Zhengzheng Wu's site

Zhengzheng Wu, Ph.D.

Analog/mixed-signal IC Design Engineer

Qualcomm Technologies, Inc., CA, USA

Email: zhengzheng.wu at gmail.com

Linkedin: https://www.linkedin.com/in/zhengzheng-wu-6ab6b833/

Professional Interests:

Analog/Mixed-signal/RF integrated electronics; Micro-electro-mechanical systems (MEMS); Signal processing, control, and system architectures for smart micro-systems.

Areas of Expertise:

Integrated circuit design for high-volume commercial applications; Micromachined sensors and actuators; RF/microwave engineering; Micro-fabrication and microsystem integration technologies.

Education:

    • 2009-2014 Ph.D. in Electrical Engineering, University of Michigan, Ann Arbor, MI

Dissertation: Microelectromechanical Systems for Wireless Front-ends and Integrated Frequency References

    • 2006-2009 M.S. in Microelectronics and Solid-State Electronics, Graduate School of the Chinese Academy of Sciences, China

Thesis: Study on MEMS-based On-chip Integrated Radio Frequency Passive Devices

    • 2001-2005 B.S. in Microelectronics, Fudan University, Shanghai, China

Professional Experience:

  • 2014-present Senior/Staff Hardware Engineer, Qualcomm Technologies, CA
  • 2011 Summer Research Intern, Samsung Wireless Research Center, Richardson, TX
  • 2009-2014 Research Assistant, Department of EECS, University of Michigan, Ann Arbor, MI
  • 2006-2009 Research Assistant, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China

Publications:

Google Scholar: https://scholar.google.com/citations?user=zRxK7mIAAAAJ&hl=en

Journal Publications:

1. Z. Wu and M. Rais-Zadeh, "A temperature-stable piezoelectric MEMS oscillator using a CMOS PLL circuit for temperature sensing and oven controls," IEEE Journal of Microelectromechanical Systems, vol. 24, no. 6, pp. 1747-1758, June, 2015.

2. A. Peczalski, Z. Wu, R. Tabrizian, and M. Rais-Zadeh, "A temperature-stable piezoelectric MEMS oscillator using a CMOS PLL circuit for temperature sensing and oven controls," IEEE Journal of Microelectromechanical Systems, vol. 24, no. 6, pp. 1695-1702, June, 2015.

3. V. A. Thakar, Z. Wu, A. Peczalski, and M. Rais-Zadeh, "Piezoelectrically transduced temperature-compensated flexural-mode silicon resonators," IEEE Journal of Microelectromechanical Systems, vol. 22, no. 3, pp. 819–823, June, 2013.

4. Z. Wu, Y. Shim, and M. Rais-Zadeh , "Miniaturized UWB filters integrated with tunable notch filters using a silicon-based integrated passive device technology," IEEE Trans. on Microwave Theory and Techniques, vol. 60, no. 3, pp. 518–527, March, 2012.

5. Y. Shim, Z. Wu, and M. Rais-Zadeh, "A multi-metal surface micromachining process for tunable RF MEMS passives," IEEE Journal of Microelectromechanical Systems, vol. 21, no. 4, pp. 867–874, August, 2012.

6. Y. Shim, Z. Wu, and M. Rais-Zadeh, "A high-performance continuously tunable MEMS bandpass filter at 1 GHz," IEEE Transaction on Microwave Theory and Technique, vol. 60, no. 8, pp. 2439–2747, August, 2012.

7. Z. Wu, X. Li, “A micromachining technology for integrating low-loss GHz RF passives on non-high-resistivity low-cost silicon MCM substrate”, Microelectronic Engineering, vol. 87, No. 11, pp. 2247-2252, Nov. 2010.

8. Z. Wu, X. Wang, W.-Y. Yin, and X. Li, “Three-solenoid windings transformer baluns on CMOS-grade silicon substrate”, Microelectronic Engineering, vol. 87, No. 2, pp. 150-158, Feb. 2010.

9. Z. Wu and X. Li, “Post-CMOS compatible micromachining technique for on-chip passive RF filter circuits”, IEEE Transactions on Components and Packaging Technologies, vol. 32, No. 4, pp. 759-765, Dec. 2009.

10. Z. Wu and X. Li, “On-chip micromachined solenoid balun for RF-SOC applications”, Electronics Letters, vol. 45, No. 8, pp. 409–411, April. 2009.

11. C. Yang, F. Liu, X. Wang, J. Zhan, A. Wang, T. Ren, L. Liu, H. Long, Z. Wu, et al., “Investigation of on-chip soft-ferrite-integrated inductors for RF ICs—Part I: Design and simulation”, IEEE Transactions on Electron Devices, vol. 56, no. 12, pp. 3133-3140, Dec. 2009.

12. C. Yang, F. Liu, X. Wang, J. Zhan, A. Wang, T. Ren, L. Liu, H. Long, Z. Wu, et al., “Investigation of on-chip soft-ferrite-integrated inductors for RF ICs—Part II: Experiments”, IEEE Transactions on Electron Devices, vol. 56, no. 12, pp. 3141-3148, Dec. 2009.

13. L. Gu, Z. Wu, and X. Li, “A wide-range tunable on-chip radio-frequency LC-tank formed with a post-CMOS-compatible MEMS fabrication technique”, Microelectronics Journal, vol. 40, no. 1, pp. 131-136, Jan, 2009.

14. L. Gu, Z. Wu, X. Li, “Post-CMOS compatibly micromachined high-performance on-chip air-core solenoidal inductors”, Microwave and Optical Technology Letters, vol. 50, no. 9, pp. 2442-2446, Sep. 2008.

15. L. Gu, Z. Wu, X. Li, “Post-CMOS micromachined nickel tunable-capacitors with a large tuning-range under low actuating voltage”, Microwave and Optical Technology Letters, vol. 50, no. 9, pp. 2469-2472, Sep. 2008.

Conference Publications:

1. Z. Wu and M. Rais-Zadeh, "A temperature-stable MEMS oscillator on an ovenized micro-platform using a PLL-based heater control system," IEEE MEMS Conference (MEMS’15), pp. 793-796, Estoril, Portugal, January, 2015.

2. Z. Wu, A. Peczalski, and M. Rais-Zadeh, "Low-power ovenization of fused silica resonators for temperature-stable oscillators," IEEE International Frequency Control Symposium (IFCS’14), Taipei, Taiwan, pp. 1-4, May, 2014.

3. V. A. Thakar, C. Figueroa, Z. Wu, and M. Rais-Zadeh, "A temperature-stable clock using multiple temperature-compensated micro-resonators," IEEE International Frequency Control Symposium (IFCS’14), Taipei, Taiwan, pp. 1-4, May, 2014.

4. Z. Wu, A. Peczalski, and M. Rais-Zadeh, "Device-layer ovenization of fused silica micromechanical resonators for temperature-stable operation," Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head, SC, pp. 87-90, June, 2014.

5. V. A. Thakar, Z. Wu, C. Figueroa, and M. Rais-Zadeh, "A multi-resonator approach for eliminating the temperature dependence of silicon-based references," Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head, SC, pp. 415-418, June, 2014.

6. Z. Wu, A. Peczalski, V. A. Thakar, Z. Cao, Y. Yuan, G. He, R. L. Peterson, K. Najafi, and M. Rais-Zadeh, "Piezoelectrically transduced high-Q silica micro resonators," IEEE International Conference on Microelectromechanical Systems (MEMS’13), Taipei, Taiwan, pp. 122-125, January, 2013.

7. Z. Wu, A. Peczalski, V. Thakar, and M. Rais-Zadeh, "A low phase-noise Pierce oscillator using a piezoelectric-on-silica micromechanical resonator," 17th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers’13), Outstanding Paper Award (Poster), Barcelona, Spain, pp. 490-493, June, 2013.

8. M. Rais-Zadeh, V. A. Thakar, Z. Wu, and A. Peczalski, "(Invited) Temperature compensated silicon resonators for space applications," Proc. SPIE 8614, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII, San Francisco, CA, February, 2013.

9. Y. Shim, Z. Wu, and M. Rais-Zadeh, "MEMS tunable bandstop and bandpass filters," USNC-URSI National Radio Science Meeting, Boulder, CO, Jan, 2013.

10. Y. Shim, J. Ruan, Z. Wu, and M. Rais-Zadeh, "An integrated RF MEMS tunable filter," IEEE International Conference on Microelectromechanical Systems (MEMS’12), Paris, France, pp. 15-18, January-February, 2012.

11. V. Thakar, Z. Wu, and M. Rais-Zadeh, "A high ON/OFF ratio MEMS capacitive switch with applications in solar energy harvesting," Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head, SC, pp. 385-388, June, 2012.

12. Z. Wu, Y. Shim, and M. Rais-Zadeh, "Switchable wide tuning range bandstop filters for frequency-agile radios," IEEE International Electron Device Meeting (IEDM’11), pp. 20.5.1-20.5.4, Washington, DC, December, 2011.

13. Z. Wu, Y. Shim, and M. Rais-Zadeh, "Miniaturized UWB bandpass filters integrated with notch filters using a silicon-based integrated passive device technology," IEEE International Microwave Symposium (IMS’11), Best Paper Award (Finalist), pp. 1-4, Baltimore, MD, June, 2011.

14. Y. Shim, Z. Wu, and M. Rais-Zadeh, "A high-performance temperature-stable continuously tuned MEMS capacitor," IEEE International Conference on Microelectromechanical Systems (MEMS’11), pp. 752-755, Cancun, Mexico, January, 2011.

15. C. Yang, T. Ren, L Liu, J. Zhan, X. Wang, A. Wang, Z. Wu, and X. Li, “On-chip soft-ferrite-integrated inductors for RF IC”, Solid-State Sensors, Actuators and Microsystems Conference, Denver, CO, pp. 785-788, June 2009.

16. X. Li, L. Gu, Z. Wu, “(Invited) High-performance RF passives using post-CMOS MEMS techniques for RF SoC”, IEEE Radio Frequency Integrated Circuits Symposium (RFIC’08), pp. 163-166, 2008.

17. C. Yang, T. Ren, L. Liu, Y. Yuan, Z. Wu, L. Gu, X. Li, A. Wang, and X. Wang, “Ferrite-integrated on-chip RF solenoid inductor”, 2008 IEEE Sensors, pp. 1040-1043, Oct. 2009.

18. L. Gu, Z. Wu, F. Wang, R. Cheng, K. Jiang, and X. Li, “(Invited) UV-LIGA metal MEMS: A promising tool to serve IC industry”, 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT 2008), Beijing, China, pp. 2357-2360, Oct. 2008.

Granted & Pending Patents

  • Z. Wu, C. Song, "Adaptive gate-biased field effect transistor for low-dropout regulator", 2018, US Application 16/170,700.
  • Z. Wu, D. Huang, J. Hinrichs, M. Pedrali-Noy, "Clock screening with programmable counter-based clock interface and time-to-digital converter with high resolution and wide range operation", 2018, US Application 15/904,124.
  • C. Song, Z. Wu, H. Cheng, Y. Lu, "Variation tracking and compensating for small capacitor", 2019, US Patent 10,312,891.
  • M. Rais-Zadeh, Z. Wu, V.A. Thakar, A. Peczalski, "Method of manufacturing a temperature-compensated micromechanical resonator", 2017, US Patent 9,742,373.

Awards & Honors:

  • Outstanding Paper Award, International Conference on Solid-State Sensors, Actuators and Microsystems, 2013 (TRANSDUCERS’13)
  • Best Student Paper Award (Finalist), IEEE International Microwave Symposium, 2011 (IMS’11)
  • Rackham International Student Fellowship, University of Michigan (2011)

Affiliations & Services:

  • Member of Institute of Electrical and Electronics Engineers (IEEE)
  • Reviewer for IEEE Transactions on Circuits and Systems (T-CAS)
  • Reviewer for IEEE Transactions on Very Large Scale Integration (T-VLSI)
  • Reviewer for IEEE/ASME Journal of Microelectromechanical Systems (J-MEMS)
  • Reviewer for IEEE Transactions on Microwave Theory and Techniques (T-MTT)
  • Reviewer for IEEE Transactions on Electron Devices (T-ED)
  • Reviewer for MDPI Sensors Journal