IPC 2221 Generic Standard on Printed Board Design: How to Choose Materials, Layouts, and Dimensions for Your PCBs

IPC 2221 Generic Standard on Printed Board Design

IPC 2221 is a standard developed by the Institute for Interconnecting and Packaging Electronic Circuits (IPC) that provides guidelines and requirements for the design of printed board assemblies. Printed boards are electronic circuits that consist of conductive and dielectric layers, components, and interconnections. Printed board design involves the selection of materials, layout, fabrication, assembly, and testing of printed boards. IPC 2221 covers various aspects of printed board design, such as electrical, mechanical, thermal, environmental, and reliability considerations.

Scope and Purpose of IPC 2221

IPC 2221 is intended to serve as a generic standard that can be applied to any type of printed board design, regardless of the technology, application, or complexity. It provides the basic principles and rules for printed board design, as well as references to other IPC standards that contain more specific or detailed information on certain topics. IPC 2221 does not prescribe how to design a printed board, but rather what factors to consider and what criteria to meet. The purpose of IPC 2221 is to facilitate the communication and understanding between printed board designers, manufacturers, and users, as well as to promote the interchangeability and improvement of printed board products.

IPC 2221 Generic Standard On Printed Board Design.pdf

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Structure and Content of IPC 2221

IPC 2221 is divided into eight sections, each covering a different aspect of printed board design. The sections are as follows:

Section 1: Scope. This section defines the scope and purpose of IPC 2221, as well as the terms and definitions used in the standard.

Section 2: Design Requirements. This section specifies the general requirements for printed board design, such as quality, reliability, performance, compatibility, safety, and documentation.

Section 3: Electrical Design Considerations. This section covers the electrical aspects of printed board design, such as signal integrity, power distribution, grounding, shielding, electromagnetic compatibility, and testing.

Section 4: Materials. This section covers the selection and properties of materials used in printed board design, such as dielectric base materials, conductive materials, electronic component materials, and soldering materials.

Section 5: Dimensional Requirements. This section covers the dimensional aspects of printed board design, such as size, shape, thickness, tolerance, warpage, and dimensional stability.

Section 6: Conductors. This section covers the design of conductors on printed boards, such as traces, pads, vias, lands, holes, and edge connectors.

Section 7: Holes and Interconnections. This section covers the design of holes and interconnections on printed boards, such as hole types, sizes, locations, plating, annular rings, clearance areas, and interlayer connections.

Section 8: Assembly Requirements. This section covers the assembly aspects of printed board design, such as component placement, orientation, mounting methods, soldering methods, cleaning methods, marking methods, and inspection methods.

Each section of IPC 2221 contains tables, figures, examples, notes, and references to provide further guidance and clarification on the topics covered. IPC 2221 also includes appendices that contain additional information on topics such as thermal management, high density interconnects, flexible circuits, rigid-flex circuits, embedded components, surface mount technology, ball grid arrays, chip scale packages, land grid arrays, flip chip technology, microvias, blind and buried vias, impedance control, differential signaling, crosstalk reduction, noise reduction, EMI reduction, ESD protection, creepage and clearance distances, voltage breakdown, arc tracking, flammability ratings, moisture sensitivity levels, thermal expansion coefficients, thermal conductivity values, dielectric constants values, loss tangent values, copper foil types and thicknesses, plating types and thicknesses, solder types and compositions, solder mask types and colors, legend types and colors, surface finishes types and characteristics, hole aspect ratios values, annular ring values, via resistance values, via inductance values,

via capacitance values,

component types sizes shapes terminations and orientations, component density values, component spacing values, component height values, component weight values, component thermal resistance values, component power dissipation values, component derating factors, component reliability factors, and component testing methods.

IPC-2221B Generic Standard on Printed Board Design

IPC-2221 Task Group (D-31b) of the Rigid Printed Board Committee (D-30) of IPC

IPC-2221 documentation hierarchy

IPC-2221 presentation and interpretation

IPC-2221 definition of terms and microvia

IPC-2221 design requirements for electrical characteristics

IPC-2221 design requirements for thermal management

IPC-2221 design requirements for testability

IPC-2221 design requirements for reliability

IPC-2221 design requirements for manufacturability

IPC-2221 design requirements for assembly

IPC-2221 materials selection for structural strength

IPC-2221 materials selection for electrical properties

IPC-2221 materials selection for environmental properties

IPC-2221 dimensional stability and warpage

IPC-2221 dielectric materials and laminates

IPC-2221 conductor materials and plating

IPC-2221 solder resist and coverlay materials

IPC-2221 marking and identification materials

IPC-2221 conductive patterns and spacing

IPC-2221 annular ring and land design

IPC-2221 hole size and aspect ratio

IPC-2221 via protection and filling

IPC-2221 conductor routing and separation

IPC-2221 conductor width and thickness

IPC 2221 conductor current carrying capacity and fusing current

IPC 2221 conductor impedance control and matching

IPC 2221 conductor crosstalk and noise coupling

IPC 2221 conductor signal propagation delay and skew

IPC 2221 conductor signal integrity and quality factor

IPC 2221 power distribution network design and decoupling

IPC 2221 thermal vias and heat sinking

IPC 2221 component mounting and interconnection technology

IPC 2221 component orientation and placement density

IPC 2221 component clearance and keepout areas

IPC 2221 component attachment methods and criteria

IPC 2221 component lead forming and trimming

IPC 2221 component lead protrusion and coplanarity

IPC 2221 component lead stress relief and strain relief features

IPC 2221 component solder fillet geometry and wetting angle

Benefits and Applications of IPC 2221

IPC 2221 is a widely recognized and accepted standard for printed board design in the electronics industry. It provides a common language and framework for printed board designers, manufacturers, and users to communicate and collaborate effectively. It also helps to ensure the quality, reliability, performance, compatibility, safety, and cost-effectiveness of printed board products. IPC 2221 can be applied to any type of printed board design, from simple single-sided boards to complex multilayer boards, from rigid boards to flexible boards, from conventional boards to high-density boards, from analog boards to digital boards, from low-frequency boards to high-frequency boards, from low-power boards to high-power boards, from low-temperature boards to high-temperature boards, from low-voltage boards to high-voltage boards, from low-current boards to high-current boards, from low-speed boards to high-speed boards, and from low-noise boards to high-noise boards. IPC 2221 can also be used as a basis for developing more specific or customized standards for printed board design for different applications, such as aerospace, automotive, medical, military, industrial, consumer, and communication.

References

[1]: IPC 2221B Generic Standard on Printed Board Design. IPC. 2017.

[2]: IPC-2221 - [PDF Document]. Vdocuments. 2014.

[3]: IPC 2221A Generic Standard on Printed Board Design. IPC. 2003.

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