Mohammad Khairul Habib Pulok
Packaging R&D Engineer
Intel Corporation
Chandler, AZ, USA.
Email: mpulok (at) uno [dot] edu
Mohammad Khairul Habib Pulok
Packaging R&D Engineer
Intel Corporation
Chandler, AZ, USA.
Email: mpulok (at) uno [dot] edu
Hello there, welcome to my site!
I am working as a Packaging R&D Engineer at Intel Corporation.
My research interests include: (i) Vibration and Aerodynamics of Structures, (ii) Fluid-structure interaction, (iii) Dynamics, (iv) Solid Mechanics, (v) Helicopter Dynamics, (vi) Electroactive Membrane, (vi) Additive Manufacturing, & (vii) Hypersonic vehicle. I have worked in multiple areas of Mechanical Engineering with hands-on experience in vibration testing, digital image correlation, wind-tunnel, and material testing system. Please see my lists of publications for the details of my work.
I have completed my Ph.D. at the University of New Orleans (UNO), Louisiana, USA, under the supervision of Dr. Uttam Chakravarty. During my Ph.D. study, I was a member of the Aerodynamics and Vibrations Laboratory (Chakravarty Research Group) at the University of New Orleans.
Before starting my Ph.D., I have worked in Aeronautical College of Bangladesh, as a Lecturer at Mechanical Engineering Department, and BASIC Bank Limited as an Assistant Manager.
Please feel free to email me: mpulok (at) uno [dot] edu for any query or concern. Happy browsing!!