Sunshine Thermal Camera Software Download ##VERIFIED##

3.infrared camera and visible light ,The infrared camera can easily detect the abnormal area of the motherboard, and the visible light camera can extract the outline of the motherboard, flexibly enlarge the details of the motherboard, and quickly and accurately detect the problem.

Electrical thermal scanning is able to identify issues with your electrical infrastructure before they become major problems. Thermal Scanners specialise in Electrical Thermal scanning and operate within the Sunshine Coast Region. The majority of electrical problems cannot be detected with the naked eye before failure occurs, but instead can be found early through electrical thermal scanning. Thermal Scanners can help verify the health of your electrical System within the Sunshine Coast.

Sunshine Thermal Camera Software Download

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There has been a recent trend in insurance companies asking businesses to complete electrical thermal scanning of their electrical boards to obtain their insurance policy. This is to mitigate against fire risks and reduce the chance of fatalities and property damage. As there have been an increased amount of electrical fires around the Sunshine Coast region.

As part of the service, Thermal Scanners complete the scan at your Sunshine Coast premise and within one business day provide the insurance complaint thermal survey report. The report will outline all thermal exceptions and provide a space for any repairers comments.

As a nondestructive sensing technique, thermal wave sensing has advantages of non-contact, fast and effective. According to whether external thermal excitation sources are needed, thermal wave sensing can be divided into passive thermal wave sensing and active thermal wave sensing [16]. Active thermal wave sensing is mainly used for the detection of debonding of composite materials and surface defects of parts when the thermal wave of tested objects is equivalent to the surrounding environment. There are few studies focused on adhesive bonded structure damage detection of hidden framing glass curtain wall using thermal method. Researches on active thermal wave sensing for damage detection include thermal excitation and thermal image enhancement. In the studies of thermal excitation, different thermal excitation sources and thermal excitation functions are used to detect specific objects. The normal thermal excitation sources used in thermal wave testing include flash lamp [17], light emitting diode (LED) [18], terahertz [19], microwave [20]. For example, Yang Z. et al. improved the uniformity and energy utilization of pulsed flash lamp excitation by fabricating cover and reflector [17]. Pickering S.G. et al. used high-power LED arrays as thermal excitation for long pulsed and lock-in thermal excitation to detect carbon fiber-reinforced plastic with artificial defects [18]. Pulsed thermal excitation [21], pulsed phase thermal excitation [22], lock-in thermal excitation [23] and modulation thermal excitation [24,25] are commonly used as thermal excitation functions. For example, Tao N. et al. detected the glue faults between supporting spars and glass fiber-reinforced plastic shells with different thickness by using pulsed thermography [21]. Brown J. et al. studied and compared the phase images of lock-in thermal excitation and constant step thermal excitation on detection of fiber-reinforced plastic strengthened bridge [23]. Guo X. et al. carried out modulated infrared thermal wave nondestructive testing for cladding debonding detection of solid rocket motors by finite element method [24]. A variety of thermal excitation sources are available in thermal wave testing, but have disadvantages of uniformity of thermal excitation and high-power consumption. By optimizing the thermal excitation source, the uniformity of thermal excitation and power consumption can be improved. For different objects, different thermal excitation functions should be applied. For bonded structures, pulsed thermal excitation is suitable for its simple thermal image sequence processing.

In the researches of thermal image enhancement, conventional image processing technologies have been applied to thermal image enhancement, such as principal component analysis [26], signal reconstruction [27], thermographic signal reconstruction (TSR) [28,29], wavelet transform [30] and adaptive image enhancement [31]. For example, Zheng K. et al. proposed a mathematical morphology for the analysis of geometrical structures to highlight the defects of carbon fiber reinforced plastics by subtracting backgrounds [26]. Shepard S.M. used a logarithmic function to fit the temperature curve and reconstructed temperature curve to reduce the influence of non-uniform emissivity [27]. Chapuis B. quantitatively assessed the improvement of the detectivity of defects in smart composite repair patch using TSR approach [28]. Wang J. et al. put forward to an image denoising method based on wavelet transform to reduce the noise of thermographic data [30]. Wu Y. et al. proposed an adaptive thermal image enhancement method based on contourlet transform and adaptive chaotic variation particle optimization to suppress noise and enhance details [31]. In conclusion, these conventional image processing technologies get great results on the improvement of contrast ratio and highlighting defect of thermal image. But, there is still little research of thermal image enhancement on adhesive bonded structure damage of glass materials.

Thermal wave testing uses a thermal excitation source to heat the object to be inspected. The damaged region forms a significant temperature difference with the normal region. The application of active thermal sensing to damage detection has advantages of intuitive, reliable, fast and effective. Taking electromagnetic radiation as heat source has advantages of non-contact, good uniformity, and a large detection area, which is suitable for adhesive bonded structure of glass curtain wall. In this paper, the active thermal sensing is used to detect adhesive bonded structure damage. A mid and far infrared (MFI) thermal excitation device with pulse function is designed and optimized for the testing of adhesive bonded structure damage. Moreover, image fusion enhancement is used to highlight the defects on thermal images.

Equation (2) shows that the temperature of curtain wall glass will rise after receiving thermal excitation radiation, and the irradiance of glass is proportional to the fourth power of the absolute temperature. Thus, the temperature of glass can be detected by using infrared camera to capture the irradiance. Compared with contact testing, thermal wave testing has the advantages of no influence on the surface temperature distribution of the glass, short response time and being suitable for large testing area, which greatly improve the efficiency of damage detection.

MFI radiation is mostly absorbed by the surface of the glass when it irradiates on the glass curtain wall, causing the temperature rising of the glass surface. Then, heat transfers to the interior of the glass in the form of direct thermal wave. The glass curtain wall can be approximated as an infinitely large multi-layer board without an internal heat source. In the thermal wave testing for adhesive bonded structure of glass curtain wall, the propagation of heat wave in adhesive bonded structure of glass curtain wall can be regarded as a one-dimensional unsteady heat conduction without inner heat source (Figure 1). The differential equations of one-dimensional unsteady heat conduction are shown in Equation (3):

During the thermal wave testing of glass curtain wall, the power of thermal excitation source is far greater than the power loss to the environment. Ignoring the heat conduction of the environment and the glass curtain wall, the glass is only affected by the MFI radiation source. The thermal excitation can be express by the following equation:

To simplify the subsequent analysis, detection temperature scale T0 = 0 was used in thermal wave testing. The final temperature distribution of the glass needs to add the true temperature of the glass curtain wall.

When there is a damaged in adhesive bonded structure, the heat wave is blocked to the deep layer of the structural adhesive. Reflected heat wave is formed at the damage interface, which is reflected again when it propagates to the surface of the glass [33]. As shown in Figure 2, the thermal wave is composed of direct thermal wave from the thermal excitation and reflected heat wave, causing the temperature of glass rising. Due to the rapid attenuation of reflection thermal wave, the reflected heat wave on the surface of glass is neglected. A heat conduction differential equation system of reflected heat wave, which is similar to the Equations (3) to (7), can be constructed. The derivation process is omitted. However, it will cause complex formulas and solving processes. The system theory is utilized to simplify the process. Analyzing the differential equations in the s-domain, theoretical relationships can be obtained as follow:

The infrared (IR) camera can only capture the surface temperature of the glass. The transfer function of the glass surface temperature T1(0, s) is called the thermal response of glass, showed as follow:

When there is a damaged in adhesive bonded structure, the thermal wave is composed of direct thermal wave from the thermal excitation and reflected heat wave. Therefore, the transfer function of the glass surface temperature with damaged bonded structure can be expressed as follow:

The thermal response of composite thermal excitation is a linear superposition of the multiple thermal excitation responses. The Laplace inverse transformation is performed on both sides of the Equation (16). Considering the initial temperature, the actual temperature of glass surface is as follows:

For a specific glass curtain wall, the surface temperature of the glass is only related to the thermal excitation, time and structural modulation function. The structural modulation function can be identified from the temperature change of the surface of the glass, thereby making it possible to detect the damage of adhesive bonded structure. ff782bc1db