2D TMDC semiconductors: MoS₂, hBN
SiO₂ metasurface
Si nanodisc array metasurface
Gold nanorod array metamaterial
Silicon nanowire arrays
Porous silicon
Silicon quantum dots
Electron-beam lithography (ELS-BODEN100)
H₂O plasma cleaning (AQ-500)
Electron-beam evaporation (ADS-E86, ADS-E810)
Silicon deep RIE (ASE-SRE)
CCP-RIE (RIE-200NL)
Nano-electroplating
Metal-assisted chemical etching (MACE)
RF/DC sputtering
Anodization
Sintering / annealing
Hyperspectral imaging
Raman & photoluminescence spectroscopy (Renishaw inVia)
Atomic force microscopy (HITACHI-AFM100)
FE-SEM + EDX (S-4800)
Spectroscopic ellipsometry (M2000U)
UV/Vis/NIR spectroscopy (Jasco V-7200)
Stylus surface profiler (Dektak XT-A)
Parameter analyzer (Keithley 4200A-SCS)
FTIR
UV-Vis
XRD
XPS spectroscopy
HRTEM
Differential scanning calorimetry (DSC)
Thermogravimetric analysis (TGA)
BET surface area analysis
Drop shape analysis
Software & Miscellaneous Skills:
Design & Simulation: K-Layout, TRACER (PEC), BEAMER, MEEP, Python, COMSOL, MATLAB, Lumerical FDTD, TCAD, SRIM, LabView
General Tools: MS Office Suite, Origin, LaTeX, Blender
Other: Documentation, research procedures & supervision, written & oral communication
Optical biosensors
Solar photovoltaic (PV) devices
Lithium-ion batteries (LIB)
Electrical gas sensors
Superhydrophobic surfaces