What is the Bga Ir 6000 Software 65?
The Bga Ir 6000 Software 65 is an infrared rework station software that uses infrared heating technology to melt and reflow solder joints on BGA chips. Unlike traditional hot air rework stations, the Bga Ir 6000 Software 65 does not blow hot air on the chip, which can cause damage or displacement of nearby components. Instead, it uses infrared rays to heat up the chip from below, creating a uniform and precise temperature distribution. The software allows you to control the temperature, time, and profile of the heating process, as well as monitor the real-time temperature curve on your computer screen. You can also save and load different profiles for different types of chips and boards.
How does the Bga Ir 6000 Software 65 work?
The Bga Ir 6000 Software 65 works in conjunction with the LY IR6000 infrared rework station, which consists of a main unit, a heating plate, a cooling fan, a temperature sensor, and a USB cable. To use the software, you need to install it on your computer and connect it to the rework station via the USB cable. You also need to place the board with the chip on the heating plate and attach the temperature sensor to the chip. Then, you can launch the software and set up the parameters for the heating process. You can choose from three modes: manual, semi-automatic, and automatic. In manual mode, you can adjust the temperature and time manually by clicking on the buttons or using the keyboard shortcuts. In semi-automatic mode, you can select a predefined profile from a list or create your own profile by setting up the temperature curve. In automatic mode, you can let the software detect the chip type and apply the optimal profile automatically. Once you start the heating process, you can watch the real-time temperature curve on your computer screen and stop it when you see that the solder joints have melted and reflowed. After that, you can use the cooling fan to cool down the board and remove it from the heating plate.
What are the advantages of using the Bga Ir 6000 Software 65?
There are many advantages of using the Bga Ir 6000 Software 65 for your BGA rework station. Some of them are:
It is easy to use and operate. You just need to install it on your computer and connect it to your rework station via a USB cable. The software has a user-friendly interface that allows you to control and monitor everything with a few clicks.
It is accurate and reliable. The software uses infrared heating technology that ensures a uniform and precise temperature distribution on the chip. The software also allows you to set up different profiles for different types of chips and boards, as well as save and load them for future use.
It is safe and efficient. The software does not blow hot air on the chip, which can cause damage or displacement of nearby components. The software also has a built-in protection system that prevents overheating, overvoltage, short circuit, etc.
It is compatible and versatile. The software works with any type of BGA chip and board, as well as other SMD components such as QFP, SOP, PLCC, etc. The software also supports multiple languages such as English, Chinese, Spanish, etc.
What are the disadvantages of using the Bga Ir 6000 Software 65?
There are also some disadvantages of using the Bga Ir 6000 Software 65 for your BGA rework station. Some of them are:
It is expensive and bulky. The software costs around $65, which is quite high compared to other rework station software. The software also requires a computer and a USB cable, which add to the cost and space.
It is not very flexible and customizable. The software has a limited number of profiles and parameters that you can adjust. The software also does not allow you to edit or modify the temperature curve, which can be useful for some advanced users.
It is not very fast and convenient. The software takes some time to load and run, especially if you have a slow computer or a poor USB connection. The software also requires you to place the board on the heating plate and attach the temperature sensor to the chip, which can be tedious and time-consuming.
Conclusion
The Bga Ir 6000 Software 65 is a powerful and reliable software for your BGA rework station. It uses infrared heating technology to melt and reflow solder joints on BGA chips, as well as control and monitor the heating process on your computer screen. The software has many advantages such as ease of use, accuracy, reliability, safety, efficiency, compatibility, and versatility. However, it also has some disadvantages such as high cost, bulkiness, lack of flexibility, customization, speed, and convenience. Therefore, you should weigh the pros and cons of using the Bga Ir 6000 Software 65 before buying it.
524038ac18