Innsbruck, Austria
http://hpcs2016.cisedu.info/ or http://cisedu.us/rp/hpcs16
In Cooperation with ACM, IEEE, and IFIP
(HPCS 2016)
July 18 – July 22, 2016
The International Conference on High Performance Computing & Simulation
and Liaisons
The HPCS 2016 Conference is looking for interested Industry Partners and organizations that would like to have an exhibit, participate in HPCS 2016 activity (tutorials, demos, panels, posters, paper presentation, speaker sponsorships, etc.), and/or be interested to sponsor Conference amenities or social activities (e.g., awards, evening exhibit reception, banquet sponsorship, special break snacks, registration handout packets, etc.).
If an industry representative or an organization is interested in becoming an HPCS 2016 Industry Partner, please contact the Industry Liaisons & Sponsorships Co-Chairs:
Maged M. Ghoneima
Nvidia Corp., Santa Clara, California, USA
Phone: +1 408
Fax: +1 408
Email: mghoneima@nvidia.com
Yannick Legré, Director of EGI.eu
European Grid Infrastructure (EGI.eu)
Amsterdam, The Netherlands
Phone: +31 (0)20 89 32 007
Fax: +31
Email: Yannick.Legre@egi.eu
Shuo Li
INTEL Corporation, Oregon, USA
Phone: + 1 (503) 696-8943
Fax: + 1 (503)
Email: shuo.li@intel.com
Josef Spillner
Zurich University of Applied Sciences, Service Prototyping Lab
Winterthur, Switzerland
Phone: + 41 58 934 45 82
Fax: + 41 58 935 45 82
Email: josef.spillner@zhaw.ch
TBA
TBA
Phone: +
Fax: +
Email:
INVITATION TO HPCS 2016 PARTNERS AND SPONSORS (Link)
HPCS 2016 Industry Partners, Participants