January 2022


SUNGWON  CHUNG
Neuralink Corporation


BIOGRAPHY


SungWon Chung is the Head of Brain Interfaces System-on-Chip at Neuralink Corporation where he is leading a chip design team to develop a high-bandwidth wireless brain computer interface. He received the Ph.D. degree in Electrical Engineering and Computer Science (EECS) from the Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts, USA, in 2014, the M.S. degree in EECS from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 2005, and the B.S. degree in Electronics Engineering with double major in Computer Engineering and minor in Mechanical Engineering from Pusan National University, Busan, Korea, in 2002.


His interests are in the broad range of integrated circuits and innovative system architectures for nanodevices exploiting diverse wave-matter interactions. His research contributions include the demonstration of the first scalable nanophotonic phased array using thermo-optic modulation in silicon-on-insulator CMOS with 1024 elements [2017 IEEE International Solid-State Circuits Conference (ISSCC), 2018 IEEE Journal of Solid-State Circuits], the first multi-gigabit mobile quantum communication receiver architecture [2017 IEEE Photonics Conference (IPC)], the first demonstration of ultrahigh-precision radio wave sampling circuits implemented with gallium-nitride high-electron mobility transistors [2016 IEEE Electron Device Letters (EDL)], a digital-intensive concurrent non-contiguous multiband wireless transmitter with the highest aggregate bandwidth [2015 IEEE Transactions on Microwave Theory and Techniques (TMTT)], the highest efficiency bulk-silicon microwave power amplifier architecture at the time of introduction [ 2012 IEEE Journal of Solid-State Circuits (JSSC)], low-power dynamic nonlinearity linearization using novel adaptive digital predistortion techniques [2009 IEEE Transactions on Circuits and Systems II (TCAS-II), 2008 IEEE Transactions on Microwave Theory and Techniques (TMTT)], and a machine learning co-processor architecture with analog cache memory for the low-overhead integration of instruction-level processing in-memory accelerator [2019 IEEE Journal of Emerging and Selected Topics in Circuits and Systems]. Prior to his appointment at Neuralink since 2019, he had held R&D positions for nine years in Mitsubishi Electric as Consultant, KITEL Company as Member of Technical Staff, University of Southern California as Research Associate and Visiting Scholar, MIT Microsystems Technology Laboratories as Postdoctoral Associate, and Intersil Corporation (acquired by Renesas Electronics) as Mixed-Signal Design Engineering Intern, while collaborating with Toyota, Bell Labs, Tower Semiconductor (acquired by Intel), and Samsung.


Dr. Chung serves on the Digital Signal Processing Technical Committee (MTT-9/DSPX) for IEEE Microwave Theory and Techniques Society (MTT-S) where he is co-organizing workshops for IEEE International Microwave Symposium (IMS) and IEEE Radio & Wireless Week (RWW).  He also serves on the Technical Program Committee of IEEE Custom Integrated Circuits Conference (CICC) and IEEE Radio Frequency Integrated Circuits Symposium (RFIC). He received IEEE Computer Society Lance Stafford Larson Outstanding Paper Award, USENIX Student Research Grant for a UNIX filesystem development, IEEE Radio & Wireless Week Best Paper Award, Samsung Electronics Thesis Award, and was nominated for IEEE International Microwave Symposium (IMS) Best Paper Award. He was a Viterbi Postdoctoral Fellow and a Presidential Scholar, and is a recipient of 2014 Outstanding Student Designer Award for excellence in integrated circuits design from Analog Devices. His research work on an energy-efficient microwave transmitter was commercialized by Eta Devices (acquired by Nokia Corporation) and recognized with 2015 Technology Pioneers Award by World Economic Forum (WEF) in Geneva, Switzerland. Dr. Chung and his two colleagues were awarded Bell Labs Prize for their work on large-scale nanophotonic phased arrays, which was live demonstrated in 2017 IEEE International Solid-State Circuits Conference (ISSCC) for 3D imaging, sensing, and wireless communication.  He has served on more than 200 review cases as a Reviewer of IEEE and OSA journals including IEEE Journal of Solid-State Circuits, IEEE Transactions on Microwave Theory and Techniques, IEEE Microwave and Wireless Component Letters, IEEE Transactions on Circuits and Systems I: Regular Papers, IEEE Transactions on Signal Processing, IEEE Transactions on Sustainable Computing, IEEE Journal of Selected Topics in Quantum Electronics, IEEE/OSA Journal of Lightwave Technology, Optics Letters, Optical Materials Express, Optics Express, and Optica.  Dr. Chung served as a Guest Editor of 2019 IEEE Microwave Magazine Focused Issue on digital predistortion and postcorrection, and is currently an Editorial Review Board Member of IEEE Solid-State Circuits Letters and an Associate Editor of IEEE Transactions on Circuits and Systems I - Regular Papers.  He is a Member of OSA and a Senior Member of IEEE.



CONTACT


sungwon_at_IEEE_dot_org


SELECTED CONFERENCE WORKSHOP & SPECIAL SESSION (participation as a (co)-organizer/host)

SELECTED CONFERENCE WORKSHOP & SPECIAL SESSION (participation as an invited speaker)


SELECTED PUBLICATIONS IN PEER-REVIEWED JOURNALS


SELECTED PUBLICATIONS IN PEER-REVIEWED CONFERENCE PROCEEDINGS


MANUSCRIPTS IN PREPARATION


SELECTED PATENT PUBLICATIONS