Avinash Kumar

Research Scholar

k.avinash.sp@gmail.com



Short Bio

Avinash Kumar joined the institute as a Research scholar in January 2019. He received his M.Tech. in Thermal Engineering from NIT Silchar in 2017 and B.Tech in Mechanical Engineering from Rajasthan Technical University. His research interest are Microfluidics and Nanofluidics, Electrohydrodyamics, Thermal management systems,  Fluid flow and heat transfer through micro-confinements.

Publications

1. A. Kumar, S. Nath, D. Bhanja, Effect of nanofluid on thermo hydraulic performance of double layer tapered microchannel heat sink used for electronic chip cooling, Numerical Heat Transfer, Part A: Applications, 73 (2018) 429-445. 

https://doi.org/10.1080/10407782.2018.1448611. (SCI, Impact Factor: 2.569).


2. A. Kumar, C. Bakli, Interplay of wettability and confinement enhancing the performance of heat sinks, Applied Thermal Engineering, 214 (2022) 118865. 

https://doi.org/10.1016/j.applthermaleng.2022.118865. (SCI, Impact Factor: 6.4).


3.  A. Kumar, A. Das, C. Bakli, Modulating fluid rheology and confinement toward augmenting the performance of a double layered microchannel heat sink, Heat Transfer. 

(2023). https://doi.org/10.1002/htj.22990 (SCI, Impact Factor: 3.6).


4.  K. Saha, J. Deka, A. Kumar, M. Mondal, B.R. Boro, C. Bakli, A. Sood, S. Chakraborty, K. Raidongia, Carbonized Cotton Fibres for Ultra-High Power-Density Electrokinetic Energy Harvesting, ACS Applied Energy Materials, 7, (2023) 176–185. https://doi.org/10.1021/acsaem.3c02409. (SCI, Impact Factor: 6.959).


5. A. Das, A. Kumar, C. Bakli, Interplay of fluid rheology and micro-patterning towards modulating draining characteristics on an inclined substrate. Physics of Fluids, 36, (2024) 023116. https://doi.org/10.1063/5.0189609. (SCI, Impact Factor: 4.6)

Awards and Recognitions

Best Poster Award for “DNA translocation through modified solid state nanopore” in 2nd International Conference on FLUIDS UNDER CONFINEMENT organized by IIT Kharagpur and university of Warwick, March 2021.