結構變化之研究"2013台灣金屬熱處理學會論文研討會, No.57, 2013/11/30,台北
李昭慶、黃國禎、汪晨暉、李驊登, 2013"Sn-xAg-0.7Cu無鉛銲料高溫疲勞特性研究"2013台灣金屬熱處理學會論文研討會, No.12, 2013/11/30,台北
黃証羣、吳函諭、王怡茹、李驊登, 2013"雷射表面重熔處理對Alloy 52覆銲之效果研究"2013台灣金屬熱處理學會論文研討會, No.61, 2013/11/30,台北.
黃景暉、郭宇傑、張淵智、李驊登, 2013"無氧銅薄板之最佳雷射銲接製程研究"2013台灣金屬熱處理學會論文研討會, No.58, 2013/11/30,台北
陳泓昇、李驊登、李孟修、林育仙, 2013"鎳基銲材Alloy 52鈮含量對銲道影響"2013台灣金屬熱處理學會論文研討會論文獎佳作, No.33, 2013/11/30,台北.
H.T. Lee, and W.H. Hou 2012 " Development of fine-grained structure and the mechanical properties of nickel-based Superalloy 718 " Materials Science & Engineering A.Vol.555, (2012), pp13–20 , (SCI,EI) [doi:10.1016/j.msea.2012.06.027], Cited:38
H.T. Lee, and W.H. Hou 2012 "Study of δ precipitation on static recrystallization behavior of Inconel 718 alloy. " J. Nanoscience and Nanotechnology Vol. 12, No 9, (2012),pp. 6987-6995(9) (SCI,EI)
[http://dx.doi.org/10.1166/jnn.2012.6513 Cited:10
K. Y. Chen, H.T. Lee, S. L. Jeng, C. C. Hsu, B. C. Tseng 2012 " Rejuvenation of Weld Decayed Alloy 82 by Laser Surface Treatment," Journal of Chinese Corrosion Engineering, vol. 26, No. 2, pp. 89-98. "雷射表面處理修補衰化之Alloy82覆銲層效果研究. " 防蝕工程.
H.T. Lee, and W.H. Hou 2012 "Influence of Precipitated Phase Formation on Recrystallization Behavior of Superalloy 718" Materials Transactions, Vol.53,No.7 (2012), pp.1334 – 1342, (SCI,EI) [doi:10.2320/matertrans.M2012090] Cited:2
H.T. Lee, and W.H. Hou 2012"Fine Grains Forming Process, Mechanism of Fine Grain Formation and Properties of Superalloy 718" Materials Transactions, Vol. 53, No 4, pp.716-723 (SCI,EI) [doi:10.2320/matertrans.M2011337] Cited:10
H.-T. Lee, 2012 "Laser Application on Rejuvenation Process for Decayed Materials in Nuclear Industry ",The 7th International Conf. on Advanced Materials Processing (ICAMP), Taipei, Taiwan, Jun 24-27, 2012 (Plenary speech)
李驊登, 2012 "汽車零件破損分析實務".第十一屆破壞科學研討會, 2012/03/24屏東,台灣(專題演講) (Plenary speech)
李驊登*、黃景暉、鄭朝友, 2012 "以Processing Map預測H13工具鋼熱作成形破壞之研究".第十一屆破壞科學研討會, 2012/03/24屏東,台灣, (Paper Award)
李驊登1.*、李昭慶1.、洪敏峰, 2012"XM-19的Processing Map製作與成型破壞現象探討".第十一屆破壞科學研討會, 2012/03/24屏東,台灣
陳冠聿、李驊登*、許家旗、曾秉鈞, 2012"核電廠劣化之鎳基超合金組件之雷射表面重熔修補研究".第十一屆破壞科學研討會, 2012/03/24屏東,台灣
李驊登, 陳冠聿, 曾秉鈞, 許家旗, 鄭勝隆, 黃証羣, 2012"雷射表面處理技術修補衰化Alloy82之效果研究".第十一屆破壞科學研討會, 2012/03/24屏東,台灣
李驊登, 2012"汽車驅動零件破損分析實務." 2012智慧車輛技術成果發表會,2012/01/12台南,成大
H. T. Lee, and C. T. Chen 2011 “Predicting Effect of Temperature Field on Sensitization of Alloy 690 Weldments" Materials Transactions, Vol. 52, No.9, pp.1824-1831, [doi:10.2320/matertrans.M2011147] (SCI,EI) Cited: 7
H.T. Lee *, J. L. Wu 2011 “The effects of peak temperature and cooling rate on the susceptibility to intergranular corrosion of alloy 690 by laser beam and gas tungsten arc welding. “ Research Express @NCKU Vol. 19, Issue 7 - Sep. 9, 2011 [ http://research.ncku.edu.tw/re/articles/e/20110909/3.html ]
H.T. Lee, and C.T. Chen 2011 “Numerical and Experimental Investigation into Effect of Temperature Field on Sensitization of AISI 304 in Butt Welds Fabricated by Gas Tungsten Arc Welding." Materials Transactions, Vol. 52, No. 7 (2011)pp. 1506-1514 (SCI,EI) [doi:10.2320/matertrans.M2011071] Cited:4
H. T. Lee.; Y.F. Chen, Alexander Schwedt, Joachim Mayer 2011 “Effect of La Addition on Adhesive Strength and Fracture Behavior of Sn-3.5Ag Solder Joints.” Material Science and Engineering A, 528 (2011) pp.3630–3638. IF=1.901 [DOI:10.1016/j.msea.2011.01.090] Cited: 6
H.T. Lee, T.Y. Tai, C. Liu, F.C. Hsu, and J.M. Hsu,2011 “Effect of material physical properties on residual stress measurement by EDM hole-drilling strain-gage method..”ASME Journal of Engineering Materials and Technology, April 2011, Vol. 133, 021014-1~8 [DOI: 10.1151/1.4000219] Cited:6
Y.C. Lin and H. T. Lee, 2011 “Microstructures and magnetostrictive strains of two-phase Fe66-Pd30-Ni4 hightemperature ferromagnetic shape memory alloys.” Journal of Applied Physics. (GS-05) Apr. 2011, IF=2.072 [doi:10.1063/1.3540690] Cited:6
陳銀發、李驊登、施谷達、林冠宇, 2011“添加La對共晶Si-3.5Ag銲料微結構之影響與細化機制研究” ,金屬熱處理, 第108期(2011) pp.48-56. 【2010年台灣金屬熱處理學會年會論文獎】
H. T. Lee.; Y.F. Chen, 2011 “Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn-3.5Ag solder.” J. of Alloys and Compounds 509 (2011) pp. 2510-2521, IF=2.135, Ranking 5/70=7.1% [DOI:10.1016/j.jallcom.2010.11.068], Cited: 42
B. C. Tseng, H. T. Lee*, J. L. Wu and S. L. Jeng 2011“Effect of Laser Surface Melting on Rejuvenation of Sensitized 304 Stainless Steel" The 6th Japan-Taiwan Workshop on Mechanical and Aerospace Engineering, Dec. 7-10, 2011, Sapporo, Hokkaido, Japan
W.-H. Hou and H.-T. Lee, 2011"Developmet of Fine Grain Structure of Superalloy 718" " The 6th Japan-Taiwan Workshop on Mechanical and Aerospace Engineering, Dec. 7-10, 2011, Sapporo, Hokkaido, Japan
陳冠聿、李驊登*、鄭勝隆、許家旗、曾秉鈞, 2011”雷射表面處理修補衰化之Alloy 82覆銲層效果研究” 中華民國防蝕工程學會100年度論文發表會, 2011/08/18-19,新北市
吳佳霖、李驊登*、陳俊德、鄭勝隆、郭聰源、陳冠聿, 2011”鎳基690合金銲件之應力腐蝕破裂抵抗性研究” 中華民國防蝕工程學會100年度論文發表會, 2011/08/18-19,新北市【100年度防蝕工程論文壁報獎】
H. T. Lee, C. T. Chen and J. L. Wu. 2010“ 3D numerical study of effects of temperature field on sensitisation of Alloy 690 butt welds fabricated by gas tungsten arc welding and laser beam welding.” Science and Technology of Welding and Joining, Vol.15, No.7 pp.605-612 (SCI) IF:1.327 [DOI: 10.1179/136217110X12821385189884] Cited: 11
Y.D. Lin, H.T. Lee, T.Y. Kuo, S.-L. Jeng, J.-L. Wu. 2010”Effects of beam offsets on mechanical properties and corrosion resistance of Alloy 690–SUS 304L EBW Joints for Nuclear Power Plant. ” J. Nuclear Materials, Volume 401, Issues 1-3, June 2010, pp. 78-85, IF: 1.501 [DOI:10.1016/j.jnucmat.2010.04.001] Cited: 8
侯文星, 李驊登, 王尚智 蔡忠君, 劉昱磊2010”δ相析出對718鎳基超合金靜態再結晶之影響研究.” 金屬熱處理,第105期(2010) pp.20-28. (2009年台灣金屬熱處理學會年會論文獎)
Lin, Y.C. and Lee, H.T., 2010“Magnetostriction and Magnetic Structure in Annealed Recrystallization of Strain-forged Ferromagnetic Shape Memory Fe-Pd-Rh Alloys ”, Journal of Applied Physics, 107, 09D312, May 2010. SCI, IF=2.072 [doi:10.1063/1.3367979] Cited: 3
H.T. Lee, and C.L. Wu. 2010" Intergranular corrosion resistance of nickel-based alloy 690 weldments" Corrosion Science, Vol.52, Issue 5, May (2010) pp.1545-1550. (SCI,EI) IF=2.293 [doi: 10.1016/j.corsci.2010.01.030] Cited: 24
H.T. Lee, Chun Te Chen and J.L. Wu, 2010“Numerical and Experimental Investigation into Effect of Temperature Field on Sensitization of Alloy 690 Butt Welds Fabricated by Gas Tungsten Arc Welding and Laser Beam Welding” Journal of Materials Processing Technology, Volume 210, Issue 12, 1 September 2010, pp.1636-1645, SCI, IF=1.42 [doi:10.1016/j.jmatprotec.2010.05.012] Cited: 25
Y.C. Lin and H. T. Lee, 2010 “Grain size refinement and magnetostriction of ferromagnetic shape memory Fe–Pd–Rh alloys” Journal of Magnetism and Magnetic Materials, 322 (2010) pp.197-207. SCI, IF=1.283, [doi:10.1016/j.jmmm.2009.08.046] Cited: 5
黃于菁、李驊登、許哲瑋、林冠宇、陳銀發,2010”添加La對Sn-Ag-Sb銲點結合強度之影響”中國機械工程學會27th全國學術研討會, paper no. EE05-011 台北科技大學, 2010/12/10-11
李驊登、陳俊德、吳佳霖 , 2010 “鎳基690合金GTAW與LBW製程熱處理之銲接溫度場模擬與測量”,台灣金屬熱處理學會, pp.81, 2010.
W.-S. Hou, H.-T. Lee, S.-F. Chang, S.-C. Wang, Y.-.L. Liu, W.-C. Kuo, C.-C. Tsai 2010 “Development of extra fine grain structure of Superalloy 718." SEAISI 2010 Vietnam Conference, May 17-20
李驊登、陳銀發、施谷達、林冠宇, 2010 “添加La對共晶Si-3.5Ag銲料微結構之影響與細化機製研究” ,台灣金屬熱處理學會, pp.83, 2010. 【獲臺灣金屬熱處理學會論文研討會論文獎】
李驊登 侯文星 王尚智 蔡忠君 劉昱磊 郭威成, 2010 “利用再結晶熱處理對δ相控制製造超細晶鎳基718超合金之新製程”,2010台灣金屬熱處理學會, pp.84, 2010.【獲臺灣金屬熱處理學會論文研討會論文獎】
S. K. Hung, H. T. Lee, J. L. Wu, K.Y. Chen, S. L. Jeng, J. Y. Huang, C. C. Xu, 2010 “Desensitized Effect of Laser Surface Melting on of 304 Stainless Steel, 第七屆海峽兩岸材料腐蝕與防護研討會 中國,昆明 Aug. 8-14(2010) pp.188.
陳冠聿、李驊登*、吳佳霖、洪聖凱、許家旗,2010 “沃斯田鐵系不銹鋼雷射表面重熔效果評估” ,第十屆破壞科學研討會/第八屆全國MTS材料試驗學術會議 台灣‧墾丁Sep.24-25(2010) p.66.
H.T. Lee, Y.F. Chen, T-F. Hong and Y.-J. Huang 2009 “Influence of lanthanum addition on microstructure and properties of Sn-3.5Ag solder system” IEEE Xplore,(2009) pp.183-186, Electronic Materials and Packaging, 2008. EMAP 2008 [http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=4784259],
H.T. Lee, F.-F. Lee, T.F. Hong and H.W. Chen.2009” Effect of In addition on Sn-Ag-Sb lead-free solder system.”IEEE Xplore,(2009) pp.191-194, Electronic Materials and Packaging, 2008. EMAP2008 [http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=4784261],
H.T. Lee, and Y.F. Chen, 2009 “Influence of Lanthanum addition on microstructure and microhardness of Sn-3.5Ag solder system” J. Electronic Materials, Vol. 38, No. 10, 2009, pp.2148-2157 [DOI: 10.1007/s11664-009-0863-7] Cited:11
H.T. Lee, C.Y. Lee, F.F. Lee, Y.F. Chen, and Y.H. Lee, 2009 “Microstructural evolution of Sn-Ag-Sb solder with Indium addition.” J. Electronic Materials, Vol. 38, No. 10, 2009, pp.2112-2121. IF=1.32 [DOI:10.1007/s11664-009-0884-2] Cited: 4
H.T. Lee, and C. Liu 2009 “Optimizing the EDM Hole-Drilling Strain Gage Method for the Measurement of Residual Stress .”Journal of Materials Processing Technology, 209 (2009) pp.5626-5635.IF=1.42 [doi:10.1016/j.jmatprotec.2009.05.028] Cited: 16
李佛富,李驊登,陳銀發,陳曉薇,洪廷甫2009"時效時間對Sn-3Ag-2Sb-xIn無鉛銲料機械性質之影響"金屬熱處理,第101期(2009)pp.37-44
H. T. Lee, and W. Y. Huang, 2009 “Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3wt-%Ag-1.5wt-%Sb-xCu Solder Joints.” Mater. Trans. Vol. 50, No. 4 (2009) pp. 899 – 908. IF=0.753 [doi:10.2320/matertrans.MER2008361]
H.T. Lee, and C. L. Wu. 2009 "Correlation between corrosion resistance properties and thermal cycles experienced by GTAW and LBW Alloy 690 Butt Weldments" Corrosion Science 51, (2009 )pp.733-743. (SCI,EI). IF=2.293 [doi:10.1016/j.corsci.2009.02.004] Cited: 37
H.C. Lin, T.Y. Kuo, H.T. Lee. 2009 “Pop-In Crack Propagation Monitoring for AA2024-T3 Ductile Alloy.” Mater. Transactions, Vol. 50, No. 2 (2009) pp. 313-320. IF=0.753 [doi:10.2320/matertrans.MRA2008275] Cited: 3
H.T. Lee, and C. L. Wu. 2009 ”The effects of peak temperature and cooling rate on the susceptibility to intergranular corrosion of alloy 690 by laser beam and gas tungsten arc welding.” Corrosion Science, 51,(2009) pp.439-445. IF=2.293, [http://dx.doi.org/10.1016/j.corsci.2009.01.002] Cited: 54
H.-T. Lee , Y.-F. Chen , T.-F. Hong, K.-T. Shih 2009“Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder” IEEE Xplore,(2009) pp.875-878,11th Electronics Packaging Technology Conf. (EPTC 2009) 9-11 Dec. 2009 Singapore, Paper ID : P0304 [DOI: 10.1109/EPTC.2009.5416420]
H.-T. Lee, J.-L. Wu, T.-Y. Kuo, S.-L. Jeng, J.-Y. Huang. 2009 ”Characteristic studies of Nd:YAG laser powers and waveforms on nickel base alloy 690 weldments.” International Conference on Manufacturing and Engineering Systems (MES 2009) December 17-19, 2009 National Formosa University, Taiwan B6-5
W.-S. Hou, H.-T. Lee, S.-C. Wang, C.-C. Tsai, and Y.-L. Liu, 2009 “Influence of δ Phase Formation on Static Recrystallization of Inconel 718” (δ相析出對718鎳基超合金靜態再結晶之影響研究), 臺灣金屬熱處理學會2009年論文研討會, 2009/12., 台北科技大學 [獲臺灣金屬熱處理學會2009年論文研討會海報獎]
Hwa-Teng Lee , Yin-Fa Chen , Ting-Fu Hong, Ku-Ta Shih, 2009 “Evolution of Ag3Sn intermetallic compounds in solidification of eutectic Sn-3.5Ag solder.” 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), paper no. E-088, Beijing, China Aug.10-13, 2009
Hwa-Teng Lee, Yin-Fa Chen, Ting-Fu Hong, Ku-Ta Shih, Che-wei Hsu, 2009 “Microstructural Evolution of Sn-3.5Ag Solder with Lanthanum Addition.” 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), paper no. E-079, Beijing, China Aug.10-13, 2009
陳銀發、李驊登、許哲瑋、黃于菁, 2009.” 添加稀土元素對Sn-Ag-Sb-X無鉛銲料系統之開發研究.” 中國機械工程學會26th全國學術研討會, paper no.D05-018 台南成功大學, 2008/11/20-21
李驊登、曾秉鈞、吳佳霖、洪聖凱、陳冠聿、許家旗, 2009.”雷射表面重熔法對去敏化之效果研究” 中國機械工程學會26th全國學術研討會, paper no.D02-044 台南成功大學, 2008/11/20-21
H.T. Lee, J.L. Wu, T. Y. Kuo, R. C. Kuo, J. Y. Huang, S. L. Jeng, 2009 ”The influence of thermal cycles on heat affected zone sensitization of alloy 690”, Asian Pacific Corrosion Forum, Corrosion in Nuclear Systems, no. A-203, Tokyo, May 22-24,2009
曾秉鈞,李驊登,吳佳霖,洪聖凱,鄭勝隆,許家旗, 2009 ”雷射表面重熔對SS304敏化不銹鋼之抗蝕性研究“ Effect of Laser Surface Melting on IGC of Sensitized 304 Stainless Steel.中華民國防蝕工程98年度論文發表會, 2009/8/27-28,台中
Y.C. Lin, H.T. Lee and C.F. Lin. 2008.”Recrystallization of Ferromagnetic Fe-Pd-Rh Alloys.” World Journal of Engineering, Vol. 5, No. 4, (2008) pp. 537-538, EI (ISSN 1708-5284)
H.T. Lee, C. Liu, F. C. Hsu and J. M. Hsu 2008 “An enhanced calibration scheme for the EDM hole-drilling strain gage method for the measurement of residual stress in ferrous materials.” Materials Transactions, Vol. 49, No. 8 (2008) pp. 1905 -1910, [doi:10.2320/matertrans.MER2008098]
H.T. Lee 2008 “Effects of In addition on the Lead-free Sn-Ag-Sb Solder.” BANYAN Research Express Vol. 5, Issue 1, Jun.2008 [ http://research.ncku.edu.tw/re/articles/e/20080627/4.html ]
Y.C. Lin, H.T. Lee 2008 “Microsturcture and magnetic property of ferromagnetic Fe-Pd-Rh alloys.” J. of Korean Physical Society, Vol.52, No.5. May 2008.pp.1410-1414 (SCI,EI)
S.L. Jeng, H.T. Lee, J.Y. Huang, R.C. Kuo, 2008 ” Effects of Nb on the Microstructure and Elevated-Temperature Mechanical Properties of Alloy 690-SUS 304L Dissimilar Welds.” Mater. Trans., Vol.49, No.6 , (2008) pp.1270-1277 (SCI,EI) [doi:10.2320/matertrans.MRA2008008], Cited: 17
Y.C. Lin, H.T. Lee, and C.F. Lin. 2008.” Magnetic structure and magnetic property of Fe-Pd-Ag alloys.” J. of Advanced Engineering Vol.3, No.2, Apr. pp.123-128 [http://dx.doi.org/10.29948/JAE.200804.0004]
Lee H.T., S.-Y. Hu, T.F. Hong, and Yin-Fa Chen. 2008” The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM” J. Electronic Materials, Vol.37, No.6, pp.867-973 [DOI: 10.1007/s11664-008-0396-5] , Cited: 25
H.T. Lee , F.F. Lee , T.F. Hong , H.W. Chen 2008 "Effect of In addition on Sn-Ag-Sb lead-free solder system," IEEEXplore, pp.191-194, Electronic Materials and Packaging, 2008. EMAP 2008. International Conference, Issue Date: 22-24 Oct. 2008 [http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4784261]
H.T. Lee * 2008“ Effects of In addition on the Lead-free Sn-Ag-Sb Solder. “ Research Express @NCKU Vol. 5 Issue 1 - Jun. 27, 2008 [http://proj.ncku.edu.tw/research/articles/e/20080627/4.html]
H. T. Lee, W. Y. Huang, and Y. F. Chen. 2008” Influence of Cu Addition on Intermetallic Compound Formation and Microstructure of Sn-3wt%Ag-1.5wt%Sb-xCu Solder Joints” Science and Technology of Welding and Joining, Vol. 13, No 8 pp.781-790 (SCI) [http://dx.doi.org/10.1179/174329308X277737]
Lee H.T., and Liu Chuen. 2008 ”Calibration of residual stress measurements obtained from EDM hole-drilling method using physical material properties.” Materials Science and Technology, Vol. 24 No 12, pp.1462-1469 (SCI,EI) [http://dx.doi.org/10.1179/174328408X269240], Cited: 7
李驊登, 吳佳霖, 牛文俊, 曾秉鈞, 施谷達, 2008 ”銲接熱循環對不同熱處理鎳基600合金之沿晶腐蝕研究” 臺灣金屬熱處理學會2008年論文研討會, 2008/12. ”, 台中逢甲大學
侯文星, 李驊登, 蔡忠君, 劉昱磊. 2008 ”718鎳基超合金delta相對靜態再結晶影響之研究.” Influence of Delta Phase Formation on Static Recrystallization of Inconel 718.臺灣金屬熱處理學會2008年論文研討會, 2008/12. ”, 台中逢甲大學
李驊登, 吳佳霖, 牛文俊, 曾秉鈞, 施谷達. 2008 ”銲接熱對鎳基600合金銲件耐蝕性之影響” Influence of thermal history of welding on corrosion resistance of alloy 600 weldment.臺灣金屬熱處理學會2008年論文研討會, 2008/12. ”, 台中逢甲大學
李佛富, 李驊登, 陳銀發, 陳曉薇, 洪廷甫. 2008 ”時效時間對Sn-3Ag-2Sb-xIn無鉛銲料機械性質之影響”Effect of aging time on mechanical properties of Sn-3Ag-2Sb-xIn Lead-free Solder.臺灣金屬熱處理學會2008年論文研討會, 2008/12. ”, 台中逢甲大學[獲臺灣金屬熱處理學會論文獎]
李佛富、李驊登、陳銀發、陳曉薇、洪廷甫、許哲瑋, 2008 ”添加In對Sn-Ag-Sb銲點結合強度之影響” 中國機械工程學會25th全國學術研討會,彰化大葉大學, 2008/11/21-22
陳銀發、李驊登、陳曉薇、李佛富、黃文勇, 2008 ”高溫時效對SnAgSb及SnAgCu銲料之微結構與機械性質之影響.” 中國機械工程學會25th全國學術研討會,彰化大葉大學, 2008/11/21-22
李驊登, 2008 “機械工業的材料思維.” 2008材料年會,台北,北科大, 2008/11/22
吳佳霖,李驊登,楊民安,郭榮卿,黃俊源,鄭勝隆,2008 ” GTAW及LBW銲接熱循環對鎳基690合金銲件之沿晶腐蝕/沿晶應力腐蝕破裂研究.”第六屆海峽兩岸材料腐蝕與防護研討會, No.TW130, 2008年11月9-12日台灣‧花蓮
H.-T. Lee, F.-F. Lee, T.-F. Hong, H.-W. Chen. 2008 “ Effect of In addition on Sn-Ag-Sb lead-free solder system.”The 3rd IMPACT and 10th EMAP Joint Conference, 10/22 - 10/24, 2008, Taipei ,Taiwan
H.-T. Lee, Y.-F. Chen, T.-F. Hong, Y.-J. Huang. 2008 “ Influence of Lanthanum Addition on Microstructure and Properties of Sn-3.5Ag Solder System .”The 3rd IMPACT and 10th EMAP Joint Conference, 10/22 - 10/24, 2008, Taipei ,Taiwan
F. C. Hsu , Y. Chuang, H. T. Lee, M. L. Hsieh, C. Liu, T. Y. Tai, Y. C. Lin 2008 “An investigation of electrode manufacturing and micro-hole drilling by micro-EDM” ICOMM-2008 International Conference on Micromanufacturing, Pittsburgh, Carnegie Mellon University USA
Y.C Lin, H.T. Lee and C.F. Lin. 2008 "Recrystallization of ferromagnetic Fe-Pd-Rh Alloy" 16th Annual Intl. Conf. on Composites and Nano Engineering (ICCE-16), Jul. 20-26, 2008. Kunming, China.
M. L. Hsieh, H. T. Lee, F. C. Hsu, et al 2008”The Study of Electrode Manufacturing and Micro-hole Drilling by Micro-EDM”, 2008 IJWMF, International Joint Workshop on Micro Fabrication, Kaohsiung, Taiwan
T.-Y. Tai, H.-T. Lee and F.-C. Hsu, 2008 ” Improvement of Fatigue Life by Reducing the Formation of Crack During EDM Process.” 13th International Conf. on Applied Mechanics and Mechanical Engineering, May 27-29, 2008. Cairo, Egypt.
李驊登、陳銀發、洪廷甫,2008 “添加微量La對Sn-3.5Ag銲點接合強度之影響.”第九屆破壞科學研討會論文集,台灣墾丁,2008.03.28~29
吳佳霖、李驊登、郭榮卿、鄭勝隆,2008 “GTAW 與LBW 製程之鎳基690 合金銲件之殘留應力與沿晶腐蝕研究.”第九屆破壞科學研討會論文集,台灣墾丁,2008.03.28~29 【中國材料學會破壞科學研討會九十七年度傑出論文獎】
侯文星、李驊登、許媛婷、李祖耀、洪廷甫、黃英彬. 2007 ”渦輪葉片應用材料-低碳麻田散鐵不銹鋼特性研究”. 金屬熱處理, 第95期(2007),pp.15-27 / “The study of low carbon martensitic stainless steel applied to turbine blade.” Metal Heat Treatment, V. 95, (2007) pp.15-27
Lee H.T., Lin Y.D. Kuo, T.Y., and S.L. Jeng. 2007” Precipitated Phases and Corrosion Behavior in the Dissimilar Alloy 690–SUS 304L Joints Formed by EBW and GTAW.” Mater. Trans., Vol. 48 No.6, (2007) pp.1538-1547 (SCI,EI) [http://www.jim.or.jp/journal/e/pdf3/48/06/1538.pdf] Cited: 6
Yin-Chih Lin, H. T. Lee, S. U. Jen, and Y. T. Chen. 2007 ”Magnetic structure of an Fe–Pd–Rh alloy.” J. Appl. Phys. 101, 09N514 (2007) (SCI,EI) [DOI:10.1063/1.2712174]
Tai, T.Y., T. Masuzawa and Lee, H.T. 2007 ”Drilling Microholes in Hot Tool Steel by Using Micro-Electro Discharge Machining.” Materials Transactions, Vol.48 No.02 (2007) pp.205-210 (SCI,EI) [https://www.jim.or.jp/journal/e/pdf3/48/02/205.pdf] Cited: 9
賴振慶、李驊登、吳佳霖2007 “核反應器基座鋼材A533之銲件微結構與銲接特性研究.” 金屬熱處理, 第92期(2007),pp.49-62
S.L. Jeng, H.T. Lee, T.E. Weirich, W.P. Rebach 2007 “Microstructual study of the dissimilar joints of Alloy 690 and AISI 304L stainless steel.” Material Trans, Vol.48, No. 3(2007) pp.481-489. (SCI,EI), Cited: 26
Lee, Y.S. and Lee, H.T., 2007 "Shear strength and interfacial microstructure of Sn-Ag-xNi/Cu single shear lap solder joints" Material Science and Engineering A. 444 (2007) pp.75–83. (SCI,EI),IF:1.457, [http://dx.doi.org/10.1016/j.msea.2006.08.065], Cited: 89
Y.C Lin, H.T. Lee and C.F. Lin. 2007"Magnetic Structure and Magnetic Property of Fe-Pd-Ag Alloys"中國機械工程學會24th全國學術研討會.C14-0027, Nov.23-24,中壢
謝銘倫、李驊登、許富銓、莊殷、劉全, 2007 ”微細放電電極製作與微細鑽孔之研究.”中國機械工程學會24th全國學術研討會.D08-0063, Nov.23-24,中壢
蔡宏佳、李驊登、陳銀發、李佛富,2007 ”添加In對Sn-3Ag-2Sb銲點等溫低週疲勞之研究.”中國機械工程學會24th全國學術研討會.C04-0024, Nov.23-24,中壢
李驊登、黃文勇、李洋憲、陳銀發、李佛富, 2007 “添加Cu對Sn-Ag-Sb無鉛銲料微觀組織與拉伸強度之影響.” 台灣銲接協會96年度銲接論文發表會, A120-125,台南縣,南台科技大學 Oct.
許富銓、李驊登、戴子堯、林彧甫、Fritz Klocke, 2007 “ The Feasibility Study of Micro-EDM Hole-Drilling Method for Measuring Residual Stress” 15th International Symposium for Electromaching 2007/4 Pittsburgh
T.-Y. Tai, H.-T. Lee, F.-C. Hsu, 2007 “ The Influence of Working Parameters and Size Effect on Surface Roughness during EDM Process.” 15th International Symposium for Electromaching 2007/4 Pittsburgh
Lee H.T., and Lin Y.D. 2006” Microstructure and Corrosion Behavior of Alloy 690 to SUS 304L Butt Joints Formed by Electron Beam Welding.” Science and Technology of Welding and Joining, Vol. 11, Number 6, Nov. (2006) pp.650-656(SCI,EI) [http://dx.doi.org/10.1179/174329306X147733], Cited: 13
Lee, H.T., and Lee, Y.S., 2006 "Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints" Material Science and Engineering A: 419 (2006) pp.172–180 (SCI,EI) [http://dx.doi.org/10.1016/j.msea.2005.12.021], Cited: 72
Lee, H-T, J. Mayer, F-C Hsu, W. P. Rehbach, T. Weirich, A. Dimyati, T.-Y. Tai, 2006 “The application of EDM Hole-Drilling Method for measuring residual stress in Tool and Carbon Steels” Journal of Engineering Materials and Technology. Transactions of the ASME, vol. 128, pp.468-475, 2006 (SCI,EI). (Innovation paper) [http://dx.doi.org/10.1016/j.jmatprotec.2003.10.056] , Cited: 13
戴子堯,李驊登, 張詠盛、馮念華, 2006 “放電加工之表面裂紋敏感性研究.”臺灣金屬熱處理學會九十五年論文研討會, 2006/12. ”, 台南【獲臺灣金屬熱處理學會論文研討會論文獎】
李祖耀、李驊登、許媛婷、陳銀發、李佛富2006"添加In 對Sn-Ag-Sb 無鉛銲料微結構之影響.” P03-037中國材料科學學會2006材料年會, Nov.
李洋憲、李驊登、陳銀發、李祖耀、許媛婷. 2006 ”添加Ni 對Sn-Ag /Cu 銲點間IMC 形貌之影響” P03-156中國材料科學學會2006材料年會, Nov. (NSC94-2216-E-006-044)
Y.C Lin, H.T. Lee and S.U. Jen. 2006"Magnetic Structure and Magnetic Property of an Fe-Pd-Rh Alloy" Magnetism & Magnetic Materials 2007, Baltimore, Maryland, Jan.7-11, MS #060543GX-02
林英志、李驊登.2006 “Microstructure and Magnetic Property of the Ferromagnetic Fe-Pd-Rh Alloys.”D1-020” 中國機械工程學會第二十三屆全國學術研討會,Nov. 24-25, 台南
戴子堯、李驊登、王奕權. 2006 ”SKS93放電裂紋與加工參數關係之研究.” 中國機械工程學會第二十三屆全國學術研討會,Nov. 24-25, 台南
許媛婷、李驊登、李祖耀、陳銀發、.蔡宏佳, 2006” Sn-Ag-Sb-xIn無鉛銲料界面微結構與等溫低週疲勞之研究”D1-021, 中國機械工程學會第二十三屆全國學術研討會,Nov. 24-25, 台南The Microstructure and Low Cycle Fatigue of Sn-Ag-Sb-xIn Lead-Free Solder Joints, Yuan-Ting Hsu, Hwa-Teng Lee, Choo-Yeow Lee, Yin-Fa Chen and Hung-Chia Tsai
李祖耀、李驊登、許媛婷、陳銀發、蔡宏佳,2006” 添加In對Sn-Ag-Sb銲點剪切強度之影響”D1-035, 中國機械工程學會第二十三屆全國學術研討會,Nov. 24-25, 台南. Effects of Indium Additions on Shear Strength of Lead-Free Sn-Ag-Sb Solder Joint, C.Y. Lee, H.T. Lee, Y.T. Hsu, Y.F. Chen and H.J. Chai
林永定、李驊登、吳佳霖、楊民安、張維鑫, 2006” 電子束銲接製程參數對鎳基合金異種銲接電化學行為與機械性質的影響”D1-011,中國機械工程學會第二十三屆全國學術研討會,Nov. 24-25, 台南The Influence of EBW Parameters on Electrochemical Behavior and Mechanical Properties in the Process of Dissimilar Welding of Inconel Alloy, Yong-Ding Lin, Hwa-Teng Lee , Jia-Lin Wu Min-An Yang , Wei-Hsin Chang
李驊登、許志民、劉全、李孟軒,2006” 材料物理特性對放電加工鑽孔法引進殘留應力之研究” D1-017, 中國機械工程學會第二十三屆全國學術研討會,Nov. 24-25, 台南 /"Effect of Material Physical Properties on Residual Stress Measurement by EDM Hole-Drilling Method"
Yin-Chih Lin, Hwa-Teng Lee, 2006” Microstructure and Magnetic Property of the Ferromagnetic Fe-Pd-Rh Alloys.” International Workshop on Functional Materials and International Workshop on Nanophysics and Nanotechnology 2006, Halong City, Vietnam December 6 ~9, 2006
F. C. Hsu, H. T. Lee, T. Y. Tai, D. Thomaidis, G. Antonoglou, D. Lung, F. Klocke, 2006 .”The improvement of EDM Hole-Drilling Method for measuring residual stress by the Micro-EDM technology.” 1st International Conference on Micromanufacturing 2006/9 Illinois, USA
李驊登、吳佳霖、范文傑、郭聰源、林永定2006.”不同輸出功率下波形變化對鎳基690 合金與304L 不銹鋼之雷射異種對接銲分析”第四屆(2006)精密機械與製造技術研討會,論文集-The 4th Conference on Precision Machinery and Manufacturing Technology-PMMT 2006, pp.A45/01-10
Lee H.T., H.S. Lin, C.S. Lee, P.W. Chen ,2005 “Reliability of Sn-Ag-Sb lead-free solder joints.” Materials Science and Engineering A. 407(2005) pp.36-44 (SCI,EI) [http://dx.doi.org/10.1016/j.msea.2005.07.049], (SCI 1.906), Cited: 117
J.L. Wu, H.T. Lee, and C.W. Chi, 2005 “Characteristics of Hot-Work Tool Steels on High Temperature.” Metal Heat Treatment, Vol.86, No.9, pp.15-24
S.L. Jeng, H.T. Lee, W.P. Rehbach, T.Y. Kuo, T.E. Weirich, J.P. Mayer,2005 “Effects of Nb on the microstructure and corrosive property in the Alloy 690-SUS 304L weldment.” Materials Science and Engineering A , Vol. 397, Issues 1-2 , pp.229-238(SCI,EI) [http://dx.doi.org/10.1016/j.msea.2005.02.042], Cited: 47
Lee, H.T., and Lee, Y.S., 2005 “Effect of In-Situ Nickel Particle Addition on the Microstructure and Microhardness of Sn-Ag Solder.” Science and Technology of Welding and Joining, Vol. 10, No 3 pp.353-360 (SCI) [http://dx.doi.org/10.1179/174329305X40697], Cited:11
Kuo, T.Y., Lin, H.S. and Lee, H.T. 2005 “The Relationship between Fracture Behaviors and Thermomechanical effects of Alloy AA2024 of T3 and T81 Temper Designations Using the Center Crack Tensile Test.” Materials Science and Engineering A. 394 (2005) pp.28–35 (SCI,EI) (NSC 83-0424-E-006-095, SCI 1.906) [http://dx.doi.org/10.1016/j.msea.2004.10.014] Cited: 7
Y.C. Lin, H.T. Lee, 2005”Nanostructure and magnetic property of Fe-Pd alloy.” 2005 Intl. Symposium on Nano Sci. and Technology, tainan Taiwan , 2005.11.10-11
戴子堯, 李驊登, 許富銓, T. Masuzawa 2005” 應用微細放電加工法在熱作工具鋼鑽微小深孔之探討.” 中國機械工程學會第二十二屆全國學術研討會, 2005/11中壢
李洋憲、李驊登、陳銀發、黃文勇、陳世榮. 2005.”Sn-Ag-xNi 銲料與銅基板接合粘結強度變化之研究.”中國機械工程學會第二十二屆全國學術研討會, 2005/11中壢,中央大學
陳世榮、李驊登、陳銀發、李洋憲、許媛婷2005..”添加Ni粉顆粒對Sn-Ag-Sb無鉛銲料銲點微結構與微硬度之影響” D1-002中國機械工程學會第二十二屆全國學術研討會, 2005/11中壢中央大學
陳銀發、李驊登、陳世榮、黃文勇、李洋憲2005.."添加Cu對Sn-Ag-Sb無鉛銲料微結構與微硬度之影響” D1-011中國機械工程學會第二十二屆全國學術研討會, 2005/11中壢,中央大學,
許富詮、李驊登2005..”放電加工鑽孔法量測殘留應力之校正程序研究.” 中國機械工程學會第二十二屆全國學術研討會, 中央大學
李驊登、范文傑、郭聰源、吳佳霖、林永定2005.” Nd:YAG 雷射波型對鎳基690 與304L 不銹鋼異種對接銲件之影響” 中華民國銲接學會94年度銲接論文發表會
李驊登、昌增榮、劉全、許志民2005.”鋁薄膜陽極處理電壓電流參數對多孔結構生成之影響” 中國材料科學學會2005材料年會
Lee, H.T., Jeng, S.L. Yen C.H. and Kuo, T.Y, 2004”Dissimilar welding of nickel-based alloy 690 to SUS 304L with Ti addition” Journal of Nuclear Materials, 335 (2004) pp.59-69 (SCI.,EI) [http://dx.doi.org/10.1016/j.jnucmat.2004.06.004], Cited: 75
Lee, H.T., Yang, C.L., Chen, M.H. and Li, C.S. 2004 “Effect of Sb Addition on Microstructure and Shear Strength of Sn-Ag Solder Joints“ Key Engineering Materials Vol. 261-263. pp.501-506 [http://www.scientific.net/KEM.261-263.501], Cited: 5
Lee, H.T., Rehbach Werner. P. Tai, T.Y. and Hsu, F.C. 2004 “Relationship between Electrode Size and Surface Cracking in the EDM Machining Process”. J. of Material Science, 39 (23): 2004 pp.6981-6986(SCI,EI), [DOI: 10.1023/B:JMSC.0000047541.95138.17] , Cited: 32
Lee, H.T. Rehbach, W.P., Hsu, F.-C., Tai T.-Y. & Hsu, Edward 2004 ” The Study of EDM Hole-Drilling Method for Measuring Residual Stress in SKD11 Tool Steel” J . of Materials Processing Technology, 149 (2004 )pp. 88–93 / ISEM XIV in Edinburgh in 2004, 14th Int. Symposium For Electromachining (ISEM) [http://dx.doi.org/10.1016/j.jmatprotec.2003.10.056], Cited: 40
Chen, T.H., Chue C.H. and Lee, H.T. 2004 ”Stress Singularities near the Apex of a Cylindrically Polarized Piezoelectric Wedge.” Archive of Applied Mechanics, 74, pp.248-261. (SCI,EI) [DOI: 10.1007/BF02637200] Cited: 10
Lee, H.T. and Chen M.H., Jao H.M. and Hsu, C.J. 2004 “ Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints.” Journal of Electronic Materials. Vol. 33, No.9.(2004) pp.1048-1054 (SCI,EI) [DOI: 10.1007/s11664-004-0034-9] , Cited: 52
Lee, H.T., Hsu, F.C.and Tai, T.Y. 2004 “Study of Surface Integrity Using the Small Area EDM Process with a Copper- Tungsten Electrode””. Material Science and Engineering A. 364(2004) pp.346-356. (SCI,EI) [http://dx.doi.org/10.1016/j.msea.2003.08.046] , Cited: 153
Lee, H. T., M. H. Chen, H. M. Jao, 2004, " Influence of Cu addition on the Adhesive Strength of the Sn-3Ag-1.5Sb Solder Joint,", Science and Technology of Welding and Joining, Vol.9, No.4.pp.555-559(SCI) [http://dx.doi.org/10.1179/136217104225021580], Cited:3
T. Y. Tai, H. T. Lee, and F. C. Hsu 2004 “The analysis of the surface integrity in micro-EDM process” 2004 International Symposium on Nano Sci. and Techn. Tainan, TAIWAN, 20-21 November 2004
Lee, H.T. Hsu Fu-Chuan, Tai Tzu-Yao & Hsu, Edward 2004 .”The Study of EDM Hole-Drilling Method for Measuring Residual Stress in SKD11 Tool Steel” ISEM XIV in Edinburgh in 2004, 14th International Symposium For Electromachining(ISEM)
許富銓、李驊登、戴子堯、D. Thomaidis、G. Antonoglou、D. Lung、F. Klocke. 2004."應用微放電加工技術改良放電鑽孔法於殘留應力量測之評估.”中國機械工程學會第二十屆全國學術研討會,
李驊登、陳明宏、李洋憲、黃文勇. .2004.03."界面IMC層對Sn-Ag-xSb無鉛銲料銲點破壞行為之影響” 中華民國第八屆破壞科學研討會論文光碟,台灣,墾丁
李驊登、胡順源、宋立文.2004.03."Sn-Ag-xSb無鉛銲料與Au/Ni-P/Cu金屬層接合銲點之剪切強度研究” 中華民國第八屆破壞科學研討會論文光碟,台灣,墾丁
李驊登、李政賢、陳柏瑋.2004.03.”不同Sb含量對Sn-Ag-xSb無鉛銲料可靠度之研究中華民國第八屆破壞科學研討會論文光碟,台灣,墾丁【中國材料學會破壞科學研討會九十三年度傑出論文獎】
李驊登、戴子堯、W.P.Rehbach、R.Harscheidt.2004.03.”以掃描式電子顯微鏡、雷射共焦掃描顯微鏡與白光干涉儀檢測放電加工鑽孔之比較” 中華民國第八屆破壞科學研討會論文光碟,台灣,墾丁
Lee, H.T., Rehbach Werner. P. Tai, T.Y. and Hsu, F.C. 2003 “Surface Integrity in Micro- Hole Drilling Using Micro- Electro Discharge Machining.” Jap. Material Transactions, Vol. 44, No.12 (2003) pp.2718-2722 (SCI,EI), Cited: 11
楊傳鏈、林文全、李驊登、陳興時、李文瑞 2003“矽的添加對M42高速鋼顯微組織及熱處理特性之影響”金屬熱處理, 第78期(2003),pp.26-31
Lee, H. T., M. H. Chen, H. M. Jao, T. L. Liao, 2003, "Influence of Interfacial Intermetallic Compound on Fracture Behavior of Solder Joints," Material Science and Engineering A, A358, pp.134-141 (SCI,EI) Cited: 289 [http://www.sciencedirect.com/science/article/pii/S0921509303002776],
Lee, H.T.,and Hsu, F.C. 2003 “ Feasibility Study of EDM Hole-Drilling Method for Residual Stress Measurement.” Materials Science and Technology. Vol. 19, no. 9, 2003, pp.1261-1265 (SCI,EI). [http://dx.doi.org/10.1179/026708303225005854], Cited: 15
Chue, C. H., Teng-Hui Chen, and Hwa-Teng Lee, 2003 “The Study of Popcorn Cracking under Vapor Pressure and Thermal Load”, IEEE Trans. On Components and Packaging Technologies, Vol.26, No2. pp.340-348. (SCI.,EI)
Lee, H. T., T. Y. Tai, 2003, “Relationship between EDM Parameters and Surface Crack Formation,” Journal of Materials Processing Technology, Vol. 142, Issue 3, 2003, pp. 676-683 (SCI.,EI) [http://dx.doi.org/10.1016/S0924-0136(03)00688-5] , Cited: 365
Lee, H. T., S. L. Jeng and T. Y. Kuo, 2003, “The Microstructure and Fracture Behavior of the Dissimilar Alloy 690-SUS 304L Joint with Various Nb Addition,” Metallurgical and Materials Transactions A, Vol.34A, May pp.1097-1105..(SCI,EI). [DOI: 10.1007/s11661-003-0129-6], Cited: 33
Kuo, T. Y., H. T .Lee and C. C. Tu, 2003, “ Evaluation of effects of niobium and manganese addition on nickel base weldments,” Science and Technology of Welding and Joining, Vol.8, No.1, pp.39-48.(SCI). [DOI:10.1179/136217103225010907] , Cited: 16
李驊登、陳玉華、戴子堯、許富銓. 2003.12. “鋼料之放電加工表面裂紋敏感性研究”中國機械工程學會第二十屆全國學術研討會, 台灣大學
陳明宏、李驊登、李洋憲、陳柏瑋. 2003.12. “冷卻率對Sn3.5Ag銲料微結構與機械性質之影響”中國機械工程學會第二十屆全國學術研討會, 台灣大學
胡順源、李政賢、李驊登、陳柏瑋. 2003.12. “添加Sb對Sn-Ag銲料之影響”中國機械工程學會第二十屆全國學術研討會, 台灣大學
許富詮、李驊登、戴子堯. 2003.12. “應用放電加工鑽孔法於不同材料之殘留應力檢測評估”中國機械工程學會第二十屆全國學術研討會, 台灣大學
鄭勝隆、李驊登、W.P. Rehbach、T.E.Weirich、范文傑. 2003.12. “Nb添加對鎳基690合金與SUS 304L不銹鋼異種金屬銲道枝晶間組織之影響”中國機械工程學會第二十屆全國學術研討會, 台灣大學
戴子堯、李驊登、許富詮. 2003.12. “微細放電加工於工具鋼微細鑽孔之研究”中國機械工程學會第二十屆全國學術研討會, 台灣大學
林文全、李驊登、劉全、昌增榮 2003.12. “KrF準分子雷射製程參數對再結晶多晶矽晶粒尺寸之影響”中國機械工程學會第二十屆全國學術研討會, 台灣大學
李驊登、戴子堯、許富銓.2003.11. “微細孔放電加工表面特性之研究” 中國材料科學學會2003材料年會論文光碟,台灣台南,崑山科技大學, (2003.11.21-22.)
李驊登、林文全、劉全、昌增榮 2003.11. “KrF準分子雷射對再結晶非晶矽薄膜之表面形貌的影響” 中國材料科學學會2003材料年會論文光碟,台灣台南,崑山科技大學, (2003.11.21-22.)
李驊登、林文全、劉全、昌增榮. 2003.11. “KrF準分子雷射對非晶矽薄膜再結晶行為之研究” 中國材料科學學會2003材料年會論文光碟,台灣台南,崑山科技大學, (2003.11.21-22.)
胡順源、李驊登、陳柏瑋、李洋憲.2003.11 ”Sn-Ag-Sb無鉛銲料與Au/Ni-P/Cu界面微結構研究.” 中國材料科學學會2003材料年會論文光碟,台灣台南,崑山科技大學, (2003.11.21-22.)
林永定、李驊登、鄭勝隆、郭聰源 2003.10.”以TEM分析鎳基合金高能量束異種銲件之研究.” 中華民國銲接學會92年度銲接論文發表會,
H.T. Lee, C.L. Yang, M.H. Chen and C.S. Li 2003.10.”Effect of Sb Addition on Microstructure and Shear Strength of Sn-Ag Solder Joints.” The 5 th International Conference on Fracture & Strength of Solids, Aobayama Campus , , Tohoku University, Sendai, Japan (Oct. 20-22, 2003)
H.T. Lee, S.L. Jeng, TH.E. Weirich, 2003. “Dissimilar weldments for high temperature corrosive environment application investigate by TEM,” Annual meeting of German Crystallographic Association, Berlin, March
Kuo, T.Y. and Lee, H.T., 2002, “Effects of Filler Metal Composition on Joining Properties of Inconel Alloy Weldments,” Mater. Sci. & Eng. A, A338, pp.202-212.(SCI,EI). [doi:10.1016/S0921-5093(02)00063-1], Cited: 74
Chue, C.H., Chen, T.H. and Lee, H.T., 2002, “A General Solution on Stress Singularities in the Junction of Two Anisotropic Materials,” Composite Structures 55, pp.81-93.(SCI,EI). [http://dx.doi.org/10.1016/S0263-8223(01)00131-3], Cited: 14
Lee H.T.; M.H. Chen,; S.-Y. Hu; C.-S. Li 2002, “Influence of Sb addition on microstructural evolution of Sn-Ag solder .”Advances in Electronic Materials and Packaging 2002,pp.139-144 https://ieeexplore.ieee.org/abstract/document/1188827 Cited: 3
Lee, H.T., T.L. Liao and M.H. Chen, 2002, “Study on microstructure and shear strength of Sn-Ag-Sb solder joints.” Electronic Materials and Packaging, 2001, IEEEXplore, pp.315-322, [http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=984003], Cited:9
Lee, H.T. and M.H. Chen, 2002, “Influence of Intermetallic Compound on Adhesive Strength of Solder Joint,” Material Science and Engineering A, A333 (2002), pp.24-34.(SCI.,EI) [http://dx.doi.org/10.1016/S0921-5093(01)01820-2], Cited: 161
H.-T. Lee, M.-H. Chen, S.-Y. Hu, C.-S. Li, 2002, “Influence of Sb Addition on Microstructural Evolution of Sn-Ag Solder,” Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. IEEE, EMAP conf. (Kaoshiung).
陳玉華, 李驊登, 許富銓, 戴子堯, 2002.11, “電極尺寸對放電加工表面特性之影響評估,” 中國機械工程學會第十九屆全國學術研討會論文光碟, 台灣, 雲林, 虎尾技術學院.
胡順源, 凌毓彥, 李驊登, 2002.11, “高溫環境下氧在Ti-6Al-4V表面擴散行為之研究,” 中國機械工程學會第十九屆學術研討會, 台灣 虎尾技術學院.
林燕村, 郭聰源, 李驊登, 吳家霖, 陳意維, 2002. 11, “改變Nd-YAG 雷射的輸出波型對鎳基690合金銲接特性影響之研究,” 中國材料科學學會2002材料年會論文光碟, 台灣, 台北, 台灣大學.
許富銓, 李驊登, 陳柏瑋, 戴子堯, 2002. 11, “放電加工表面裂縫防制法之研究,” 中國材料科學學會2002材料年會論文光碟, 台灣, 台北, 台灣大學.
胡順源, 凌毓彥, 李驊登, 2002.11, “Ti-6Al-4V 高溫氧化之研究,” 中國材料科學學會2002年材料研討會論文集, 台灣, 台灣大學.
李驊登, 楊仲霖, 林永定, 郭聰源, 2002.10, “電子束銲接製程參數對690合金與304L不銹鋼異材銲接之研究,” 中華民國銲接學會91年度銲接論文發表會, 台灣, 台中中興大學, ppA37-A44.
李驊登, 郭聰源,杜青駿,楊仲霖, 2002.03, "銲材中Nb、Mn合金的添加對鎳基690合金銲件機械性質與破斷行為影響之研究.” 中華民國第七屆破壞科學研討會年會論文光碟,台灣、屏柬、墾丁
陳明宏,李驊登,饒慧美, 廖天龍,” 2002.03, "界面金屬間化合物對錫銲接點破壞行為之影響.” 中華民國第七屆破壞科學研討會年會論文光碟,台灣、屏柬、墾丁【獲中國材料學會破壞科學研討會九十一年度傑出論文獎】
許富銓, 李驊登, 于劍平, 2002. 3, “放電加工表面裂縫的生成與型態之研究,” 中華民國第七屆破壞科學研討會論文光碟, 台灣, 墾丁.
凌毓彥, 李驊登, 胡順源, 2002.3, “Ti-6Al-4V 高溫熱壓裂紋成長機制之探討,”中華民國第七屆破壞科學研討會年會論文光碟, 台灣、屏東、墾丁.
Lee, H.T., Jeng, S.L., 2001, “Characteristics of Dissimilar Welding of Alloy 690 to 304L stainless steel,” Science and Technology of Welding and Joining, Vol.6, No.4, pp.225-234.(SCI). [https://doi.org/10.1179/136217101101538811] Cited: 50
李驊登, 楊仲霖, 侯文星, 黃英彬, 2001, “麻田散鐵系不鏽鋼GTD450之特性研究,”金屬熱處理,第70期, pp7-12.
Lee, H.T., Yur, C.P., 2001, “Optimization of EDM Process Parameters for Tungsten Carbide by Taguchi Method,” J of CSME, Vol.22, No.6.(EI).
Chue, C.H., T.H. Chen and H.T. Lee, 2001 21-23 May, “A General Solution of Stress Singularities in the Bonded Anisotropic Bimaterial Junction,” 4th. Pacific International Conference on Aerospace Science and Technology. Kaohsiung. Taiwan.
許富銓,于劍平,李驊登, 2001.“應用放電加工於應變規鑽孔法最適放電條件研究,”16th全國技術及職業教育研討會.
于劍平, 李驊登, 2001.4, “以銅鎢電極進行小面積放電加工之表面特性研究,” 第十六屆全國技術及職業教育研討會.
H.-T. Lee, T.-L. Liao, M.-H. Chen, 2001.11, “Study on Microstructure and Shear Strength of Sn-Ag-Sb Solder Joints,” The 3rd International Symposium on Electronics and Packaging 2001 (EMAP2001), Jeju Island, Korea.
許 多, 李驊登, 許富銓, 戴子堯, 2001.12, “SKD11工具鋼殘留應力之放電加工鑽孔量測法研究,” 第十八屆中國機械工程研討會, 第四冊 製造與材料集(下), pp.447-452, 台灣台北, 台灣科技大學.
許富銓, 李驊登, 戴子堯, 許多, 2001.12 “利用應變規鑽孔法探討放電加工之殘留應力,” 第十八屆中國機械工程研討會, 第四冊 製造與材料集(下), pp.633-640, 台灣, 台北, 台灣科技大學.
戴子堯,李驊登, 許富銓, 許 多, 2001.12, “放電加工參數與表面裂紋生成之關連性研究,” 第十八屆中國機械工程研討會, 第四冊 製造與材料集(下), pp.641-647, 台灣, 台北, 台灣科技大學.
顏志軒, 李驊登, 鄭勝隆, 楊仲霖, 郭聰源, 2001.12, “Ti合金元素添加對鎳基合金銲件之微結構與機械性質影響研究,” 第十八屆中國機械工程研討會, 第四冊 製造與材料集(上), pp.33-40, 台灣, 台北, 台灣科技大學.
李驊登, 廖天龍, 陳明宏, 2001.12, “添加微量Sb對Sn4.38Ag銲接點微結構的影響,” 第18屆機械工程研討會, 第五冊 新興工程技術論文集, pp.447-452, 台灣, 台北, 台灣科技大學.
李驊登, 廖天龍, 陳明宏, 2001.12, “添加微量Sb對Sn4.38Ag銲接點剪切強度的影響,” 第18屆機械工程研討會, 第五冊 新興工程技術論文集, pp.453-458, 台灣, 台北, 台灣科技大學.
李驊登, 顏志軒, 鄭勝隆, 楊仲霖, 郭聰源, 許富淵, 杜啟敏, 2001.11, “鎳基690合金銲件添加鈦之作業性與微結構研究,” 中華民國銲接學會90年度銲接論文發表會, 台灣, 台北市, ppA1-A7.
陳意維, 郭聰源, 李驊登, 姬俊宇, 施光亮, 黃仁隆, 2001.11, “Nd:YAG雷射銲接參數對304L不銹鋼之影響,” 中華民國銲接學會90年度銲接論文發表會, 台灣, 台北市, ppA14-A20.
陳意維, 郭聰源, 李驊登, 劉家銘, 施光亮, 黃仁隆, 2001.11, “雷射銲接690合金顯微組織特性分析,” 中華民國銲接學會90年度銲接論文發表會, 台灣, 台北市, ppA8-A13.
許富銓, 李驊登, 于劍平, 2001.12, “以單瓣應變規配合應變規鑽孔法量測單軸向殘留應力之可行性分析,” 第25屆全國力學會議, 台灣, 台中, 逢甲大學.
Lee, H.T., Shaue, G.H. and Kuo, T.Y., 2000, “The Study between the Behavior and the Thermomechanical Effect of Aluminum Alloy 2024-T3 by TPB Cracked Test,” J. of CSME, Vol.21, No.3, pp.293-301 (EI) (NSC83-0424-E006-095)
李驊登, 葉東昌, 鄭勝隆,郭聰源, 2000, “鎳基690合金銲件微組織與耐蝕性研究,”金屬熱處理, 64期, pp.28-39.
李驊登, 陳意維, 陳明宏, 2000, “平面高週波感應硬化研究,” 金屬熱處理, 64期, pp.18-27.
Lee, H.T., Yur, C.P., 2000, “Characteristic Analysis of EDMed Surface Using the Taguchi Approach,” Materials and Manufacturing Process. Vol.15. No.6. pp.781-806.(SCI,EI). [https://doi.org/10.1080/10426910008913021] Cited: 75
李驊登,張家銘,鄭欽維. 2000. “Ti-6Al-4V鍛造表面裂紋之研究,”中華民國第六屆破壞科學研討會, 3/22-23,墾丁.
葉東昌, 鄭勝隆, 李驊登, 郭聰源, 2000. “鎳基合金銲件之析出物與耐蝕性之關連性研究,” 中華民國第六屆破壞科學研討會, 3/22-23, 墾丁.
于劍平,李驊登, 2000. ”碳化鎢放電加工表面破壞特性,”中華民國第六屆破壞科學研討會年會論文, 3/22-23,墾丁.
郭聰源. 李驊登, 鄭勝隆, 2000.4, “I-52與I-82銲材對690合金銲件之耐蝕性與機械性質影響研究,” 第十五屆全國技職教育研討會論文:機械組, pp.277-286.
李驊登,許富銓,于劍平, 2000, ”放電加工鑽孔法量測殘留應力知校正研究 ”中國機械工程學會17th學術研討會C070.
李驊登, 鄭欽維, 凌毓彥, 洪廷甫, 2000 ,”Ti-6AI-4V表面α-case之生成研究,”中國機械工程學會17th學術研討會D100.
李驊登,于劍平,2000,“碳化鎢放電加工表面缺陷生成之研究,”中國機械工程學會17th學術研討會 D101.
李驊登,陳明宏,饒慧美,2000,“Sn-3Ag-xSb銲接點微結構探討,”中國機械工程學會17th學術研討會,E068.
李驊登,陳明宏,饒慧美, 2000, “Sn-3Ag-xSb銲料與銅接和附著強度變化”中國機械工程學會第十七屆學術研討會E069.
Lee, H. T., T.Y. Kuo, 1999, “Analysis of Microstructure and Mechanical Properties for Alloy 690 Weldments Using Filler Metals I-82 and I-52,” Science and Technology of Welding and Joining, Vol. 4, No.2, pp.94-103.(SCI) (NSC85-2216-E006-027), Cited: 24
Lee, H. T., G.H. Shaue, 1999, “The Thermomechanical Behavior for Aluminum Alloy under Uniaxial Tensile Loading,” Material Science and Engineering A 268, pp.154-164.(SCI,EI). Cited: 36
Lee, H.T. and Kuo, T.Y., 1999, ” Mechanical Properties and Corrosion Behavior of Alloy 690 Weldments Using I-52 and I-152 Metals”, J. of CSME, Vol. 20. No.3, pp.277-285.(EI). (NSC85-2216-E006-027, NSC87-2216-E006-011)
Lee, H.T. and Kuo, T.Y., 1999, ”Effects of Niobium on the Microstructure, Mechanical Properties and Corrosion Behavior in Weldments of Alloy 690,” Science and Technology of Welding and Joining, Vol.4, No.4, pp.246-256. (SCI). (NSC87-2216-E006-011), Cited: 24
2006, “Sn‐Ag‐X無鉛銲料系添加Sb、Cu及In之效益評估與銲點性質測試分析” 國科會專題,
2006, “汽車零件破損分析實務指導及能力提升(三)”嚴慶齡基金會
2005, “國立成功大學貴重儀器使用中心服務計畫(2/2)” 國科會, NSC
2005, “汽車零件破損分析實務指導及能力提升(二)”嚴慶齡基金會
2004, “Sn‐Ag‐xSb無鉛銲料於Ni‐P金屬層與不同冷卻速率下之低週疲勞研究” 國科會, NSC 93‐2216‐E‐006‐028 .
2004, “國立成功大學貴重儀器使用中心服務計畫(1/2)” 國科會, NSC93‐2731‐M006‐001‐
2004, “汽車零件破損分析實務指導及能力提升(一)”嚴慶齡基金會
2003, “玻璃/銅背電極/氧化鋁阻障層之基板應用於矽薄膜太陽能電池雷射長晶技術之研究,”國科會 NSC92‐2212‐E‐
2002, “國立成功大學貴重儀器使用中心服務計畫” 國科會91‐2731‐P‐006‐001‐
2002, “應用雷射、電子束再結晶非晶矽太陽能電池薄膜之研究,” 國科會專題, NSC91‐2212‐E‐003 –147..
2001, “Sn‐Ag‐X銲料係銲接點之等溫疲勞與熱機疲勞性質研究,” 國科會專題, NSC90‐2216‐E‐006‐056.
2001, “尺寸效應對微放加工後表面特性之影響評估,” 國科會專題, NSC‐90WFA0900538.
2000, “Ti合金元素之添加對鎳基690銲件結構之改質設計研究,” 國科會專題, NSC89‐2216‐E‐006‐065.
2000 “無鉛銲錫與傳統鉛錫銲錫銲接點之機械性質與顯微組織比較分析[2/2],” 國科會專題, NSC89‐2218‐E‐006‐076.
2000, “新型電動六軸運動平台及模擬訓練系統之設計,”(與陳鐵城 ) 台中精機委託專題, 88C31.
1999, “以科技諮詢網際網站架設建立南區工業資訊服務網(II),” (與林裕城 ) 慶齡基金會專題, 88S32.
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