High Temperature Mechanical Testing Committee (HTMTC)
Chairman
Vice-Chairman
Dr Hellmuth Klingelhöffer
BAM Federal Institute for Materials Research and Testing
Department 5.0 – Materials Engineering
Unter den Eichen 87, 12205 Berlin, Germany
Phone: +49 30 8104 1501
Contact E-mails: Hellmuth.Klingelhoeffer@bam.de
Dr Peter Barnard
Consultant
Contact E-mail:
peter.barnard@mpiuk.com
Treasurer
Secretary
Dr Jonathan Jones
Swansea University, Institute of Structural Materials ISM, Bay Campus, Fabian Way
SA1 8EN Swansea, UK
Contact E-mails: jonathan.p.jones@swansea.ac.uk
Mr Malcolm Loveday
10 Abbey Gardens, Surrey,
KT16 8RQ Chertsey, UK
Contact E-mail: malcolmloveday46@gmail.com
Be always update about the TC11 initiatives! Join the TC11 Group: LINK
TC11 Scope
The High Temperature Mechanical Testing Committee (HTMTC) was established in 1982 following a conference held at NPL on 'Measurement of High Temperature Mechanical Properties of Materials'. The membership of the committee includes experts in the field of high temperature testing drawn from industry, research institutions and universities. The HTMTC operates as Technical Committee 11 (TC11) of the European Structural Integrity Society (ESIS).
The HTMTC aims to improve the techniques and procedures used for the high temperature testing of materials, and to disseminate this information to the materials community as a whole.
It achieves these aims by:
Providing a Forum for Discussion
Organizing Conferences and Laboratory Visits
Publishing Conference Proceedings and Codes of Practice
Initiating Research Activities
Membership of the HTMTC is open to all interested parties particularly engineers, scientists and technical personnel from industry, laboratories and research institutes who have an interest in high temperature mechanical testing. For further information on becoming a member, please contact the secretary of the committee.
Please see also www.htmtc.net
Next ESIS TC 11 (HTMTC) meeting
83th Meeting, 31st August 2022, Linköping, Sweden (hybrid)
Next Temperature Measurement Working Group Meeting of ESIS TC 11 (HTMTC)
no on site meeting is planned due to Corona virus restrictions
next virtual meeting will be announced on time
Next conference co-organised by ESIS TC11 (HTMTC)
6th International ECCC2023 Creep & Fracture Conference
22-25 May 2023, Edinburgh, Scotland (on site conference)
for more details please see also https://eccc2023.com