Welcome to PCBA Standard-to-Real Grand Challenge !

Rio de Janeiro, Brazil — 10–14 November 2026.

📢 Competition Now Open

The PCBA Standard-to-Real Grand Challenge is now open on Codabench. Participants can register for the challenge on HuggingFace by applying for a Dataset and submitting their prediction files through the official competition platform.

For our Grand Challenge, the top-3 performing teams will be invited to submit Grand Challenge papers for inclusion in the ACM MM 2026 main conference proceedings.  Grand Challenge papers must follow the official ACM Multimedia 2026 author instructions and are limited to 6 pages plus 2 additional pages for references. 

🔗  Competition Platform: PCBA Standard-to-Real Grand Challenge on Codabench

📮 Contact: aimmifm@gmail.com

📖 About the Challenge

Manufacturing inspection requires understanding product rules, context-dependent defect definitions, and the causes behind anomalies. On real production lines, engineers need more than just bounding boxes—they need actionable decisions. Understanding why it occurred and how to handle it requires deep manufacturing knowledge, such as polarity rules and packaging conventions.

Factory decision-making relies on two important sources: theoretical standards and cluttered real-world imagery. Current VQA models performing well on clean, isolated components often fail drastically on dense, heterogeneous motherboard assemblies due to severe domain shift.

🎯 Our Mission

The PCBA Standard-to-Real Challenge frames PCBA Surface-Mount Technology (SMT) inspection as a cross-domain Visual QA task. We invite researchers to develop robust multimodal systems capable of generalizing from normative standard illustrations to real-world industrial environments.

Important Notice： ACM Multimedia 2026 is an on-site event only. This means that all papers and contributions must be presented by a physical person on-site; remote presentations will not be hosted or allowed. Papers and contributions not presented on-site will be considered a no-show and removed from the proceedings of the conference.  More details will be provided to handle unfortunate situations in which none of the authors would be able to attend the conference physically.

Sponsors

Organizers