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Track on Interoperability (INTOP)
Track on Interoperability (INTOP)
With the rapid development of new technologies (e.g., the Internet of Things (IoT), cloud & edge computing, big data, and artificial intelligence), software and hardware environments have become sophisticated increasingly. These environments require hyper-connectivity among different objects (e.g., SW/HW platforms, resources, network, service, and data), and, therefore, interoperability is considered as an indispensable element of the hyper-connectivity. For instance, most of the current IoT platforms (e.g., oneM2M, Iotivity, Watson IoT, and FIWARE) are developed with its own device identification (ID) system that each IoT platform has a different resource request format for using services or resources provided by the device. Therefore, the interworking between heterogeneous IoT platforms is challenging and deserves consideration. Many kinds of research have been studied on data- (e.g., semantic or syntactic interoperability) and network-related topics (e.g., functional interworking across multi-vendor and multi-carrier), whereas quite a few interoperability researches on the resource, platform, and security. This track aims to share research results, mainly focused on interoperability issues in diverse areas (i.e., data, network, middleware, resources, service, and security in emerging technologies).
Important Dates
Important Dates
Submission: Sep. 26, 2025 (EST)
Notification: Oct. 31, 2025
Camera Ready: Dec. 5, 2025
Conference: Mar. 23 - 27, 2026
Documents & Links
Documents & Links
Important Update
Important Update
Important update on ACMs new open access publishing model for 2026 ACM Conferences!
Starting January 1, 2026, ACM will fully transition to Open Access. All ACM publications, including those from ACM-sponsored conferences, will be 100% Open Access. Authors will have two primary options for publishing Open Access articles with ACM: the ACM Open institutional model or by paying Article Processing Charges (APCs). With over 1,800 institutions already part of ACM Open, the majority of ACM-sponsored conference papers will not require APCs from authors or conferences (currently, around 70-75%).
Authors from institutions not participating in ACM Open will need to pay an APC to publish their papers, unless they qualify for a financial or discretionary waiver. To find out whether an APC applies to your article, please consult the list of participating institutions in ACM Open and review the APC Waivers and Discounts Policy. Keep in mind that waivers are rare and are granted based on specific criteria set by ACM.
Understanding that this change could present financial challenges, ACM has approved a temporary subsidy for 2026 to ease the transition and allow more time for institutions to join ACM Open. The subsidy will offer:
$250 APC for ACM/SIG members
$350 for non-members
This represents a 65% discount, funded directly by ACM. Authors are encouraged to help advocate for their institutions to join ACM Open during this transition period. This temporary subsidized pricing will apply to all conferences scheduled for 2026.
SAC 2026
SAC 2026
For the past thirty-seven years, the ACM Symposium on Applied Computing (SAC) has been a primary gathering forum for applied computer scientists, computer engineers, software engineers, and application developers from around the world. ACM SAC is structured in multiple technical tracks. Each track is devoted to a specific research area, and is coordinated by one or more Track Chair(s). The complete list of the technical tracks selected for the current edition of SAC can be found on the SAC 2026 website.
SAC 2026 is sponsored by the ACM Special Interest Group on Applied Computing (SIGAPP), will be held in Thessaloniki, Greece.
News
News
The conference proceedings will be published in the ACM digital library. Furthermore, selected papers will be invited for submission to a special issue of the Interoperability in Data and Security, Discover Computing (SCIE, Springer Nature) and the Cybersecurity, Applied Sciences (SCIE, MDPI).
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