My work with the UCB experimental cosmology group consists of running thermal simulations on the readout electronics and designing and testing experiments to validate these simulations. In my time with the group I have run simulations on both the Polarbear design and the upcoming LiteBIRD design.
Static Thermal Simulations
This is a side shot of the displacement of the readout electronics assembly, we can clearly see how the temperature is causing it to twist, which generates high stresses in the fragile silicon chip.Â
The plots above(Displacement on the Right and Stress on the Left) illustrate how the unsecured corners of the aluminum shield are where the maximum displacement occurs. This in turn causes an area of high stress right down the center of the silicon chip. While the stress shown in this simulation is not high enough to break the chip, it is so close that any imperfection in the chip or differences in the real world could easily push the stress high enough to cause catastrophic failure. To combat these stresses I am working on resigning the way the silicon is mounted to the circuit board. Rather than using an epoxy we are moving towards a clamping style solution.