Research

vdW building blocks (2D materials & freestanding 3D materials)

We develop van der Waals (vdW) material building blocks spanning both two-dimensional (2D) crystals and freestanding 3D membranes. Our approach enables deterministic release and transfer of ultra-thin layers while preserving crystal quality, surface cleanliness, and mechanical integrity. By treating these materials as modular “Lego-like” components, we create clean, lattice-agnostic interfaces and assemble heterogeneous stacks for next-generation electronic and optoelectronic systems. Ultimately, we aim to establish scalable pathways from high-quality materials to integrable platforms for 3D heterogeneous integration and advanced semiconductor devices.

# CVD, Epitaxy, singlecrystal semiconductors, TMDCs, 2D crystals, Nanomembranes

vdW Heterogeneous Integration for 3D Electronics & Optoelectronics

We focus on vdW-enabled heterogeneous integration as a manufacturing route for vertically stacked (3D) electronic and optoelectronic systems. Instead of relying on epitaxial compatibility, we integrate dissimilar functional layers through low-damage, transfer-based assembly, targeting interfaces that remain electronically clean and process-compatible. Our research emphasizes stack architecture design (order, thickness, and interface control), yield and alignment strategies, and reliability under thermal/mechanical loading, key requirements for practical 3D integration. This platform aims to deliver compact, multifunctional stacks that combine sensing, logic, and photonics within a single 3D framework.

# 3DHI, Advanced packaging, vdW assembly & disassembly, Bonding

3D applications

Building on our vdW-enabled stacking and bonding platform, we demonstrate application-level device stacks that translate heterogeneous integration into measurable system functions. We target broadband optoelectronic modules (photodetection and optical interfacing), sensing layers, and functional layers tailored for mechanically and thermally robust operation. These demonstrations define a practical route to scalable 3D integration, where stacked functions meet packaging-level requirements in process compatibility and reliability.

# Edge devices, (opto)electronics, sensing, multifunctional 3D modules

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