Structure and Content of IPC 2221
IPC 2221 is divided into eight sections, each covering a different aspect of printed board design. The sections are as follows:
Section 1: Scope. This section defines the scope and purpose of IPC 2221, as well as the terms and definitions used in the standard.
Section 2: Design Requirements. This section specifies the general requirements for printed board design, such as quality, reliability, performance, compatibility, safety, and documentation.
Section 3: Electrical Design Considerations. This section covers the electrical aspects of printed board design, such as signal integrity, power distribution, grounding, shielding, electromagnetic compatibility, and testing.
Section 4: Materials. This section covers the selection and properties of materials used in printed board design, such as dielectric base materials, conductive materials, electronic component materials, and soldering materials.
Section 5: Dimensional Requirements. This section covers the dimensional aspects of printed board design, such as size, shape, thickness, tolerance, warpage, and dimensional stability.
Section 6: Conductors. This section covers the design of conductors on printed boards, such as traces, pads, vias, lands, holes, and edge connectors.
Section 7: Holes and Interconnections. This section covers the design of holes and interconnections on printed boards, such as hole types, sizes, locations, plating, annular rings, clearance areas, and interlayer connections.
Section 8: Assembly Requirements. This section covers the assembly aspects of printed board design, such as component placement, orientation, mounting methods, soldering methods, cleaning methods, marking methods, and inspection methods.
Each section of IPC 2221 contains tables, figures, examples, notes, and references to provide further guidance and clarification on the topics covered. IPC 2221 also includes appendices that contain additional information on topics such as thermal management, high density interconnects, flexible circuits, rigid-flex circuits, embedded components, surface mount technology, ball grid arrays, chip scale packages, land grid arrays, flip chip technology, microvias, blind and buried vias, impedance control, differential signaling, crosstalk reduction, noise reduction, EMI reduction, ESD protection, creepage and clearance distances, voltage breakdown, arc tracking, flammability ratings, moisture sensitivity levels, thermal expansion coefficients, thermal conductivity values, dielectric constants values, loss tangent values, copper foil types and thicknesses, plating types and thicknesses, solder types and compositions, solder mask types and colors, legend types and colors, surface finishes types and characteristics, hole aspect ratios values, annular ring values, via resistance values, via inductance values,
via capacitance values,
component types sizes shapes terminations and orientations, component density values, component spacing values, component height values, component weight values, component thermal resistance values, component power dissipation values, component derating factors, component reliability factors, and component testing methods.
IPC-2221B Generic Standard on Printed Board Design
IPC-2221 Task Group (D-31b) of the Rigid Printed Board Committee (D-30) of IPC
IPC-2221 documentation hierarchy
IPC-2221 presentation and interpretation
IPC-2221 definition of terms and microvia
IPC-2221 design requirements for electrical characteristics
IPC-2221 design requirements for thermal management
IPC-2221 design requirements for testability
IPC-2221 design requirements for reliability
IPC-2221 design requirements for manufacturability
IPC-2221 design requirements for assembly
IPC-2221 materials selection for structural strength
IPC-2221 materials selection for electrical properties
IPC-2221 materials selection for environmental properties
IPC-2221 dimensional stability and warpage
IPC-2221 dielectric materials and laminates
IPC-2221 conductor materials and plating
IPC-2221 solder resist and coverlay materials
IPC-2221 marking and identification materials
IPC-2221 conductive patterns and spacing
IPC-2221 annular ring and land design
IPC-2221 hole size and aspect ratio
IPC-2221 via protection and filling
IPC-2221 conductor routing and separation
IPC-2221 conductor width and thickness
IPC 2221 conductor current carrying capacity and fusing current
IPC 2221 conductor impedance control and matching
IPC 2221 conductor crosstalk and noise coupling
IPC 2221 conductor signal propagation delay and skew
IPC 2221 conductor signal integrity and quality factor
IPC 2221 power distribution network design and decoupling
IPC 2221 thermal vias and heat sinking
IPC 2221 component mounting and interconnection technology
IPC 2221 component orientation and placement density
IPC 2221 component clearance and keepout areas
IPC 2221 component attachment methods and criteria
IPC 2221 component lead forming and trimming
IPC 2221 component lead protrusion and coplanarity
IPC 2221 component lead stress relief and strain relief features
IPC 2221 component solder fillet geometry and wetting angle
Benefits and Applications of IPC 2221
IPC 2221 is a widely recognized and accepted standard for printed board design in the electronics industry. It provides a common language and framework for printed board designers, manufacturers, and users to communicate and collaborate effectively. It also helps to ensure the quality, reliability, performance, compatibility, safety, and cost-effectiveness of printed board products. IPC 2221 can be applied to any type of printed board design, from simple single-sided boards to complex multilayer boards, from rigid boards to flexible boards, from conventional boards to high-density boards, from analog boards to digital boards, from low-frequency boards to high-frequency boards, from low-power boards to high-power boards, from low-temperature boards to high-temperature boards, from low-voltage boards to high-voltage boards, from low-current boards to high-current boards, from low-speed boards to high-speed boards, and from low-noise boards to high-noise boards. IPC 2221 can also be used as a basis for developing more specific or customized standards for printed board design for different applications, such as aerospace, automotive, medical, military, industrial, consumer, and communication.
References
[1]: IPC 2221B Generic Standard on Printed Board Design. IPC. 2017.
[2]: IPC-2221 - [PDF Document]. Vdocuments. 2014.
[3]: IPC 2221A Generic Standard on Printed Board Design. IPC. 2003.
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