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Wire Bonder

Location : DGIST E2, 521 

Specifications :
  • HB05 Wedge & Ball Bonder
  1. Gold-, Aluminium-, Silver- & Copper Wire
    • Wire sizes 17um to 75um, Ribbon max. 20x250um
  2. Wedge-, Ball-, Bump- & Ribbon Bonding
    • Easy switching between bond modes
  3. Compact Design & Intuitive control
    • The practical design makes the bonder very easy to use
  4. 4'' TFT Display & Multi Button
    • Fast and easy adjustment of all bond parameters
  5. Storage for 20 Parameter Sets
    • Easy setting recall for working on different applications
  6. Deep & Wide Bond Access
    • Ample work space due to special bond bead design
  7. Electronic Wire Clamp - Up & Down Movement
    • Precise tail length control
  8. Designed for Extension Kits
    • Pick & Place, Pull Tester, Video Targeting, Copper Ball Bonding
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