Welcome to my little corner on the web! Firstly, thank you for visiting.
I am a fifth year Ph.D. student at the Bradley Department of Electrical and Computer Engineering, Virginia Tech. I work at the Wireless Networking & Security (WiNSeR) Lab with Dr. Jung-Min (Jerry) Park in areas related to dynamic spectrum access.
Before joining Virginia Tech, I completed the Masters degree in Electrical Engineering from Indian Institute of Technology Bombay in 2015 and the Bachelors degree in Electronics and Telecom. Engineering from the University of Mumbai in 2012.
At IIT Bombay, I worked with Prof. Abhay Karandikar and Prof. Animesh Kumar on the technical feasibility of TV White Space operations in India. Our research team at Infonet Lab worked on the first TV White Space-based test-bed for rural broadband provisioning.
For questions or comments, feel free to contact me at gaurang [at] vt [dot] edu
[1/20] Our paper titled - "C2RC: Channel Congestion-based Re-transmission Control for 3GPP-based V2X Technologies" has been accepted for publication at IEEE WCNC 2020, Seoul, South Korea.
[10/19] Awarded the ECE Department's Prasad Fellowship for academic excellence for the academic year 2019-20.
[8/19] Our paper titled - "Impact of Wi-Fi Transmissions on C-V2X Performance" has been accepted for publication at IEEE DySPAN 2019, Newark, NJ, USA.
[5/19] Our paper - "IEEE 802.11bd & 5G NR V2X: Evolution of Radio Access Technologies for V2X Communications" has been accepted for publication in IEEE Access.
[5/19] I passed my Ph.D. prelim exam!
[3/19] The pre-print of our new submission titled "IEEE 802.11bd & 5G NR V2X: Evolution of Radio Access Technologies for V2X Communications" is now available on arXiv.
[2/19] I will be interning this summer at Qualcomm, San Diego, CA.
[2/19] Our paper titled "TCP BBR for Ultra-Low Latency Networking: Challenges, Analysis, and Solutions" has been accepted for publication at IFIP Networking 2019, Warsaw, Poland.
[1/19] Our paper titled "Uplink resource allocation in IEEE 802.11ax" has been accepted for publication at IEEE ICC 2019, Shanghai, China.