In ultra-low temperature environments, bonding methods are often limited to soldering. In applications such as sensors and light sources that are exposed to cryogenic conditions, solder joints may be subject to thermal stress due to rapid temperature changes.

Under these conditions, we evaluated the performance of ONE-HAND MIXING® using repeated immersion in liquid nitrogen (−196°C). The results indicated that even after 10 cycles of immersion, adhesion strength was largely maintained, and cohesive failure was observed.

These findings suggest the potential applicability of this material for bonding components used in cryogenic environments.

✅Results Confirmed in This Evaluation

• After repeated immersion in liquid nitrogen (−196°C), adhesion strength decreased from 7.5 MPa to 5.4 MPa, corresponding to a retention rate of approximately 72%.

• The failure mode observed after testing was cohesive failure, rather than interfacial delamination.

• These results provide initial data supporting the potential use of this material in ultra-low temperature environments.

✅Potential Applications

• Electrical connections for sensors and light sources used in cryogenic environments

• Component fixation inside low-temperature test equipment

• Laboratory equipment utilizing liquid nitrogen

• Research and development involving ultra-low temperature evaluation

• Aerospace-related evaluation systems

✅Summary 

This evaluation confirmed that ONE-HAND MIXING® maintained adhesion performance under liquid nitrogen (−196°C) immersion cycling.

While material selection must be determined according to specific design and safety requirements, these results suggest potential applicability in bonding applications where cryogenic exposure is anticipated.

Further technical data and evaluation samples are available upon request.