For a complete and updated list of publications, please visit Google Scholar.
Journal Publications
2026
1. "Analytical Extraction of Thermal Resistance in Power Semiconductors Using Structural Function Derivatives and Series Resistance Modeling," IEEE Access, Feb. 2026.
2. "Calibration-Based Electrical Estimation of Transient Self-Heating in Packaged Si and SiC Power FETs Using Pulsed I–V Measurements," Electronics, Oct. 2026
2025
1. "Temperature Dependent Modeling of Silicon Strain Gauge-Based Pressure Sensors for Automotive Applications," IEEE Sensors Letters, Aug. 2025.
2. "Abnormal Operation of 6-T SRAM based on Nanosheet FET due to Total Ionizing Dose," IEEE Access, Sep. 2025.
3. "Single Event Upset and Total Ionizing Dose Effects on DDR4 DRAM Due to Proton Irradiation Under Different Temperatures," IEEE TED, Sep. 2025.
2024
1. "Analysis of Failure Mechanism and Reliability Enhancement of Silicon Strain Gauge-Based Pressure Sensor for Automotive Applications," Sensors, Feb. 2024.
2. "Reliability Analysis of LiDAR Sensor for Automotive Applications," Transaction of KSAE, Feb. 2024.
3. "Comprehensive Hammering and Parasitic BJT Effects in Vertically Stacked DRAM," IEEE Access, Oct. 2024.
Conference Publications
2025
1. J. Lee, H. Lee, and H. Sagong*, "Temperature Dependent Modeling of Silicon Strain Gauge-Based Pressure Sensors for Automotive Applications," IEEE SENSORS, Vancouver, Canada, Oct. 19–22, 2025.
2. C. Han, K. Lee, H. Lee, J. Lee, and H. Sagong*, "Analysis on Thermal Resistance Characteristics of Power Semiconductors through Structure Function Differentiation," KSAE 2025 Annual Spring Conference, Jeju, Korea, May 21–23, 2025. [Best Paper Award]
2024
1. J. Lee, C. Han, H. Lee, and H. Sagong*, "Study on Temperature Dependent Modeling of Automotive Pressure Sensors," KSAE 2024 Annual Spring Conference, Geoje, Korea, Jun. 19–22, 2024. [Best Paper Award]
2. C. Han, H. Lee, J. Park, and H. Sagong*, "Analysis on Reliability Enhancement of Zero Current Transformer," KSAE 2024 Annual Spring Conference, Geoje, Korea, Jun. 19–22, 2024.
3. K. Lee, H. Lee, J. Jo, and H. Sagong*, "Reliability Enhancement through Process Improvement of Discharge Resistor of DC-DC Converter," KSAE 2024 Annual Spring Conference, Geoje, Korea, Jun. 19–22, 2024.
4. H. Lee, C. Han, J. Lee, K. Lee, and H. Sagong*, "Reliability Analysis of Hydrogen Pressure Sensor for Automotive Applications," Sensors 2024, Barcelona, Spain, Oct. 23–25, 2024.
2023
1. J. Lee, H. Lee, G. Koo, H. Kim, and H. Sagong*, "Study on Reliability of Wireless Power Transfer Module for Automotive Seat," KSAE 2023 Annual Autumn Conference, Ulsan, Korea, Nov. 15–18, 2023.
2020
1. H. Sagong, K. Choi, H. Jiang, J. Park, H. Rhee, and S. Pae, "Reliability of Advanced FinFET Technology Nodes Beyond Planar: Invited," IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Penang, Malaysia, 2020. [Invited Paper]
2018
1. H. Sagong, K. Choi, J. Kim, T. Jeong, M. Choe, H. Shim, W. Kim, J. Park, S. Shin, and S. Pae, "Modeling of FinFET Self-Heating Effects in Multiple FinFET Technology Generations with Implication for Transistor and Product Reliability," IEEE Symposium on VLSI Technology, Honolulu, HI, USA, Jun. 18–22, 2018.
2. H. Sagong, H. Kim, S. Choo, S. Yoon, H. Shim, S. Ha, T. Jeong, M. Choe, J. Park, S. Shin, and S. Pae, "Effects of Far-BEOL Anneal on the WLR and Product Reliability Characterization of FinFET Process Technology," IEEE International Reliability Physics Symposium (IRPS), Burlingame, CA, USA, Mar. 11–15, 2018.
Registered Patents
[US Patents ]
2023
1. "Semiconductor Device Having Gate Electrodes and Methods of Manufacturing the Same," US Patent No. 11,563,002, 2023.
2022
1. "Semiconductor Device Including Test Structure," US Patent No. 11,488,877, 2022.
2. "Semiconductor Device Including a Gate Structure with a Wider End Portion than a Linear Portion," US Patent No. 11,245,018, 2022.
2021
1. "Semiconductor Device and Method for Fabricating the Same," US Patent No. 10,943,900, 2021.
2019
1. "Semiconductor Device," US Patent No. 10,490,477, 2019.
2. "Semiconductor Device and Method of Manufacturing the Same," US Patent No. 10,262,998, 2019.
2018
1. "FinFET and Method of Forming Fin of the FinFET," US Patent No. 9,892,977, 2018.
2017
1. "Semiconductor Device Including a Fin Pattern," US Patent No. 9,728,486, 2017.
2025
1. "Electronic Component Module and Method for Manufacturing Electronic Component Module," Korean Patent No. 10-2843154, 2025.
2024
1. "Semiconductor Device and Method for Fabricating the Same," Korean Patent No. 10-2626334, 2024.
2023
1. "Semiconductor Device Including Test Structure," Korean Patent No. 10-2600786, 2023.
2. "Semiconductor Devices," Korean Patent No. 10-2595606, 2023.
3. "Semiconductor Device Having Gate Electrode and Method of Manufacturing the Same," Korean Patent No. 10-2620342, 2023.
2022
1. "Semiconductor Device and Method for Manufacturing the Same," Korean Patent No. 10-2481480, 2022.
2. "FinFET and Method for Forming Fin of the FinFET," Korean Patent No. 10-2432464, 2022.
2021
1. "Semiconductor Device and Method for Fabricating the Same," Korean Patent No. 10-2343223, 2021.
2. "Semiconductor Device," Korean Patent No. 10-2287406, 2021.