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8. Tri-phase

(1) nc tri-phase Co-Cu-Ag

Significant enhancement in the thermal stability of nanocrystalline metals via immiscible tri-phases

Y. Chen, Y. Liu, F. Khatkhatay, C.Sun,H. Wang,X. Zhang,  Scripta Material 67,(2012),177–180

  • Introducing Co–Cu–Ag tri-phase immiscible nanocomposites (TPIN) with abundant of triple junctions.
  • The thermal stability of TPIN is superior compared to CuAg and monolithic Cu. The grain size is only 115 nm after annealing (973k/1h), compared to 700 nm for CuAg binary alloys.